SLUSCY0B May   2018  – August 2019 BQ27Z561

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Schematic
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Supply Current
    6. 6.6  Internal 1.8-V LDO (REG18)
    7. 6.7  I/O (CE, PULS, INT)
    8. 6.8  Internal Temperature Sensor
    9. 6.9  NTC Thermistor Measurement Support
    10. 6.10 Coulomb Counter (CC)
    11. 6.11 Analog Digital Converter (ADC)
    12. 6.12 Internal Oscillator Specifications
    13. 6.13 Voltage Reference1 (REF1)
    14. 6.14 Voltage Reference2 (REF2)
    15. 6.15 Flash Memory
    16. 6.16 I2C I/O
    17. 6.17 I2C Timing — 100 kHz
    18. 6.18 I2C Timing — 400 kHz
    19. 6.19 HDQ Timing
    20. 6.20 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  BQ27Z561 Processor
      2. 7.3.2  Battery Parameter Measurements
        1. 7.3.2.1 Coulomb Counter (CC)
        2. 7.3.2.2 CC Digital Filter
        3. 7.3.2.3 ADC Multiplexer
        4. 7.3.2.4 Analog-to-Digital Converter (ADC)
        5. 7.3.2.5 Internal Temperature Sensor
        6. 7.3.2.6 External Temperature Sensor Support
      3. 7.3.3  Power Supply Control
      4. 7.3.4  Bus Communication Interface
      5. 7.3.5  Low Frequency Oscillator
      6. 7.3.6  High Frequency Oscillator
      7. 7.3.7  1.8-V Low Dropout Regulator
      8. 7.3.8  Internal Voltage References
      9. 7.3.9  Gas Gauging
      10. 7.3.10 Charge Control Features
      11. 7.3.11 Authentication
    4. 7.4 Device Functional Modes
      1. 7.4.1 Lifetime Logging Features
      2. 7.4.2 Configuration
        1. 7.4.2.1 Coulomb Counting
        2. 7.4.2.2 Cell Voltage Measurements
        3. 7.4.2.3 Auto Calibration
        4. 7.4.2.4 Temperature Measurements
  8. 8 Applications and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Design Requirements (Default)
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Changing Design Parameters
      3. 8.2.3 Calibration Process
      4. 8.2.4 Gauging Data Updates
        1. 8.2.4.1 Application Curve
  9. 9 Power Supply Requirements
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

Over-operating free-air temperature range (unless otherwise noted)
THERMAL METRIC(1) BQ27Z561 UNIT
DSBGA (YPH)
(12 PINS)
RθJA Junction-to-ambient thermal resistance 64.1 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 59.8
RθJB Junction-to-board thermal resistance 52.7
ψJT Junction-to-top characterization parameter 0.3
ψJB Junction-to-board characterization parameter 28.3
RθJC(bot) Junction-to-case (bottom) thermal resistance 2.4
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report (SPRA953).