SLUSD04B July   2018  – February 2019 BQ25150

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
    1.     Device Images
      1.      Simplified Schematic
      2.      Solution Area
  4. Revision History
  5. Description (continued)
  6. Pin Configuration and Functions
    1.     Pin Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Linear Charger and Power Path
        1. 8.3.1.1 Battery Charging Process
          1. 8.3.1.1.1 Pre-Charge
          2. 8.3.1.1.2 Fast Charge
          3. 8.3.1.1.3 Pre-Charge to fast Charge Transitions and Charge Current Ramping
          4. 8.3.1.1.4 Termination
        2. 8.3.1.2 JEITA and Battery Temperature Dependent Charging
        3. 8.3.1.3 Input Voltage Based Dynamic Power Management (VINDPM)
        4. 8.3.1.4 Dynamic Power Path Management Mode (DPPM)
        5. 8.3.1.5 Battery Supplement Mode
      2. 8.3.2  Protection Mechanisms
        1. 8.3.2.1 Input Over-Voltage Protection
        2. 8.3.2.2 Safety Timer and I2C Watchdog Timer
        3. 8.3.2.3 Thermal Protection and Thermal Charge Current Foldback
        4. 8.3.2.4 Battery Short and Over Current Protection
        5. 8.3.2.5 PMID Short Circuit
        6. 8.3.2.6 Maximum Allowable Charging Current (IMAX)
      3. 8.3.3  ADC
        1. 8.3.3.1 ADC Operation in Active Battery Mode and Low Power Mode
        2. 8.3.3.2 ADC Operation When VIN Present
        3. 8.3.3.3 ADC Measurements
        4. 8.3.3.4 ADC Programmable Comparators
      4. 8.3.4  VDD LDO
      5. 8.3.5  Load Switch / LDO Output and Control
      6. 8.3.6  PMID Power Control
      7. 8.3.7  MR Wake and Reset Input
        1. 8.3.7.1 MR Wake or Short Button Press Functions
        2. 8.3.7.2 MR Reset or Long Button Press Functions
      8. 8.3.8  14-second Watchdog for HW Reset
      9. 8.3.9  Faults Conditions and Interrupts (INT)
        1. 8.3.9.1 Flags and Fault Condition Response
      10. 8.3.10 Power Good (PG) Pin
      11. 8.3.11 External NTC Monitoring (TS)
        1. 8.3.11.1 TS Thresholds
      12. 8.3.12 External NTC Monitoring (ADCIN)
      13. 8.3.13 I2C Interface
        1. 8.3.13.1 F/S Mode Protocol
    4. 8.4 Device Functional Modes
      1. 8.4.1 Ship Mode
      2. 8.4.2 Low Power
      3. 8.4.3 Active Battery
      4. 8.4.4 Charger/Adapter Mode
      5. 8.4.5 Power-Up/Down Sequencing
    5. 8.5 Register Map
      1. 8.5.1 I2C Registers
        1. 8.5.1.1  STAT0 Register (Address = 0x0) [reset = X]
          1. Table 10. STAT0 Register Field Descriptions
        2. 8.5.1.2  STAT1 Register (Address = 0x1) [reset = X]
          1. Table 11. STAT1 Register Field Descriptions
        3. 8.5.1.3  STAT2 Register (Address = 0x2) [reset = X]
          1. Table 12. STAT2 Register Field Descriptions
        4. 8.5.1.4  FLAG0 Register (Address = 0x3) [reset = 0x0]
          1. Table 13. FLAG0 Register Field Descriptions
        5. 8.5.1.5  FLAG1 Register (Address = 0x4) [reset = 0x0]
          1. Table 14. FLAG1 Register Field Descriptions
        6. 8.5.1.6  FLAG2 Register (Address = 0x5) [reset = 0x0]
          1. Table 15. FLAG2 Register Field Descriptions
        7. 8.5.1.7  FLAG3 Register (Address = 0x6) [reset = 0x0]
          1. Table 16. FLAG3 Register Field Descriptions
        8. 8.5.1.8  MASK0 Register (Address = 0x7) [reset = 0x0]
          1. Table 17. MASK0 Register Field Descriptions
        9. 8.5.1.9  MASK1 Register (Address = 0x8) [reset = 0x0]
          1. Table 18. MASK1 Register Field Descriptions
        10. 8.5.1.10 MASK2 Register (Address = 0x9) [reset = 0x71]
          1. Table 19. MASK2 Register Field Descriptions
        11. 8.5.1.11 MASK3 Register (Address = 0xA) [reset = 0x0]
          1. Table 20. MASK3 Register Field Descriptions
        12. 8.5.1.12 VBAT_CTRL Register (Address = 0x12) [reset = 0x3C]
          1. Table 21. VBAT_CTRL Register Field Descriptions
        13. 8.5.1.13 ICHG_CTRL Register (Address = 0x13) [reset = 0x8]
          1. Table 22. ICHG_CTRL Register Field Descriptions
        14. 8.5.1.14 PCHRGCTRL Register (Address = 0x14) [reset = 0x2]
          1. Table 23. PCHRGCTRL Register Field Descriptions
        15. 8.5.1.15 TERMCTRL Register (Address = 0x15) [reset = 0x14]
          1. Table 24. TERMCTRL Register Field Descriptions
        16. 8.5.1.16 BUVLO Register (Address = 0x16) [reset = 0x0]
          1. Table 25. BUVLO Register Field Descriptions
        17. 8.5.1.17 CHARGERCTRL0 Register (Address = 0x17) [reset = 0x82]
          1. Table 26. CHARGERCTRL0 Register Field Descriptions
        18. 8.5.1.18 CHARGERCTRL1 Register (Address = 0x18) [reset = 0x42]
          1. Table 27. CHARGERCTRL1 Register Field Descriptions
        19. 8.5.1.19 ILIMCTRL Register (Address = 0x19) [reset = 0x1]
          1. Table 28. ILIMCTRL Register Field Descriptions
        20. 8.5.1.20 LDOCTRL Register (Address = 0x1D) [reset = 0xB0]
          1. Table 29. LDOCTRL Register Field Descriptions
        21. 8.5.1.21 MRCTRL Register (Address = 0x30) [reset = 0x2A]
          1. Table 30. MRCTRL Register Field Descriptions
        22. 8.5.1.22 ICCTRL0 Register (Address = 0x35) [reset = 0x10]
          1. Table 31. ICCTRL0 Register Field Descriptions
        23. 8.5.1.23 ICCTRL1 Register (Address = 0x36) [reset = 0x0]
          1. Table 32. ICCTRL1 Register Field Descriptions
        24. 8.5.1.24 ICCTRL2 Register (Address = 0x37) [reset = 0x0]
          1. Table 33. ICCTRL2 Register Field Descriptions
        25. 8.5.1.25 ADCCTRL0 Register (Address = 0x40) [reset = 0x2]
          1. Table 34. ADCCTRL0 Register Field Descriptions
        26. 8.5.1.26 ADCCTRL1 Register (Address = 0x41) [reset = 0x40]
          1. Table 35. ADCCTRL1 Register Field Descriptions
        27. 8.5.1.27 ADC_DATA_VBAT_M Register (Address = 0x42) [reset = X]
          1. Table 36. ADC_DATA_VBAT_M Register Field Descriptions
        28. 8.5.1.28 ADC_DATA_VBAT_L Register (Address = 0x43) [reset = X]
          1. Table 37. ADC_DATA_VBAT_L Register Field Descriptions
        29. 8.5.1.29 ADC_DATA_TS_M Register (Address = 0x44) [reset = X]
          1. Table 38. ADC_DATA_TS_M Register Field Descriptions
        30. 8.5.1.30 ADC_DATA_TS_L Register (Address = 0x45) [reset = X]
          1. Table 39. ADC_DATA_TS_L Register Field Descriptions
        31. 8.5.1.31 ADC_DATA_ICHG_M Register (Address = 0x46) [reset = X]
          1. Table 40. ADC_DATA_ICHG_M Register Field Descriptions
        32. 8.5.1.32 ADC_DATA_ICHG_L Register (Address = 0x47) [reset = X]
          1. Table 41. ADC_DATA_ICHG_L Register Field Descriptions
        33. 8.5.1.33 ADC_DATA_ADCIN_M Register (Address = 0x48) [reset = X]
          1. Table 42. ADC_DATA_ADCIN_M Register Field Descriptions
        34. 8.5.1.34 ADC_DATA_ADCIN_L Register (Address = 0x49) [reset = X]
          1. Table 43. ADC_DATA_ADCIN_L Register Field Descriptions
        35. 8.5.1.35 ADC_DATA_VIN_M Register (Address = 0x4A) [reset = X]
          1. Table 44. ADC_DATA_VIN_M Register Field Descriptions
        36. 8.5.1.36 ADC_DATA_VIN_L Register (Address = 0x4B) [reset = X]
          1. Table 45. ADC_DATA_VIN_L Register Field Descriptions
        37. 8.5.1.37 ADC_DATA_PMID_M Register (Address = 0x4C) [reset = X]
          1. Table 46. ADC_DATA_PMID_M Register Field Descriptions
        38. 8.5.1.38 ADC_DATA_PMID_L Register (Address = 0x4D) [reset = X]
          1. Table 47. ADC_DATA_PMID_L Register Field Descriptions
        39. 8.5.1.39 ADC_DATA_IIN_M Register (Address = 0x4E) [reset = X]
          1. Table 48. ADC_DATA_IIN_M Register Field Descriptions
        40. 8.5.1.40 ADC_DATA_IIN_L Register (Address = 0x4F) [reset = X]
          1. Table 49. ADC_DATA_IIN_L Register Field Descriptions
        41. 8.5.1.41 ADCALARM_COMP1_M Register (Address = 0x52) [reset = 0x23]
          1. Table 50. ADCALARM_COMP1_M Register Field Descriptions
        42. 8.5.1.42 ADCALARM_COMP1_L Register (Address = 0x53) [reset = 0x20]
          1. Table 51. ADCALARM_COMP1_L Register Field Descriptions
        43. 8.5.1.43 ADCALARM_COMP2_M Register (Address = 0x54) [reset = 0x38]
          1. Table 52. ADCALARM_COMP2_M Register Field Descriptions
        44. 8.5.1.44 ADCALARM_COMP2_L Register (Address = 0x55) [reset = 0x90]
          1. Table 53. ADCALARM_COMP2_L Register Field Descriptions
        45. 8.5.1.45 ADCALARM_COMP3_M Register (Address = 0x56) [reset = 0x0]
          1. Table 54. ADCALARM_COMP3_M Register Field Descriptions
        46. 8.5.1.46 ADCALARM_COMP3_L Register (Address = 0x57) [reset = 0x0]
          1. Table 55. ADCALARM_COMP3_L Register Field Descriptions
        47. 8.5.1.47 ADC_READ_EN Register (Address = 0x58) [reset = 0x0]
          1. Table 56. ADC_READ_EN Register Field Descriptions
        48. 8.5.1.48 TS_FASTCHGCTRL Register (Address = 0x61) [reset = 0x34]
          1. Table 57. TS_FASTCHGCTRL Register Field Descriptions
        49. 8.5.1.49 TS_COLD Register (Address = 0x62) [reset = 0x7C]
          1. Table 58. TS_COLD Register Field Descriptions
        50. 8.5.1.50 TS_COOL Register (Address = 0x63) [reset = 0x6D]
          1. Table 59. TS_COOL Register Field Descriptions
        51. 8.5.1.51 TS_WARM Register (Address = 0x64) [reset = 0x38]
          1. Table 60. TS_WARM Register Field Descriptions
        52. 8.5.1.52 TS_HOT Register (Address = 0x65) [reset = 0x27]
          1. Table 61. TS_HOT Register Field Descriptions
        53. 8.5.1.53 DEVICE_ID Register (Address = 0x6F) [reset = 0x20]
          1. Table 62. DEVICE_ID Register Field Descriptions
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Input (IN/PMID) Capacitors
        2. 9.2.2.2 VDD, LDO Input and Output Capacitors
        3. 9.2.2.3 TS
        4. 9.2.2.4 IMAX Selection
        5. 9.2.2.5 Recommended Passive Components
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Pin Configuration and Functions

YFP Package
20-Pin DSBGA
Top View
BQ25150 bq25150_ballmap.gif

Pin Functions

PIN I/O DESCRIPTION
NAME NO.
IN A1 I DC Input Power Supply. IN is connected to the external DC supply. Bypass IN to GND with at least 1 uF of capacitance using a ceramic capacitor.
PMID A2, B2 I/O High Side Bypass Connection. Connect at least 10 uF ceramic capacitor (at least 3 uF of ceramic capacitance with DC bias de-rating) from PMID to GND as close to the PMID and GND pins as possible. Note: Shorting PMID to IN pin is not recommended as it may cause large discharge current from battery to IN if IN pin is not truly floating.
GND A4 PWR Ground connection. Connect to the ground plane of the circuit.
VDD D1 O Digital supply LDO. Connect at least 4.7 uF capacitor to ground.
CE C2 I Charge Enable. Drive CE low or leave disconnected to enable charging when VIN is valid. Drive CE high to disable charge when VIN is present. CE is pulled low internally with 900-kΩ resistor. CE has no effect when VIN is not present.
SCL E3 I/O I2C Interface Clock. Connect SCL to the logic rail through a 10-kΩ resistor.
SDA E2 I I2C Interface Data. Connect SDA to the logic rail through a 10-kΩ resistor.
LP D3 I Low Power Mode Enable. Drive this pin low to enable the device in low power mode when powered by the battery. LP is pulled low internally with 900 kOhm resistor. This pin has no effect when VIN is present.
IMAX C3 I Connect a 10-kOhms or lower resistor to this pin to set the maximum allowable fast charge current. Must not be left floating.
INT D2 O INT is an open-drain output that signals fault interrupts. When a fault occurs, a 128us pulse is sent out as an interrupt for the host. INT is enabled/disabled using the MASK_INT bit in the control register.
ADCIN C4 I Input Channel to the ADC. Maximum ADC range 1.2 V.
MR C1 I Manual Reset Input. MR is a general purpose input that must be held low for greater than tHWRESET to go into HW Reset and power cycle the output rails. If MR is also used to wake up the device out of Ship Mode when pressed for at least tWAKE2. MR has in internal 125-kΩ pull-up resistor to BAT.
LS/LDO D4 O Load Switch or LDO output. Connect 2.2 uF of ceramic capacitance to this pin to assure stability. Be sure to account for capacitance bias voltage derating when selecting the capacitor.
VINLS E4 I Input to the Load Switch / LDO output. Connect at least 1 uF of ceramic capacitance from this pin to ground.
BAT A3, B3 I/O Battery Connection. Connect to the positive terminal of the battery. Bypass BAT to GND with at least 1 uF of ceramic capacitance.
TS B4 I Battery Pack NTC Monitor. Connect TS to a 10kΩ NTC Thermistor in parallel to a 10-kΩ resistor. If TS function is not to be used connect a 5-kΩ resistor from TS to ground.
PG B1 O Open-drain Power Good status indication output. PG is pulled to GND when VIN is above VBAT+ VSLP and less than VOVP. PG is high-impedance when the input power is not within specified limits. Connect PG to the desired logic voltage rail using a 1-kΩ to 100-kΩ resistor, or use with an LED for visual indication. PG can also be configured through I2C as a push-button level shifted output (MR), where the output of the PG pin reflects the status of the MR input, but pulled up to the desired logic voltage rail using a 1-kΩ to 100-kΩ resistor. The PG pin can also be configured as a general purpose open drain output.
VIO E1 I System IO supply. Connect to system IO supply to allow level shifting of input signals (SDA, SCL, LP and CE) to the device internal digital domain. Connect to VDD when external IO supply is not available.