SLUSAT1B March   2013  – March 2020 BQ27510-G3

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
    1.     Device Images
      1.      Simplified Schematic
  4. Revision History
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Data Flash Memory Characteristics
    7. 6.7 400-kHz I2C-Compatible Interface Communication Timing Requirements
    8. 6.8 100-kHz I2C-Compatible Interface Communication Timing Requirements
    9. 6.9 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
      1. 7.4.1 Power Modes
    5. 7.5 Programming
      1. 7.5.1 Standard Data Commands
        1. 7.5.1.1 Control(): 0x00/0x01
      2. 7.5.2 Communications
        1. 7.5.2.1 I2C Interface
        2. 7.5.2.2 I2C Time Out
        3. 7.5.2.3 I2C Command Waiting Time
        4. 7.5.2.4 I2C Clock Stretching
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 BAT Voltage Sense Input
        2. 8.2.2.2 SRP and SRN Current Sense Inputs
        3. 8.2.2.3 Sense Resistor Selection
        4. 8.2.2.4 TS Temperature Sense Input
        5. 8.2.2.5 Thermistor Selection
        6. 8.2.2.6 REGIN Power Supply Input Filtering
        7. 8.2.2.7 VCC LDO Output Filtering
      3. 8.2.3 Application Curves
  9. Power Supply Recommendations
    1. 9.1 Power Supply Decoupling
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Sense Resistor Connections
      2. 10.1.2 Thermistor Connections
      3. 10.1.3 High-Current and Low-Current Path Separation
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

I2C Clock Stretching

A clock stretch can occur during all modes of fuel gauge operation. In SLEEP and HIBERNATE modes, a short clock stretch occurs on all I2C traffic as the device must wake-up to process the packet. In the other modes (BAT INSERT CHECK, NORMAL) clock stretching only occurs for packets addressed for the fuel gauge. The majority of clock stretch periods are small as the I2C interface performs normal data flow control. However, less frequent yet more significant clock stretch periods may occur as blocks of Data Flash are updated. The following table summarizes the approximate clock stretch duration for various fuel gauge operating conditions.

Table 4. Approximate Clock Stretch Duration

GAUGING MODE OPERATING CONDITION OR COMMENT APPROXIMATE
DURATION
SLEEP
HIBERNATE
Clock stretch occurs at the beginning of all traffic as the device wakes up ≤ 4 ms
BAT INSERT CHECK,
NORMAL
Clock stretch occurs within the packet for flow control (after a start bit, ACK or first data bit) ≤ 4 ms
Normal Ra table data flash updates 24 ms
Data flash block writes 72 ms
Restored Data Flash block write after loss of power 116 ms
End of discharge Ra table data flash update 144 ms