SLUSBY7 July   2014

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Description (Continued)
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 Handling Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Dynamic Power Path Management
      2. 8.3.2 Production Test Mode
      3. 8.3.3 AnyBoot Battery Detection
    4. 8.4 Device Functional Modes
      1. 8.4.1  Charge Profile
      2. 8.4.2  EN1/EN2 Pins
      3. 8.4.3  I2C Operation (Host Mode / Default Mode)
      4. 8.4.4  External Settings: ISET, ILIM and VIN_DPM
      5. 8.4.5  Transient Response
      6. 8.4.6  Input Voltage Based DPM
      7. 8.4.7  Sleep Mode
      8. 8.4.8  Input Over-Voltage Protection
      9. 8.4.9  NTC Monitor
      10. 8.4.10 Safety Timer
      11. 8.4.11 Watchdog Timer
      12. 8.4.12 Thermal Regulation and Thermal Shutdown
      13. 8.4.13 Fault Modes
      14. 8.4.14 Serial Interface Description
        1. 8.4.14.1 F/S Mode Protocol
    5. 8.5 Register Maps
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Inductor Selection
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Board Layout
    3. 11.3 Package Summary
  12. 12Device and Documentation Support
    1. 12.1 Trademarks
    2. 12.2 Electrostatic Discharge Caution
    3. 12.3 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

13 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.