SLUSDC7A March   2020  – November 2020 BQ25306

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Description (continued)
  6. Device Comparison Table
  7. Pin Configuration and Functions
  8. Specifications
    1. 8.1 Absolute Maximum Ratings
    2. 8.2 ESD Ratings
    3. 8.3 Recommended Operating Conditions
    4. 8.4 Thermal Information
    5. 8.5 Electrical Characteristics
    6. 8.6 Timing Requirements
    7. 8.7 Typical Characteristics
  9. Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Device Power Up
        1. 9.3.1.1 Power-On-Reset (POR)
        2. 9.3.1.2 REGN Regulator Power Up
        3. 9.3.1.3 Charger Power Up
        4. 9.3.1.4 Charger Enable and Disable by EN Pin
        5. 9.3.1.5 Device Unplugged from Input Source
      2. 9.3.2 Battery Charging Management
        1. 9.3.2.1 Battery Charging Profile
        2. 9.3.2.2 Precharge
        3. 9.3.2.3 Charging Termination
        4. 9.3.2.4 Battery Recharge
        5. 9.3.2.5 Charging Safety Timer
        6. 9.3.2.6 Thermistor Temperature Monitoring
      3. 9.3.3 Charging Status Indicator (STAT)
      4. 9.3.4 Protections
        1. 9.3.4.1 Voltage and Current Monitoring
          1. 9.3.4.1.1 Input Over-Voltage Protection
          2. 9.3.4.1.2 Input Voltage Dynamic Power Management (VINDPM)
          3. 9.3.4.1.3 Input Current Limit
          4. 9.3.4.1.4 Cycle-by-Cycle Current Limit
        2. 9.3.4.2 Thermal Regulation and Thermal Shutdown
        3. 9.3.4.3 Battery Protection
          1. 9.3.4.3.1 Battery Over-Voltage Protection (VBAT_OVP)
          2. 9.3.4.3.2 Battery Short Circuit Protection
        4. 9.3.4.4 ICHG Pin Open and Short Protection
    4. 9.4 Device Functional Modes
      1. 9.4.1 Disable Mode, HiZ Mode, Sleep Mode, Charge Mode, Termination Mode, and Fault Mode
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Applications
      1. 10.2.1 Typical Application
        1. 10.2.1.1 Design Requirements
        2. 10.2.1.2 Detailed Design Procedure
          1. 10.2.1.2.1 Charge Voltage Settings
          2. 10.2.1.2.2 Charge Current Setting
          3. 10.2.1.2.3 Inductor Selection
          4. 10.2.1.2.4 Input Capacitor
          5. 10.2.1.2.5 Output Capacitor
        3. 10.2.1.3 Application Curves
      2. 10.2.2 Typical Application with External Power Path
        1. 10.2.2.1 Design Requirements
      3. 10.2.3 Typical Application with MCU Programmable Charge Current
        1. 10.2.3.1 Design Requirements
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Device Support
      1. 13.1.1 Third-Party Products Disclaimer
    2. 13.2 Documentation Support
      1. 13.2.1 Related Documentation
    3. 13.3 Receiving Notification of Documentation Updates
    4. 13.4 Support Resources
    5. 13.5 Trademarks
    6. 13.6 Electrostatic Discharge Caution
    7. 13.7 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Absolute Maximum Ratings

Over operating free-air temperature range (unless otherwise noted)(1)
PARAMETER MIN MAX UNIT
Voltage Range (with respect to GND) VBUS (converter not switching) –2 28 V
PMID(converter not switching) –0.3 28 V
SW –2(2) 20 V
BTST –0.3 25.5 V
STAT –0.3 5.5 V
BAT –0.3 11 V
BTST to SW –0.3 5.5 V
ICHG –0.3 5.5 V
REGN –0.3 5.5 V
POL –0.3 5.5 V
/EN –0.3 5.5 V
TS –0.3 5.5 V
Voltage Range (with respect to GND) FB –0.3 11 V
FB_GND –0.3 11 V
Output Sink Current STAT 6 mA
REGN 20 mA
Junction temperature TJ –40 150 ºC
Storage temperature Tstg –65 150 ºC
Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
-3V for 10ns transient