SLUSCS3J October   2017  – December 2022 BQ2980 , BQ2982

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
      1. 8.1.1 Device Configurability
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Overvoltage (OV) Status
      2. 8.3.2 Undervoltage (UV) Status
      3. 8.3.3 Overcurrent in Charge (OCC) Status
      4. 8.3.4 Overcurrent in Discharge (OCD) and Short Circuit in Discharge (SCD) Status
      5. 8.3.5 Overtemperature (OT) Status
      6. 8.3.6 Charge and Discharge Driver
      7. 8.3.7 CTR for FET Override and Device Shutdown
      8. 8.3.8 CTR for PTC Connection
      9. 8.3.9 ZVCHG (0-V Charging)
    4. 8.4 Device Functional Modes
      1. 8.4.1 Power Modes
        1. 8.4.1.1 Power-On-Reset (POR)
        2. 8.4.1.2 NORMAL Mode
        3. 8.4.1.3 FAULT Mode
        4. 8.4.1.4 SHUTDOWN Mode
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Test Circuits for Device Evaluation
      2. 9.1.2 Test Circuit Diagrams
      3. 9.1.3 Using CTR as FET Driver On/Off Control
    2. 9.2 Typical Applications
      1. 9.2.1 BQ298x Configuration 1: System-Controlled Reset/Shutdown Function
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Selection of Power FET
        4. 9.2.1.4 Application Curves
      2. 9.2.2 BQ298x Configuration 2: CTR Function Disabled
      3. 9.2.3 BQ298x Configuration 3: PTC Thermistor Protection
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Third-Party Products Disclaimer
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.4 Thermal Information

THERMAL METRIC(1)BQ2980xy/BQ2982xyUNIT
RUG (X2QFN)
8 PINS
RθJAJunction-to-ambient thermal resistance171.8°C/W
RθJC(top)Junction-to-case (top) thermal resistance75°C/W
RθJBJunction-to-board thermal resistance94.7°C/W
ψJTJunction-to-top characterization parameter2.5°C/W
ψJBJunction-to-board characterization parameter94.9°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.