SLUSDV2A May   2020  – May 2021 BQ25798

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Description (continued)
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Device Power-On-Reset
      2. 8.3.2  PROG Pin Configuration
      3. 8.3.3  Device Power Up from Battery without Input Source
      4. 8.3.4  Device Power Up from Input Source
        1. 8.3.4.1 Power Up REGN LDO
        2. 8.3.4.2 Poor Source Qualification
        3. 8.3.4.3 ILIM_HIZ Pin
        4. 8.3.4.4 Default VINDPM Setting
        5. 8.3.4.5 Input Source Type Detection
          1. 8.3.4.5.1 D+/D– Detection Sets Input Current Limit
          2. 8.3.4.5.2 HVDCP Detection Procedure
          3. 8.3.4.5.3 Connector Fault Detection
      5. 8.3.5  Dual-Input Power Mux
        1. 8.3.5.1 ACDRV Turn On Condition
        2. 8.3.5.2 VBUS Input Only
        3. 8.3.5.3 One ACFET-RBFET
        4. 8.3.5.4 Two ACFETs-RBFETs
      6. 8.3.6  Buck-Boost Converter Operation
        1. 8.3.6.1 Force Input Current Limit Detection
        2. 8.3.6.2 Input Current Optimizer (ICO)
        3. 8.3.6.3 Maximum Power Point Tracking for Small PV Panel
        4. 8.3.6.4 Pulse Frequency Modulation (PFM)
        5. 8.3.6.5 Device HIZ State
      7. 8.3.7  USB On-The-Go (OTG)
        1. 8.3.7.1 OTG Mode to Power External Devices
        2. 8.3.7.2 Backup Power Supply Mode
        3. 8.3.7.3 Backup Mode with Dual Input Mux
      8. 8.3.8  Power Path Management
        1. 8.3.8.1 Narrow VDC Architecture
        2. 8.3.8.2 Dynamic Power Management
      9. 8.3.9  Battery Charging Management
        1. 8.3.9.1 Autonomous Charging Cycle
        2. 8.3.9.2 Battery Charging Profile
        3. 8.3.9.3 Charging Termination
        4. 8.3.9.4 Charging Safety Timer
        5. 8.3.9.5 Thermistor Qualification
          1. 8.3.9.5.1 JEITA Guideline Compliance in Charge Mode
          2. 8.3.9.5.2 Cold/Hot Temperature Window in OTG Mode
      10. 8.3.10 Integrated 16-Bit ADC for Monitoring
      11. 8.3.11 Status Outputs ( STAT, and INT)
        1. 8.3.11.1 Charging Status Indicator (STAT Pin)
        2. 8.3.11.2 Interrupt to Host ( INT)
      12. 8.3.12 Ship FET Control
        1. 8.3.12.1 Shutdown Mode
        2. 8.3.12.2 Ship Mode
        3. 8.3.12.3 System Power Reset
      13. 8.3.13 Protections
        1. 8.3.13.1 Voltage and Current Monitoring
          1. 8.3.13.1.1  VAC Over-voltage Protection (VAC_OVP)
          2. 8.3.13.1.2  VBUS Over-voltage Protection (VBUS_OVP)
          3. 8.3.13.1.3  VBUS Under-voltage Protection (POORSRC)
          4. 8.3.13.1.4  System Over-voltage Protection (VSYS_OVP)
          5. 8.3.13.1.5  System Short Protection (VSYS_SHORT)
          6. 8.3.13.1.6  Battery Over-voltage Protection (VBAT_OVP)
          7. 8.3.13.1.7  Battery Over-current Protection (IBAT_OCP)
          8. 8.3.13.1.8  Input Over-current Protection (IBUS_OCP)
          9. 8.3.13.1.9  OTG Over-voltage Protection (OTG_OVP)
          10. 8.3.13.1.10 OTG Under-voltage Protection (OTG_UVP)
        2. 8.3.13.2 Thermal Regulation and Thermal Shutdown
      14. 8.3.14 Serial Interface
        1. 8.3.14.1 Data Validity
        2. 8.3.14.2 START and STOP Conditions
        3. 8.3.14.3 Byte Format
        4. 8.3.14.4 Acknowledge (ACK) and Not Acknowledge (NACK)
        5. 8.3.14.5 Slave Address and Data Direction Bit
        6. 8.3.14.6 Single Write and Read
        7. 8.3.14.7 Multi-Write and Multi-Read
    4. 8.4 Device Functional Modes
      1. 8.4.1 Host Mode and Default Mode
      2. 8.4.2 Register Bit Reset
    5. 8.5 Register Map
      1. 8.5.1 I2C Registers
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 PV Panel Selection
        2. 9.2.2.2 Inductor Selection
        3. 9.2.2.3 Input (VBUS / PMID) Capacitor
        4. 9.2.2.4 Output (VSYS) Capacitor
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Support Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Interrupt to Host ( INT)

In some applications, the host does not always monitor charger operation. The INT pin notifies the system host on the device operation. By default, the following events generate an active-low, 256µs INT pulse.

  1. Good input source detected
    • VVBUS < VVBUS_OVP threshold
    • VVBUS > VPOORSRC (typical 3.4 V) when IPOORSRC (typical 30 mA) current is applied (not a poor source)
  2. VBUS_STAT changes state (VBUS_STAT any bit change)
  3. Good input source removed
  4. Entering IINDPM regulation
  5. Entering VINDPM regulation
  6. Entering IC junction temperature regulation (TREG)
  7. I2C Watchdog timer expired
    • At initial power up, this INT gets asserted to signal I2C is ready for communication
  8. Charger status changes state (CHRG_STAT value change), including Charge Complete
  9. TS_STAT changes state (TS_STAT any bit change)
  10. VBUS over-voltage detected (VBUS_OVP)
  11. VAC over-voltage detected (VAC_OVP for VAC1 or VAC2)
  12. Junction temperature shutdown (TSHUT)
  13. Battery over-voltage detected (BATOVP)
  14. System over-voltage detected (VSYS_OVP)
  15. IBUS over-current detected (IBUS_OCP)
  16. IBAT over-current detected (IBAT_OCP)
  17. Charge safety timer expired, including trickle charge and pre-charge and fast charge safety timer expired
  18. A rising edge on any of the other *_STAT bits

Each one of these INT sources can be masked off to prevent INT pulses from being sent out when they occur. Three bits exist for each one of these events:

  • The STAT bit holds the current status of each INT source
  • The FLAG bit holds information on which source produced an INT, regardless of the current status
  • The MASK bit is used to prevent the device from sending out INT for each particular event

When one of the above conditions occurs (a rising edge on any of the *_STAT bits), the device sends out an INT pulse and keeps track of which source generated the INT via the FLAG registers. The FLAG register bits are automatically reset to zero after the host reads them, and a new edge on STAT bit is required to re-assert the FLAG. This sequence is illustrated in Figure 8-14.

GUID-88ED2306-DFD1-4488-8C0B-2A6B144E4B48-low.gif Figure 8-14 INT Generation Behavior Example