SBOS531E August   2010  – June 2019 AFE031

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
    1.     Device Images
  4. Revision History
  5. Description, continued
  6. Device Comparison Table
  7. Pin Configuration and Functions
    1.     Pin Functions
  8. Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Thermal Information
    4. 8.4  Electrical Characteristics: Transmitter (Tx)
    5. 8.5  Electrical Characteristics: Power Amplifier (PA)
    6. 8.6  Electrical Characteristics: Receiver (Rx)
    7. 8.7  Electrical Characteristics: Digital
    8. 8.8  Electrical Characteristics: Two-Wire Interface
    9. 8.9  Electrical Characteristics: Internal Bias Generator
    10. 8.10 Electrical Characteristics: Power Supply
    11. 8.11 Timing Requirements
    12. 8.12 Timing Diagrams
    13. 8.13 Typical Characteristics
  9. Detailed Description
    1. 9.1 Functional Block Diagram
    2. 9.2 Feature Description
      1. 9.2.1 PA Block
      2. 9.2.2 Tx Block
      3. 9.2.3 Rx Block
      4. 9.2.4 DAC Block
      5. 9.2.5 REF1 and REF2 Blocks
      6. 9.2.6 Zero Crossing Detector Block
      7. 9.2.7 ETx and ERx Blocks
    3. 9.3 Power Supplies
    4. 9.4 Pin Descriptions
      1. 9.4.1 Current Overload
      2. 9.4.2 Thermal Overload
    5. 9.5 Calibration Modes
      1. 9.5.1 Tx Calibration Mode
      2. 9.5.2 Rx Calibration Mode
    6. 9.6 Serial Interface
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Detailed Design Procedure
        1. 10.2.1.1 Line-Coupling Circuit
        2. 10.2.1.2 Circuit Protection
        3. 10.2.1.3 Thermal Considerations
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
      2. 11.1.2 Development Support
        1. 11.1.2.1 Powerline Communications Developer’s Kit
        2. 11.1.2.2 TINA-TI™ (Free Software Download)
        3. 11.1.2.3 TI Precision Designs
        4. 11.1.2.4 WEBENCH Filter Designer
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Electrical Characteristics: Power Amplifier (PA)

At TJ = 25°C, PA_VS = 16 V, VAVDD = VDVDD = 3.3 V, and 10 kΩ connected to PA_ISET (pin 46), unless otherwise noted.
PARAMETER CONDITIONS MIN TYP MAX UNIT
Input
Input voltage range GND – 0.1 PA_VS + 0.1 V
RI Input resistance 20
Frequency Response
BW Bandwidth ILOAD = 0 670 kHz
SR Slew rate 10-V step 19 V/μs
Full-power bandwidth VOUT = 10 VPP 300 kHz
AC PSRR f = 50 kHz 14 dB
Output
VO Voltage output swing from PA_VS IO = 300 mA, sourcing 0.3 1 V
IO = 1.5 A, sourcing 1.7 2 V
VO Voltage output swing from PA_Gnd IO = 300 mA, sinking 0.3 1 V
IO = 1.5 A, sinking 1.3 2 V
IO Maximum continuous current, dc 7.5 kΩ connected to PA_ISET 1.5 A
Maximum peak current, ac TJ = –40°C to +125°C, f = 50 kHz 1.7 A
RO Output resistance IO = 1.5 A 0.1 Ω
PA disabled Output impedance, f = 100 kHz, REF1 enabled 145 ll 120 kΩ ll pF
Output current limit range ±0.4 to ±1.5 A
Current limit equation ILIM = 20 kΩ • [1.2 V/(RSET + 5 kΩ)] A
Solved for RSET (Current Limit) RSET = [(20 kΩ • 1.2 V/ILIM) – 5 kΩ] Ω
Gain RLOAD = 1 kΩ
G Nominal gain 6.5 V/V
Gain error –1% 0.1% 1%
Gain error drift TJ = –40°C to +125°C ±1 ppm/°C
TSENSE Diode
η Diode ideality factor 1.033
Thermal Shutdown
Junction temperature at shutdown 160 °C
Hysteresis 15 °C
Return to normal operation 145 °C