SLUSB20C November   2012  – November 2021

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics: Supply Current
    6. 7.6  Digital Input and Output DC Characteristics
    7. 7.7  Power-on Reset
    8. 7.8  2.5-V LDO Regulator
    9. 7.9  Internal Clock Oscillators
    10. 7.10 ADC (Temperature and Cell Measurement) Characteristics
    11. 7.11 Integrating ADC (Coulomb Counter) Characteristics
    12. 7.12 Data Flash Memory Characteristics
    13. 7.13 I2C-Compatible Interface Communication Timing Requirements
    14. 7.14 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
      1. 8.4.1 Power Modes
        1. 8.4.1.1 BAT INSERT CHECK Mode
        2. 8.4.1.2 NORMAL Mode
        3. 8.4.1.3 SLEEP Mode
      2. 8.4.2 SLEEP+ Mode
      3. 8.4.3 HIBERNATE Mode
    5. 8.5 Programming
      1. 8.5.1 Standard Data Commands
      2. 8.5.2 Extended Data Commands
      3. 8.5.3 Communications
        1. 8.5.3.1 I2C Interface
        2. 8.5.3.2 I2C Time Out
        3. 8.5.3.3 I2C Command Waiting Time
        4. 8.5.3.4 I2C Clock Stretching
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 BAT Voltage Sense Input
        2. 9.2.2.2 SRP and SRN Current Sense Inputs
        3. 9.2.2.3 Sense Resistor Selection
        4. 9.2.2.4 TS Temperature Sense Input
        5. 9.2.2.5 Thermistor Selection
        6. 9.2.2.6 REGIN Power Supply Input Filtering
        7. 9.2.2.7 VCC LDO Output Filtering
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
    1. 10.1 Power Supply Decoupling
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Sense Resistor Connections
      2. 11.1.2 Thermistor Connections
      3. 11.1.3 High-Current and Low-Current Path Separation
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Third-Party Products Disclaimer
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Support Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.5.2 Extended Data Commands

Extended commands offer additional functionality beyond the standard set of commands. They are used in the same manner; however, unlike standard commands, extended commands are not limited to 2-byte words. The number of command bytes for a given extended command range in size from single to multiple bytes is specified in Table 8-2. See BQ27520-G4 Technical Reference Manual (SLUUA35) for details on accessing the data flash.

Table 8-2 Extended Data Commands
NAMECOMMAND
CODE		UNITSEALED
ACCESS(1) (2)		UNSEALED
ACCESS(1) (2)
Reserved0x34 to 0x3DNARR
DataFlashClass( ) (2)0x3ENANARW
DataFlashBlock( ) (2)0x3FNARWRW
BlockData( )0x40 to 0x5FNARRW
BlockDataCheckSum( )0x60NARWRW
BlockDataControl( )0x61NANARW
ApplicationStatus( )0x6ANARR
Reserved0x6B to 0x7FNARR
(1) SEALED and UNSEALED states are entered via commands to Control( ) 0x00 and 0x01.
(2) In SEALED mode, data flash cannot be accessed through commands 0x3E and 0x3F.