SBAS667F April   2016  – April 2020 AMC1301


  1. Features
  2. Applications
  3. Description
    1.     Device Images
      1.      Simplified Schematic
  4. Revision History
  5. Device Comparison Table
  6. Pin Configuration and Functions
    1.     Pin Functions
  7. Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Power Ratings
    6. 7.6  Insulation Specifications
    7. 7.7  Safety-Related Certifications
    8. 7.8  Safety Limiting Values
    9. 7.9  Electrical Characteristics
    10. 7.10 Insulation Characteristics Curves
    11. 7.11 Typical Characteristics
  8. Parameter Measurement Information
    1. 8.1 Timing Diagrams
  9. Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Analog Input
      2. 9.3.2 Fail-Safe Output
    4. 9.4 Device Functional Modes
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Applications
      1. 10.2.1 Frequency Inverter Application
        1. Design Requirements
        2. Detailed Design Procedure
        3. Application Curves
      2. 10.2.2 Isolated Voltage Sensing
        1. Design Requirements
        2. Detailed Design Procedure
        3. Application Curve
    3. 10.3 What To Do and What Not TO Do
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Device Support
      1. 13.1.1 Device Nomenclature
    2. 13.2 Documentation Support
      1. 13.2.1 Related Documentation
    3. 13.3 Receiving Notification of Documentation Updates
    4. 13.4 Community Resources
    5. 13.5 Trademarks
    6. 13.6 Electrostatic Discharge Caution
    7. 13.7 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Detailed Design Procedure

The high-side power supply (VDD1) for the AMC1301 is derived from the power supply of the upper gate driver. Further details are provided in the Power Supply Recommendations section.

The floating ground reference (GND1) is derived from one of the ends of the shunt resistor that is connected to the negative input of the AMC1301 (VINN). If a four-pin shunt is used, the inputs of the AMC1301 are connected to the inner leads and GND1 is connected to one of the outer shunt leads.

Use Ohm's Law to calculate the voltage drop across the shunt resistor (VSHUNT) for the desired measured current: VSHUNT = I × RSHUNT.

Consider the following two restrictions to choose the proper value of the shunt resistor RSHUNT:

  • The voltage drop caused by the nominal current range must not exceed the recommended differential input voltage range: VSHUNT ≤ ± 250 mV
  • The voltage drop caused by the maximum allowed overcurrent must not exceed the input voltage that causes a clipping output: VSHUNT ≤ VClipping

For best performance, use an RC filter (components R2, R3, and C3 in Figure 49) to minimize the noise of the differential output signal. Tailor the bandwidth of this RC filter to the bandwidth requirement of the system. TI recommends an NP0-type capacitor to be used for C3.

For more information on the general procedure to design the filtering and driving stages of SAR ADCs, consult the TI Precision Designs 18-Bit, 1MSPS Data Acquisition Block (DAQ) Optimized for Lowest Distortion and Noise and 18-Bit Data Acquisition Block (DAQ) Optimized for Lowest Power, available for download at