SLVSIU4
April 2026
BQ27Z846
ADVANCE INFORMATION
1
1
Features
2
Applications
3
Description
4
Pin Configurations and Functions
5
Specifications
5.1
Absolute Maximum Ratings
5.2
ESD Ratings
5.3
Recommended Operating Conditions
5.4
Supply Current
5.5
1.8V LDO Regulator (REG18)
5.6
Low Frequency Oscillator (LFO)
5.7
High Frequency Oscillator (HFO)
5.8
PACK Clamp (PACK_CLAMP)
5.9
Analog-to-Digital Converter (VADC)
5.10
Coulomb Counter (CCADC)
5.11
Coulomb Counter Digital Filter (CC1)
5.12
Current Measurement Digital Filter (CC2)
5.13
Wake-up Comparator (I-WAKE)
5.14
Internal Temperature Sensor (INT_TEMP)
5.15
Thermistor Measurement Support
5.16
Hardware-based Protection (SCOMP) Thresholds (OVP, UVP, OCC, OCD, SCD)
5.17
Hardware-based Protections (SCOMP) Timing (OVP, UVP, OCC, OCD, SCD)
5.18
CHG, DSG NFET Drivers
5.19
Zero-volt Charging (ZVCHG)
5.20
General Purpose Input-Outputs (INT)
5.21
I2C Interface I/O (SDA, SCL)
5.22
I2C Interface Timing
6
Detailed Description
6.1
Overview
6.2
Functional Block Diagram
6.3
Feature Description
6.3.1
BQ27Z855 Processor
6.3.2
Battery Parameter Measurements
6.3.2.1
Analog-to-Digital Converter (VADC)
6.3.2.2
VADC Multiplexer
6.3.2.3
Coulomb Counter (CCADC) and Digital Filter (CC1)
6.3.2.4
Internal Temperature Sensor (INT_TEMP)
6.3.2.5
External Temperature Sensor Support
6.3.3
Power Supply Control
6.3.4
ENAB Pin
6.3.5
I2C Bus Communication Interface
6.3.6
Low Frequency Oscillator (LFO)
6.3.7
High Frequency Oscillator (HFO)
6.3.8
Real Time Clock (RTC)
6.3.9
1.8V Low Dropout Regulator (REG18)
6.3.10
FET Drivers (CHG, DSG)
6.3.10.1
Charge (CHG) FET Driver
6.3.10.2
Discharge (DSG) FET Driver
6.3.11
Zero-volt Charging (ZVCHG)
6.3.12
Integrated Protections
6.3.12.1
Hardware-based Protections
6.3.12.1.1
Overvoltage Protection (OVP)
6.3.12.1.2
Undervoltage Protection (UVP)
6.3.12.1.3
Overcurrent in Charge Protection (OCC)
6.3.12.1.4
Overcurrent in Discharge Protection (OCD)
6.3.12.1.5
Short Circuit Current in Discharge Protection (SCD)
6.3.12.1.6
Wake-up Comparator (I-WAKE)
6.3.12.2
Firmware-based Protections
6.3.12.2.1
Primary Level Protection Features
6.3.12.2.2
Permanent Failure Protection Features
6.3.13
Gas Gauging
6.3.14
Advanced Battery Algorithms
6.3.14.1
Si-anode Chemistry Support
6.3.14.2
Internal Short Indication (ISI)
6.3.14.3
Battery Swelling Detection (BSD)
6.3.15
Charge Control Features
6.3.16
Lifetime Data Logging Features
6.3.17
Authentication
6.3.17.1
ECC ECDSA Authentication
6.3.17.2
SHA-256 Authentication
6.3.18
Over the Air (OTA) Field Updater
6.3.19
Configuration
6.3.19.1
Cell Voltage Measurements
6.3.19.2
Coulomb Counting
6.3.19.3
Temperature Measurements
6.4
Device Functional Modes
7
Application and Implementation
7.1
Application Information
7.2
Typical Application Schematics
7.2.1
Design Requirements
7.2.2
Detailed Design Procedure
7.2.2.1
High-Current Path
7.2.2.1.1
Protection FETs
7.2.2.1.2
Battery Cell Connections
7.2.2.1.3
Sense Resistor
7.2.2.1.4
ESD Mitigation
7.2.2.2
Gas Gauge Circuit
7.2.2.2.1
Cell Voltage Measurement Interface
7.2.2.2.2
Coulomb Counter Interface
7.2.2.2.3
Temperature Measurement
7.2.2.2.4
1.8V Low Dropout Regulator (REG18)
7.2.2.2.5
I2C Communication (SDA, SCL)
7.2.2.2.6
Interrupt to Host Interface (INT)
7.2.2.3
Co-design with BQ27Z746 and BQ27Z758
7.2.2.3.1
Footprint Compatibility and Equivalent Pins
7.2.2.3.2
Co-layout Example
7.3
Power Supply Recommendations
8
Layout
8.1
Layout Guidelines
9
Device and Documentation Support
9.1
Third-Party Products Disclaimer
9.2
Documentation Support
9.2.1
Related Documentation
9.3
Trademarks
9.4
Electrostatic Discharge Caution
9.5
Glossary
10
Revision History
11
Mechanical, Packaging, and Orderable Information
PACKAGE OPTION ADDENDUM
11.1
Tape and Reel Information
11.2
Mechanical Data
Package Options
Mechanical Data (Package|Pins)
YAH|15
MXBG425
Thermal pad, mechanical data (Package|Pins)
Data Sheet
BQ27Z846
Dynamic Z-Track™ Gauge with Integrated Protection and Authentication for 1 Cell Battery Packs