SBASA60 December   2020 AFE10004

PRODUCTION DATA  

  1. 1Features
  2. 2Applications
  3. 3Description
  4. 4Device and Documentation Support
    1. 4.1 Documentation Support
      1. 4.1.1 Related Documentation
    2. 4.2 Receiving Notification of Documentation Updates
    3. 4.3 Support Resources
    4. 4.4 Trademarks
    5. 4.5 Electrostatic Discharge Caution
    6. 4.6 Glossary
  5. 5Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RGE|24
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • Local and remote diode temperature sensor
    • ±2.5°C accuracy, maximum
    • 0.0625°C resolution
  • Internal EEPROM for autonomous operation
    • Four independent transfer functions storage
    • Device configuration storage
    • Open space for user storage
  • Four analog outputs
    • Four monotonic DACs: 1.22-mV resolution
    • Automatically configured output ranges:
      • Positive output voltage: 5.5 V, maximum
      • Negative output voltage: –10 V, minimum
    • High current drive capability:
      • Source up to 100 mA
      • Sink up to 20 mA
    • High capacitive load tolerant: up to 15 µF
  • Gate bias on and off control switches
    • Two programmable off voltages
      • Two auxiliary DACs: 1.22-mV resolution
    • Fast switching time: 50 ns, typical
    • Low resistance: 3 Ω, maximum
  • Built-in sequencing control
  • Internal 2.5-V reference
  • SPI and I2C interfaces: 1.7-V to 3.6-V operation
    • SPI: 4-wire Interface
    • I2C: Eight selectable slave addresses
  • Specified temperature range: –40°C to +125°C
  • Operating temperature range –40°C to +150°C