SLUSBP6C September   2013  – December 2016


  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Description (Continued)
  6. Device Comparison Table
  7. Pin Configuration and Functions
  8. Specifications
    1. 8.1 Absolute Maximum Ratings
    2. 8.2 ESD Ratings
    3. 8.3 Recommended Operating Conditions
    4. 8.4 Thermal Information
    5. 8.5 Electrical Characteristics
    6. 8.6 Timing Requirements
    7. 8.7 Typical Characteristics
  9. Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Device Power Up
        1. Power-On-Reset (POR)
        2. Power Up from Battery without DC Source
          1. BATFET Turn Off
          2. Shipping Mode
        3. Power Up from DC Source
          1. REGN LDO
          2. Input Source Qualification
          3. Input Current Limit Detection
          4. D+/D- Detection Sets Input Current Limit (bq24297)
          5. PSEL/OTG Pins Set Input Current Limit
          6. HIZ State with 100mA USB Host
          7. Force Input Current Limit Detection
        4. Converter Power-Up
        5. Boost Mode Operation from Battery
      2. 9.3.2 Power Path Management
        1. Narrow VDC Architecture
        2. Dynamic Power Management
        3. Supplement Mode
      3. 9.3.3 Battery Charging Management
        1. Autonomous Charging Cycle
        2. Battery Charging Profile
        3. Thermistor Qualification
          1. Cold/Hot Temperature Window
        4. Charging Termination
          1. Termination When REG02[0] = 1
        5. Charging Safety Timer
          1. Safety Timer Configuration Change
        6. USB Timer When Charging from USB100mA Source
      4. 9.3.4 Status Outputs (PG, STAT, and INT)
        1. Power Good Indicator (PG) (bq24296)
        2. Charging Status Indicator (STAT)
        3. Interrupt to Host (INT)
      5. 9.3.5 Protections
        1. Input Current Limit on ILIM
        2. Thermal Regulation and Thermal Shutdown
        3. Voltage and Current Monitoring in Buck Mode
          1. Input Over-Voltage (ACOV)
          2. System Over-Voltage Protection (SYSOVP)
        4. Voltage and Current Monitoring in Boost Mode
          1. Over-Current Protection
          2. VBUS Over-Voltage Protection
        5. Battery Protection
          1. Battery Over-Voltage Protection (BATOVP)
          2. Battery Short Protection
          3. System Over-Current Protection
    4. 9.4 Device Functional Modes
      1. 9.4.1 Host Mode and Default Mode
        1. Plug in USB100mA Source with Good Battery
        2. USB Timer When Charging from USB100mA Source
    5. 9.5 Programming
      1. 9.5.1 Serial Interface
        1. Data Validity
        2. START and STOP Conditions
        3. Byte Format
        4. Acknowledge (ACK) and Not Acknowledge (NACK)
        5. Slave Address and Data Direction Bit
          1. Single Read and Write
          2. Multi-Read and Multi-Write
    6. 9.6 Register Map
      1. 9.6.1 I2C Registers
        1.  Input Source Control Register REG00 [reset = 00110xxx, or 3x]
        2.  Power-On Configuration Register REG01 [reset = 00011011, or 0x1B]
        3.  Charge Current Control Register REG02 [reset = 01100000, or 60]
        4.  Pre-Charge/Termination Current Control Register REG03 [reset = 00010001, or 0x11]
        5.  Charge Voltage Control Register REG04 [reset = 10110010, or 0xB2]
        6.  Charge Termination/Timer Control Register REG05 [reset = 10011010, or 0x9A]
        7.  Boost Voltage/Thermal Regulation Control Register REG06 [reset = 01110011, or 0x73]
        8.  Misc Operation Control Register REG07 [reset = 01001011, or 4B]
        9.  System Status Register REG08
        10. New Fault Register REG09
        11. Vender / Part / Revision Status Register REG0A
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. Inductor Selection
        2. Input Capacitor
        3. Output Capacitor
      3. 10.2.3 Application Performance Plots
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 Related Links
    3. 13.3 Receiving Notification of Documentation Updates
    4. 13.4 Community Resources
    5. 13.5 Trademarks
    6. 13.6 Electrostatic Discharge Caution
    7. 13.7 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Device and Documentation Support

Documentation Support

Related Documentation

bq24296/7 EVM (PWR021) User’s Guide (SLUUAQ1)

Quad Flatpack No-Lead Logic Packages Application Report (SCBA017)

QFN/SON PCB Attachment Application Report (SLUA271)

Related Links

The table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy.

Table 20. Related Links

bq24296 Click here Click here Click here Click here Click here
bq24297 Click here Click here Click here Click here Click here

Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.

Community Resources

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    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.


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Electrostatic Discharge Caution


These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.


SLYZ022TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.