SLUSFQ0C November   2024  – September 2025 BQ27Z758

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configurations and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
      1. 5.5.1 Supply Current
      2. 5.5.2 Common Analog (LDO, LFO, HFO, REF1, REF2, I-WAKE)
      3. 5.5.3 Battery Protection (CHG, DSG)
      4. 5.5.4 Cell Sensing Output (BAT_SP, BAT_SN)
      5. 5.5.5 Gauge Measurements (ADC, CC, Temperature)
      6. 5.5.6 Flash Memory
    6. 5.6 Digital I/O: DC Characteristics
    7. 5.7 Digital I/O: Timing Characteristics
    8. 5.8 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  BQ27Z758 Processor
      2. 6.3.2  Battery Parameter Measurements
        1. 6.3.2.1 Coulomb Counter (CC) and Digital Filter
        2. 6.3.2.2 ADC Multiplexer
        3. 6.3.2.3 Analog-to-Digital Converter (ADC)
        4. 6.3.2.4 Internal Temperature Sensor
        5. 6.3.2.5 External Temperature Sensor Support
      3. 6.3.3  Power Supply Control
      4. 6.3.4  ENAB Pin
      5. 6.3.5  Bus Communication Interface
      6. 6.3.6  Low Frequency Oscillator
      7. 6.3.7  High Frequency Oscillator
      8. 6.3.8  1.8V Low Dropout Regulator
      9. 6.3.9  Internal Voltage References
      10. 6.3.10 Overcurrent in Discharge Protection
      11. 6.3.11 Overcurrent in Charge Protection
      12. 6.3.12 Short-Circuit Current in Discharge Protection
      13. 6.3.13 Primary Protection Features
      14. 6.3.14 Battery Sensing
      15. 6.3.15 Gas Gauging
      16. 6.3.16 Zero Volt Charging (ZVCHG)
      17. 6.3.17 Charge Control Features
      18. 6.3.18 Authentication
    4. 6.4 Device Functional Modes
      1. 6.4.1 Lifetime Logging Features
      2. 6.4.2 Configuration
        1. 6.4.2.1 Coulomb Counting
        2. 6.4.2.2 Cell Voltage Measurements
        3. 6.4.2.3 Auto Calibration
        4. 6.4.2.4 Temperature Measurements
  8. 7 Applications and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Applications
      1. 7.2.1 Design Requirements (Default)
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Changing Design Parameters
      3. 7.2.3 Calibration Process
      4. 7.2.4 Gauging Data Updates
        1. 7.2.4.1 Application Curve
      5. 7.2.5 ESD Mitigation
    3. 7.3 Power Supply Requirements
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Third-Party Products Disclaimer
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Orderable, and Packaging Information
    1.     PACKAGE OPTION ADDENDUM
    2. 10.1 Tape and Reel Information
    3. 10.2 Mechanical Data

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • YAH|15
Thermal pad, mechanical data (Package|Pins)

4 Pin Configurations and Functions

BQ27Z758 Pinout Diagram Figure 4-1 Pinout Diagram
Table 4-1 Pin Functions
PIN DESCRIPTION
NAME NO. TYPE(1)
CHG A1 AO Charge FET (CHG) driver
DSG A2 AO Discharge FET (DSG) driver. Connect a series 10MΩ typical resistor (RDSG) between DSG pin and PACK+ positive terminal.
PACK A3 AI Pack input voltage sensing pin. Connect a series 5kΩ typical resistor (RPACK) between PACK pin and PACK+ positive terminal.
VDD B1 P LDO regulator input. Connect a 1µF typical capacitor (CVDD) between VDD and VSS. Place the capacitor close to the gauge.
BAT B2 AI Battery voltage measurement sense input
BAT_SP B3 AO Cell sense output, positive
BAT_SN C3 AO Cell sense output, negative
TS C1 AI Thermistor input to ADC with internal 18kΩ pullup resistor
GPO/TS1 C2 I/O General purpose output. Optional TS1 ADC input channel with internal 18kΩ pullup resistor
VSS D1 P Device ground
ENAB D2 I Active low digital input with weak internal pullup to VDD. If enabled for ultra-low power SHELF mode, driving this signal low will enable the device to wake up.
SDA D3 I/O Digital input, open drain output for I2C serial data. Use with a typical 10kΩ pullup resistor.
SCL E3 I/O Digital input, open drain output for I2C serial clock. Use with a typical 10kΩ pullup resistor.
SRP E1 AI This is the positive analog input pin connected to the internal coulomb-counter peripheral for integrating a small voltage between SRP (positive side) and SRN (negative side).
SRN E2 AI This is the negative analog input pin connected to the internal coulomb-counter peripheral for integrating a small voltage between SRP (positive side) and SRN (negative side).
(1) I/O = Digital input/output, AI = Analog input, AO = Analog output, P = Power connection