SBAS876C August   2018  – June 2019 ADS9224R , ADS9234R

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Typical Application Diagram
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics: ADS92x4R
    6. 6.6  Electrical Characteristics: ADS9224R
    7. 6.7  Electrical Characteristics: ADS9234R
    8. 6.8  Timing Requirements
    9. 6.9  Switching Characteristics
    10. 6.10 Typical Characteristics: ADS9224R
    11. 6.11 Typical Characteristics: ADS9234R
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Converter Modules
        1. 7.3.1.1 Analog Input With Sample-and-Hold
        2. 7.3.1.2 ADC Transfer Function
      2. 7.3.2 Internal Reference Voltage
      3. 7.3.3 Reference Buffers
      4. 7.3.4 REFby2 Buffer
      5. 7.3.5 Data Averaging
        1. 7.3.5.1 Averaging of Two Samples
        2. 7.3.5.2 Averaging of Four Samples
    4. 7.4 Device Functional Modes
      1. 7.4.1 ACQ State
      2. 7.4.2 CNV State
      3. 7.4.3 Reset or Power-Down
        1. 7.4.3.1 Reset
        2. 7.4.3.2 Power-Down
      4. 7.4.4 Conversion Control and Data Transfer Frame
        1. 7.4.4.1 Conversion Control and Data Transfer Frame With Zero Cycle Latency (Zone 1 Transfer)
        2. 7.4.4.2 Conversion Control and Data Transfer Frame With Wide Read Cycle (Zone 2 Transfer)
    5. 7.5 READY/STROBE Output
      1. 7.5.1 READY Output
      2. 7.5.2 STROBE Output
    6. 7.6 Programming
      1. 7.6.1 Output Data Word
      2. 7.6.2 Data Transfer Protocols
        1. 7.6.2.1 Protocols for Reading From the Device
          1. 7.6.2.1.1 Legacy, SPI-Compatible Protocols (SPI-xy-S-SDR)
          2. 7.6.2.1.2 SPI-Compatible Protocols With Bus Width Options and Single Data Rate (SPI-xy-D-SDR and SPI-xy-Q-SDR)
          3. 7.6.2.1.3 SPI-Compatible Protocols With Bus Width Options and Double Data Rate (SPI-x1-S-DDR, SPI-x1-D-DDR, SPI-x1-Q-DDR)
          4. 7.6.2.1.4 Clock Re-Timer (CRT) Protocols (CRT-S-SDR, CRT-D-SDR, CRT-Q-SDR, CRT-S-DDR, CRT-D-DDR, CRT-Q-DDR)
          5. 7.6.2.1.5 Parallel Byte Protocols (PB-xy-AB-SDR, PB-xy-AA-SDR)
        2. 7.6.2.2 Device Setup
          1. 7.6.2.2.1 Single Device: All Enhanced-SPI Options
          2. 7.6.2.2.2 Single Device: Minimum Pins for a Standard SPI Interface
        3. 7.6.2.3 Protocols for Configuring the Device
      3. 7.6.3 Reading and Writing Registers
    7. 7.7 Register Maps
      1. 7.7.1 ADS92x4R Registers
        1. 7.7.1.1 DEVICE_STATUS Register (Offset = 0h) [reset = 0h]
          1. Table 12. DEVICE_STATUS Register Field Descriptions
        2. 7.7.1.2 POWER_DOWN_CFG Register (Offset = 1h) [reset = 0h]
          1. Table 13. POWER_DOWN_CFG Register Field Descriptions
        3. 7.7.1.3 PROTOCOL_CFG Register (Offset = 2h) [reset = 0h]
          1. Table 14. PROTOCOL_CFG Register Field Descriptions
        4. 7.7.1.4 BUS_WIDTH Register (Offset = 3h) [reset = 0h]
          1. Table 15. BUS_WIDTH Register Field Descriptions
        5. 7.7.1.5 CRT_CFG Register (Offset = 4h) [reset = 0h]
          1. Table 16. CRT_CFG Register Field Descriptions
        6. 7.7.1.6 OUTPUT_DATA_WORD_CFG Register (Offset = 5h) [reset = 0h]
          1. Table 17. OUTPUT_DATA_WORD_CFG Register Field Descriptions
        7. 7.7.1.7 DATA_AVG_CFG Register (Offset = 6h) [reset = 0h]
          1. Table 18. DATA_AVG_CFG Register Field Descriptions
        8. 7.7.1.8 REFBY2_OFFSET Register (Offset = 7h) [reset = 0h]
          1. Table 19. REFBY2_OFFSET Register Field Descriptions
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 ADC Input Driver
        1. 8.1.1.1 Charge-Kickback Filter
      2. 8.1.2 Input Amplifier Selection
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Signal Path
      2. 10.1.2 Grounding and PCB Stack-Up
      3. 10.1.3 Decoupling of Power Supplies
      4. 10.1.4 Reference Decoupling
      5. 10.1.5 Differential Input Decoupling
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
    2. 11.2 Related Documentation
    3. 11.3 Related Links
    4. 11.4 Receiving Notification of Documentation Updates
    5. 11.5 Community Resources
    6. 11.6 Trademarks
    7. 11.7 Electrostatic Discharge Caution
    8. 11.8 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.8 Timing Requirements

at AVDD = 4.5 V to 5.5V, DVDD = 2.35 V to 5.5 V, VCM = VREFP_x/2, Internal reference and maximum throughput (unless otherwise noted); minimum and maximum values at TA = -40℃ to +125℃; typical values at TA = 25℃, AVDD = 5V, DVDD = 3.3 V
MIN NOM MAX UNIT
CONVERSION CONTROL AND DATA TRANSFER (See Figure 1  and  Figure 2)
tD_CONVST_CS Delay time: CONVST high to CS Falling for zero cycle latency (zone 1 transfer) tDRDY(2) ns
tCYCLE Time between two adjacent CONVST rising edges for zero cycle latency (zone 1 transfer) tDRDY+tREAD(3) ns
Time between two adjacent CONVST rising edges for zone 2 transfer, ADS9224R 333 ns
Time between two adjacent CONVST rising edges for zone 2 transfer, ADS9234R 285
fSAMPLE Sampling rate, ADS9224R 3 MSPS
Sampling rate, ADS9234R 3.5
tACQ Acquisition time 140 ns
tD_CONVST_CS Delay time: CONVST high to CS falling for zone 2 transfer 15 180 ns
tWL_CONVST Pulse duration : CONVST low 15 ns
tWH_CONVST Pulse duration : CONVST high 15 ns
SPI-COMPATIBLE AND PARALLEL BYTE PROTOCOL (See Figure 3)
tCLK Serial clock time period 1/ fCLK
tPH_CLK SCLK high time 0.45 × tCLK 0.55 × tCLK ns
tPL_CLK SCLK low time 0.45 × tCLK 0.55 × tCLK ns
tSU_CSCK Setup time: CS faling to first SCLK capture edge 12 ns
tSU_CKDI Setup Time: SDI data valid to SCLK capture edge 2.5 ns
tHT_CKDI Hold Time: SCLK capture edge to previous data valid on SDI 1.5 ns
tHT_CKCS Delay Time: last SCLK capture edge to CS rising 14 ns
fCLK Serial clock frequency for SPI protocols with single data rate 60 MHz
Serial clock frequency for SPI protocols with double data rate 22 MHz
Serial clock frequency for parallel byte protocol 45 MHz
CLOCK RE-TIMER PROTOCOL WITH STROBE = SCLK (EXTERNAL CLOCK)(1)(See Figure 4)
fCLK Serial clock frequency with single data rate 60 MHz
Serial clock frequency with double data rate 22 MHz
ASYNCHRONOUS RESET AND POWER-DOWN TIMING (See Figure 6)
tWL-RST Pulse duration (low) for reset 50 500 ns
tWL-PD-min Minimum pulse duration (low) for power-down 1000 ns
(1) Other parameters are the same as the SPI-compatible and Parallel Byte Protocols.
(2) See Switching Characteristics