SLUSDU0 September   2019 BQ21061

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
    1.     Device Images
      1.      Simplified Schematic
  4. Revision History
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Linear Charger and Power Path
        1. 7.3.1.1 Battery Charging Process
        2. 7.3.1.2 JEITA and Battery Temperature Dependent Charging
        3. 7.3.1.3 Input Voltage Based Dynamic Power Management (VINDPM) and Dynamic Power Path Management (DPPM)
        4. 7.3.1.4 Battery Supplement Mode
      2. 7.3.2  Protection Mechanisms
        1. 7.3.2.1 Input Over-Voltage Protection
        2. 7.3.2.2 Safety Timer and I2C Watchdog Timer
        3. 7.3.2.3 Thermal Protection and Thermal Charge Current Foldback
        4. 7.3.2.4 Battery Short and Over Current Protection
        5. 7.3.2.5 PMID Short Circuit
      3. 7.3.3  VDD LDO
      4. 7.3.4  Load Switch/LDO Output and Control
      5. 7.3.5  PMID Power Control
      6. 7.3.6  System Voltage (PMID) Regulation
      7. 7.3.7  MR Wake and Reset Input
        1. 7.3.7.1 MR Wake or Short Button Press Functions
        2. 7.3.7.2 MR Reset or Long Button Press Functions
      8. 7.3.8  14-Second Watchdog for HW Reset
      9. 7.3.9  Faults Conditions and Interrupts (INT)
        1. 7.3.9.1 Flags and Fault Condition Response
      10. 7.3.10 Power Good (PG) Pin
      11. 7.3.11 External NTC Monitoring (TS)
        1. 7.3.11.1 TS Thresholds
      12. 7.3.12 I2C Interface
        1. 7.3.12.1 F/S Mode Protocol
    4. 7.4 Device Functional Modes
      1. 7.4.1 Ship Mode
      2. 7.4.2 Low Power
      3. 7.4.3 Active Battery
      4. 7.4.4 Charger/Adapter Mode
      5. 7.4.5 Power-Up/Down Sequencing
    5. 7.5 Register Map
      1. 7.5.1 I2C Registers
        1. 7.5.1.1  STAT0 Register (Address = 0x0) [reset = X]
          1. Table 8. STAT0 Register Field Descriptions
        2. 7.5.1.2  STAT1 Register (Address = 0x1) [reset = X]
          1. Table 9. STAT1 Register Field Descriptions
        3. 7.5.1.3  STAT2 Register (Address = 0x2) [reset = X]
          1. Table 10. STAT2 Register Field Descriptions
        4. 7.5.1.4  FLAG0 Register (Address = 0x3) [reset = 0x0]
          1. Table 11. FLAG0 Register Field Descriptions
        5. 7.5.1.5  FLAG1 Register (Address = 0x4) [reset = 0x0]
          1. Table 12. FLAG1 Register Field Descriptions
        6. 7.5.1.6  FLAG2 Register (Address = 0x5) [reset = 0x0]
          1. Table 13. FLAG2 Register Field Descriptions
        7. 7.5.1.7  FLAG3 Register (Address = 0x6) [reset = 0x0]
          1. Table 14. FLAG3 Register Field Descriptions
        8. 7.5.1.8  MASK0 Register (Address = 0x7) [reset = 0x0]
          1. Table 15. MASK0 Register Field Descriptions
        9. 7.5.1.9  MASK1 Register (Address = 0x8) [reset = 0x0]
          1. Table 16. MASK1 Register Field Descriptions
        10. 7.5.1.10 MASK2 Register (Address = 0x9) [reset = 0x71]
          1. Table 17. MASK2 Register Field Descriptions
        11. 7.5.1.11 MASK3 Register (Address = 0xA) [reset = 0x0]
          1. Table 18. MASK3 Register Field Descriptions
        12. 7.5.1.12 VBAT_CTRL Register (Address = 0x12) [reset = 0x3C]
          1. Table 19. VBAT_CTRL Register Field Descriptions
        13. 7.5.1.13 ICHG_CTRL Register (Address = 0x13) [reset = 0x8]
          1. Table 20. ICHG_CTRL Register Field Descriptions
        14. 7.5.1.14 PCHRGCTRL Register (Address = 0x14) [reset = 0x2]
          1. Table 21. PCHRGCTRL Register Field Descriptions
        15. 7.5.1.15 TERMCTRL Register (Address = 0x15) [reset = 0x14]
          1. Table 22. TERMCTRL Register Field Descriptions
        16. 7.5.1.16 BUVLO Register (Address = 0x16) [reset = 0x0]
          1. Table 23. BUVLO Register Field Descriptions
        17. 7.5.1.17 CHARGERCTRL0 Register (Address = 0x17) [reset = 0x82]
          1. Table 24. CHARGERCTRL0 Register Field Descriptions
        18. 7.5.1.18 CHARGERCTRL1 Register (Address = 0x18) [reset = 0xC2]
          1. Table 25. CHARGERCTRL1 Register Field Descriptions
        19. 7.5.1.19 ILIMCTRL Register (Address = 0x19) [reset = 0x6]
          1. Table 26. ILIMCTRL Register Field Descriptions
        20. 7.5.1.20 LDOCTRL Register (Address = 0x1D) [reset = 0xB0]
          1. Table 27. LDOCTRL Register Field Descriptions
        21. 7.5.1.21 MRCTRL Register (Address = 0x30) [reset = 0x2A]
          1. Table 28. MRCTRL Register Field Descriptions
        22. 7.5.1.22 ICCTRL0 Register (Address = 0x35) [reset = 0x10]
          1. Table 29. ICCTRL0 Register Field Descriptions
        23. 7.5.1.23 ICCTRL1 Register (Address = 0x36) [reset = 0x0]
          1. Table 30. ICCTRL1 Register Field Descriptions
        24. 7.5.1.24 ICCTRL2 Register (Address = 0x37) [reset = 0x40]
          1. Table 31. ICCTRL2 Register Field Descriptions
        25. 7.5.1.25 TS_FASTCHGCTRL Register (Address = 0x61) [reset = 0x34]
          1. Table 32. TS_FASTCHGCTRL Register Field Descriptions
        26. 7.5.1.26 TS_COLD Register (Address = 0x62) [reset = 0x7C]
          1. Table 33. TS_COLD Register Field Descriptions
        27. 7.5.1.27 TS_COOL Register (Address = 0x63) [reset = 0x6D]
          1. Table 34. TS_COOL Register Field Descriptions
        28. 7.5.1.28 TS_WARM Register (Address = 0x64) [reset = 0x38]
          1. Table 35. TS_WARM Register Field Descriptions
        29. 7.5.1.29 TS_HOT Register (Address = 0x65) [reset = 0x27]
          1. Table 36. TS_HOT Register Field Descriptions
        30. 7.5.1.30 DEVICE_ID Register (Address = 0x6F) [reset = 0x3A]
          1. Table 37. DEVICE_ID Register Field Descriptions
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Input (IN/PMID) Capacitors
        2. 8.2.2.2 VDD, LDO Input and Output Capacitors
        3. 8.2.2.3 TS
        4. 8.2.2.4 Recommended Passive Components
      3. 8.2.3 Application Curves
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

MR Wake or Short Button Press Functions

There are two programmable wake or short button press timers, WAKE1 and WAKE2. When the MR pin is held low for tWAKE1 the device sends an interrupt (128 µs active low pulse in the INT pin) and sets the MRWAKE1_TIMEOUT flag when it expires. If the MR pin continues to be driven low after WAKE1 and the WAKE2 timer expires, the BQ21061 sends a second interrupt and sets the MRWAKE2_TIMOUT flag. WAKE1 is used as the timer to wake the device from ship mode. WAKE2’s only function is to send the interrupt and has no effect on other BQ21061 functions. These flags are not cleared until they have been read by the host. Note that interrupts are only sent when the flags are set and the flags must be cleared in order for another interrupt to be sent upon MR press. The timer durations can be set through the MR_WAKEx_TIMER bits in the MRCTRL Register section.

One of the main MR functions is to wake the device from Ship Mode when the MR is asserted. The device will exit the Ship Mode when the MR pin is held low for at least tWAKE1. Immediately after the MR is asserted, VDD will be enabled and the digital will start the WAKE counter. If the MR signal remains low until after the WAKE1 timer expires, the device will power up PMID and LDO (If enabled) completing the exit from the ship mode. If the MR signal goes high before the WAKE1 timer expires, the device will go back to the Ship Mode operation, never powering up PMID or the LDO. Note that if the MR pin remains low after exiting Ship Mode the wake interrupts will not be sent and the long button press functions like HW reset will not occur until the MR pin is toggled. In the case where a valid VIN (VIN > VUVLO) is connected prior to WAKE2 timer expiring, the device will exit the ship mode immediately regardless of the MR or wake timer state. Figure 18 and Figure 19 show these different scenarios.

BQ21061 MR_wake_noVin.gifFigure 18. MR Wake from Ship Mode (MR_LPRESS_ACTION = Ship Mode, VIN not valid)
BQ21061 MR_wake_Vin.gifFigure 19. MR Wake from Ship Mode – VIN Dependencies