SLUSAT1B March   2013  – March 2020 BQ27510-G3

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
    1.     Device Images
      1.      Simplified Schematic
  4. Revision History
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Data Flash Memory Characteristics
    7. 6.7 400-kHz I2C-Compatible Interface Communication Timing Requirements
    8. 6.8 100-kHz I2C-Compatible Interface Communication Timing Requirements
    9. 6.9 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
      1. 7.4.1 Power Modes
    5. 7.5 Programming
      1. 7.5.1 Standard Data Commands
        1. 7.5.1.1 Control(): 0x00/0x01
      2. 7.5.2 Communications
        1. 7.5.2.1 I2C Interface
        2. 7.5.2.2 I2C Time Out
        3. 7.5.2.3 I2C Command Waiting Time
        4. 7.5.2.4 I2C Clock Stretching
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 BAT Voltage Sense Input
        2. 8.2.2.2 SRP and SRN Current Sense Inputs
        3. 8.2.2.3 Sense Resistor Selection
        4. 8.2.2.4 TS Temperature Sense Input
        5. 8.2.2.5 Thermistor Selection
        6. 8.2.2.6 REGIN Power Supply Input Filtering
        7. 8.2.2.7 VCC LDO Output Filtering
      3. 8.2.3 Application Curves
  9. Power Supply Recommendations
    1. 9.1 Power Supply Decoupling
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Sense Resistor Connections
      2. 10.1.2 Thermistor Connections
      3. 10.1.3 High-Current and Low-Current Path Separation
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

100-kHz I2C-Compatible Interface Communication Timing Requirements

TA = –40°C to 85°C, 2.4 V < VCC < 2.6 V; typical values at TA = 25°C and VCC = 2.5 V (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
tr SCL/SDA rise time 1 µs
tf SCL/SDA fall time 300 ns
tw(H) SCL pulse width (high) 4 µs
tw(L) SCL pulse width (low) 4.7 μs
tsu(STA) Setup for repeated start 4.7 µs
td(STA) Start to first falling edge of SCL 4 µs
tsu(DAT) Data setup time 250 ns
th(DAT) Data hold time Receive mode 0 ns
Transmit mode 300
tsu(STOP) Setup time for stop 4 µs
tBUF Bus free time between stop and start 4.7 μs
fSCL Clock frequency 10 100 kHz
tBUSERR Bus error timeout 17.3 21.2 s
BQ27510-G3 i2c_comp_lus816.gifFigure 1. I2C-Compatible Interface Timing Diagram