SBAS771C June   2017  – February 2020 AMC1303E0510 , AMC1303E0520 , AMC1303E2510 , AMC1303E2520 , AMC1303M0510 , AMC1303M0520 , AMC1303M2510 , AMC1303M2520

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
    1.     Device Images
      1.      Simplified Schematic
  4. Revision History
  5. Device Comparison Table
  6. Pin Configuration and Functions
    1.     Pin Functions
  7. Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Power Ratings
    6. 7.6  Insulation Specifications
    7. 7.7  Safety-Related Certifications
    8. 7.8  Safety Limiting Values
    9. 7.9  Electrical Characteristics: AMC1303x05x
    10. 7.10 Electrical Characteristics: AMC1303x25x
    11. 7.11 Switching Characteristics
    12. 7.12 Insulation Characteristics Curves
    13. 7.13 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Analog Input
      2. 8.3.2 Modulator
      3. 8.3.3 Isolation Channel Signal Transmission
      4. 8.3.4 Digital Output
      5. 8.3.5 Manchester Coding Feature
    4. 8.4 Device Functional Modes
      1. 8.4.1 Fail-Safe Output
      2. 8.4.2 Output Behavior in Case of a Full-Scale Input
  9. Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Digital Filter Usage
    2. 9.2 Typical Applications
      1. 9.2.1 Frequency Inverter Application
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Isolated Voltage Sensing
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
        3. 9.2.2.3 Application Curve
      3. 9.2.3 What To Do and What Not To Do
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Device Nomenclature
        1. 12.1.1.1 Isolation Glossary
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Related Links
    4. 12.4 Receiving Notification of Documentation Updates
    5. 12.5 Community Resources
    6. 12.6 Trademarks
    7. 12.7 Electrostatic Discharge Caution
    8. 12.8 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Power Supply Recommendations

In a typical frequency-inverter application, the high-side power supply (AVDD) for the device is directly derived from the floating power supply of the upper gate driver. For lowest system-level cost, a Zener diode can be used to limit the voltage to 5 V or 3.3 V (±10%). Alternatively a low-cost low-drop regulator (LDO), for example the LM317-N, can be used to adjust the supply voltage level and minimize noise on the power supply node. A low-ESR decoupling capacitor of 0.1 µF is recommended for filtering this power-supply path. Place this capacitor (C2 in Figure 57) as close as possible to the AVDD pin of the AMC1303 for best performance. Further, an additional capacitor with a value in the range of 2.2 µF to 10 µF is recommended.

The floating ground reference (AGND) is derived from the end of the shunt resistor, which is connected to the negative input (AINN) of the device. If a four-pin shunt is used, the device inputs are connected to the inner leads and AGND is connected to one of the outer leads of the shunt.

For decoupling of the digital power supply on the controller side, TI recommends using a 0.1-µF capacitor assembled as close to the DVDD pin of the AMC1303 as possible, followed by an additional capacitor in the range of 2.2 µF to 10 µF.

AMC1303E0510 AMC1303M0510 AMC1303E0520 AMC1303M0520 AMC1303E2510 AMC1303M2510 AMC1303E2520 AMC1303M2520 ai_pwr_bas771.gifFigure 57. Decoupling the AMC1303