SLUSAT1B March   2013  – March 2020 BQ27510-G3

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
    1.     Device Images
      1.      Simplified Schematic
  4. Revision History
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Data Flash Memory Characteristics
    7. 6.7 400-kHz I2C-Compatible Interface Communication Timing Requirements
    8. 6.8 100-kHz I2C-Compatible Interface Communication Timing Requirements
    9. 6.9 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
      1. 7.4.1 Power Modes
    5. 7.5 Programming
      1. 7.5.1 Standard Data Commands
        1. 7.5.1.1 Control(): 0x00/0x01
      2. 7.5.2 Communications
        1. 7.5.2.1 I2C Interface
        2. 7.5.2.2 I2C Time Out
        3. 7.5.2.3 I2C Command Waiting Time
        4. 7.5.2.4 I2C Clock Stretching
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 BAT Voltage Sense Input
        2. 8.2.2.2 SRP and SRN Current Sense Inputs
        3. 8.2.2.3 Sense Resistor Selection
        4. 8.2.2.4 TS Temperature Sense Input
        5. 8.2.2.5 Thermistor Selection
        6. 8.2.2.6 REGIN Power Supply Input Filtering
        7. 8.2.2.7 VCC LDO Output Filtering
      3. 8.2.3 Application Curves
  9. Power Supply Recommendations
    1. 9.1 Power Supply Decoupling
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Sense Resistor Connections
      2. 10.1.2 Thermistor Connections
      3. 10.1.3 High-Current and Low-Current Path Separation
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Pin Configuration and Functions

DRZ Package
12-Pin SON
Top View
BQ27510-G3 po_lusat1.gif

Pin Functions

PIN TYPE(1) DESCRIPTION
NAME NO.
BI/TOUT 1 I/O Battery-insertion detection input. Power pin for pack thermistor network. Thermistor-multiplexer control pin. Open-drain I/O. Use with pull-up resistor >1MΩ (1.8 MΩ typical).
REG25 2 P 2.5-V output voltage of the internal integrated LDO
REGIN 3 P Regulator input. Decouple with 0.1-μF ceramic capacitor to Vss
BAT 4 I Cell voltage measurement input. ADC input
Vcc 5 P Processor power input. Decouple with 0.1-μF ceramic capacitor minimum
Vss 6 P Device ground
SRP 7 IA Analog input pin connected to the internal coulomb counter with a Kelvin connection where SRP is nearest the PACK– connection. Connect to 5-mΩ to 20-mΩ sense resistor.
SRN 8 IA Analog input pin connected to the internal coulomb counter with a Kelvin connection where SRN is nearest the Vss connection. Connect to 5-mΩ to 20-mΩ sense resistor.
TS 9 IA Pack thermistor voltage sense (use 103AT-type thermistor). ADC input
SDA 10 I/O Slave I2C serial communications data line for communication with system (Master). Open-drain I/O. Use with 10-kΩ pull-up resistor (typical).
SCL 11 I Slave I2C serial communications clock input line for communication with system (Master). Open-drain I/O. Use with 10-kΩ pull-up resistor (typical).
GPOUT 12 O General Purpose open-drain output. May be configured as Battery Low, Battery Good, or to perform interrupt functionality.
I/O = Digital input/output; IA = Analog input; P = Power connection.