SBAS667F April   2016  – April 2020 AMC1301

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
    1.     Device Images
      1.      Simplified Schematic
  4. Revision History
  5. Device Comparison Table
  6. Pin Configuration and Functions
    1.     Pin Functions
  7. Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Power Ratings
    6. 7.6  Insulation Specifications
    7. 7.7  Safety-Related Certifications
    8. 7.8  Safety Limiting Values
    9. 7.9  Electrical Characteristics
    10. 7.10 Insulation Characteristics Curves
    11. 7.11 Typical Characteristics
  8. Parameter Measurement Information
    1. 8.1 Timing Diagrams
  9. Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Analog Input
      2. 9.3.2 Fail-Safe Output
    4. 9.4 Device Functional Modes
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Applications
      1. 10.2.1 Frequency Inverter Application
        1. 10.2.1.1 Design Requirements
        2. 10.2.1.2 Detailed Design Procedure
        3. 10.2.1.3 Application Curves
      2. 10.2.2 Isolated Voltage Sensing
        1. 10.2.2.1 Design Requirements
        2. 10.2.2.2 Detailed Design Procedure
        3. 10.2.2.3 Application Curve
    3. 10.3 What To Do and What Not TO Do
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Device Support
      1. 13.1.1 Device Nomenclature
    2. 13.2 Documentation Support
      1. 13.2.1 Related Documentation
    3. 13.3 Receiving Notification of Documentation Updates
    4. 13.4 Community Resources
    5. 13.5 Trademarks
    6. 13.6 Electrostatic Discharge Caution
    7. 13.7 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Power Supply Recommendations

In a typical frequency inverter application, the high-side power supply (VDD1) for the device is derived from the floating power supply of the upper gate driver. For lowest cost, a Zener diode may be used to limit the voltage to 5 V (or 3.3 V, depending on the design) ± 10%. Alternatively a low-cost, low-dropout (LDO) regulator (for example, the LM317-N) may be used to minimize noise on the power supply. TI recommends a low-ESR decoupling capacitor of 0.1 µF to filter this power-supply path. Place this capacitor (C2 in Figure 54) as close as possible to the VDD1 pin of the AMC1301 for best performance. If better filtering is required, an additional 10-µF capacitor may be used. The floating ground reference (GND1) is derived from the end of the shunt resistor, which is connected to the negative input (VINN) of the device. If a four-pin shunt is used, the device inputs are connected to the inner leads, and GND1 is connected to one of the outer leads of the shunt.

To decouple the digital power supply on the controller side, use a 0.1-µF capacitor placed as close to the VDD2 pin of the AMC1301 as possible, followed by an additional capacitor from 1 µF to 10 µF.

AMC1301 ai_pwr_bas667.gifFigure 54. Zener-Diode-Based, High-Side Power Supply