SLUSCS3J October   2017  – December 2022 BQ2980 , BQ2982

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
      1. 8.1.1 Device Configurability
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Overvoltage (OV) Status
      2. 8.3.2 Undervoltage (UV) Status
      3. 8.3.3 Overcurrent in Charge (OCC) Status
      4. 8.3.4 Overcurrent in Discharge (OCD) and Short Circuit in Discharge (SCD) Status
      5. 8.3.5 Overtemperature (OT) Status
      6. 8.3.6 Charge and Discharge Driver
      7. 8.3.7 CTR for FET Override and Device Shutdown
      8. 8.3.8 CTR for PTC Connection
      9. 8.3.9 ZVCHG (0-V Charging)
    4. 8.4 Device Functional Modes
      1. 8.4.1 Power Modes
        1. 8.4.1.1 Power-On-Reset (POR)
        2. 8.4.1.2 NORMAL Mode
        3. 8.4.1.3 FAULT Mode
        4. 8.4.1.4 SHUTDOWN Mode
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Test Circuits for Device Evaluation
      2. 9.1.2 Test Circuit Diagrams
      3. 9.1.3 Using CTR as FET Driver On/Off Control
    2. 9.2 Typical Applications
      1. 9.2.1 BQ298x Configuration 1: System-Controlled Reset/Shutdown Function
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Selection of Power FET
        4. 9.2.1.4 Application Curves
      2. 9.2.2 BQ298x Configuration 2: CTR Function Disabled
      3. 9.2.3 BQ298x Configuration 3: PTC Thermistor Protection
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Third-Party Products Disclaimer
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12.5 Electrostatic Discharge Caution

GUID-D6F43A01-4379-4BA1-8019-E75693455CED-low.gif This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.