SLUSAT1B March   2013  – March 2020 BQ27510-G3

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
    1.     Device Images
      1.      Simplified Schematic
  4. Revision History
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Data Flash Memory Characteristics
    7. 6.7 400-kHz I2C-Compatible Interface Communication Timing Requirements
    8. 6.8 100-kHz I2C-Compatible Interface Communication Timing Requirements
    9. 6.9 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
      1. 7.4.1 Power Modes
    5. 7.5 Programming
      1. 7.5.1 Standard Data Commands
        1. 7.5.1.1 Control(): 0x00/0x01
      2. 7.5.2 Communications
        1. 7.5.2.1 I2C Interface
        2. 7.5.2.2 I2C Time Out
        3. 7.5.2.3 I2C Command Waiting Time
        4. 7.5.2.4 I2C Clock Stretching
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 BAT Voltage Sense Input
        2. 8.2.2.2 SRP and SRN Current Sense Inputs
        3. 8.2.2.3 Sense Resistor Selection
        4. 8.2.2.4 TS Temperature Sense Input
        5. 8.2.2.5 Thermistor Selection
        6. 8.2.2.6 REGIN Power Supply Input Filtering
        7. 8.2.2.7 VCC LDO Output Filtering
      3. 8.2.3 Application Curves
  9. Power Supply Recommendations
    1. 9.1 Power Supply Decoupling
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Sense Resistor Connections
      2. 10.1.2 Thermistor Connections
      3. 10.1.3 High-Current and Low-Current Path Separation
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Electrical Characteristics

TA = 25°C, CREG = 0.47 μF, VREGIN = 3.6 V (unless otherwise noted)
PARAMETER TEST CONDITION MIN NOM MAX UNIT
2.5-V LDO(1)
VREG25 Regulator output voltage 2.7 V ≤ VREGIN ≤ 5.5 V,
IOUT ≤ 16mA
TA = –40°C to 85°C 2.4 2.5 2.6 V
2.45 V ≤ VREGIN < 2.7 V (low battery), IOUT ≤ 3mA TA = –40°C to 85°C 2.4 V
VDO Regulator dropout voltage 2.7 V, IOUT ≤ 16 mA TA = –40°C to 85°C 280 mV
2.45 V, IOUT ≤ 3 mA 50
ΔVREGTEMP Regulator output change with temperature VREGIN = 3.6 V, IOUT = 16 mA TA = –40°C to 85°C 0.3%
ΔVREGLINE Line regulation 2.7 V ≤ VREGIN ≤ 5.5 V, IOUT = 16 mA 11 25 mV
ΔVREGLOAD Load regulation 0.2 mA ≤ IOUT ≤ 3 mA, VREGIN = 2.45 V 34 40 mV
3 mA ≤ IOUT ≤ 16 mA, VREGIN = 2.7 V 31
ISHORT(2) Short circuit current limit VREG25 = 0 V TA = –40°C to 85°C 250 mA
POWER-ON RESET
VIT+ Positive-going battery voltage input at VCC TA = –40°C to 85°C 2.05 2.20 2.31 V
VHYS Power-on reset hysteresis TA = –40°C to 85°C 45 115 185 mV
INTERNAL TEMPERATURE SENSOR CHARACTERISTICS
GTEMP Temperature sensor voltage gain TA = –40°C to 85°C, 2.4 V < VCC < 2.6 V; typical values at TA = 25°C and VCC = 2.5 V –2 mV/°C
INTERNAL CLOCK OSCILLATORS
fOSC High Frequency Oscillator TA = –40°C to 85°C, 2.4 V < VCC < 2.6 V; typical values at TA = 25°C and VCC = 2.5 V 8.389 MHz
fLOSC Low Frequency Oscillator TA = –40°C to 85°C, 2.4 V < VCC < 2.6 V; typical values at TA = 25°C and VCC = 2.5 V 32.768 kHz
INTEGRATING ADC (COULOMB COUNTER) CHARACTERISTICS
VSR_IN Input voltage range, V(SRN) and V(SRP) VSR = V(SRN) – V(SRP) TA = –40°C to 85°C, 2.4 V < VCC < 2.6 V –0.125 0.125 V
tSR_CONV Conversion time Single conversion TA = 25°C and VCC = 2.5 V 1 s
Resolution TA = –40°C to 85°C, 2.4 V < VCC < 2.6 V 14 15 bits
VSR_OS Input offset TA = 25°C and VCC = 2.5 V 10 µV
INL Integral nonlinearity error TA = –40°C to 85°C, 2.4 V < VCC < 2.6 V ±0.007% ±0.034% FSR
ZSR_IN Effective input resistance(2) TA = –40°C to 85°C, 2.4 V < VCC < 2.6 V 2.5
ISR_LKG Input leakage current(2) TA = –40°C to 85°C, 2.4 V < VCC < 2.6 V 0.3 µA
ADC (TEMPERATURE AND CELL MEASUREMENT) CHARACTERISTICS
VADC_IN Input voltage range TA = –40°C to 85°C, 2.4 V < VCC < 2.6 V –0.2 1 V
tADC_CONV Conversion time TA = –40°C to 85°C, 2.4 V < VCC < 2.6 V 125 ms
Resolution TA = –40°C to 85°C, 2.4 V < VCC < 2.6 V 14 15 bits
VADC_OS Input offset TA = 25°C and VCC = 2.5 V 1 mV
ZADC1 Effective input resistance (TS) (2) TA = –40°C to 85°C, 2.4 V < VCC < 2.6 V 8
ZADC2 Effective input resistance (BAT)(2) BQ27510-G3 not measuring cell voltage TA = –40°C to 85°C, 2.4 V < VCC < 2.6 V 8
BQ27510-G3 measuring cell voltage TA = 25°C and VCC = 2.5 V 100
IADC_LKG Input leakage current(2) TA = –40°C to 85°C, 2.4 V < VCC < 2.6 V 0.3 µA
LDO output current, IOUT, is the sum of internal and external load currents.
Assured by design. Not production tested.