SBOS948F February   2019  – May 2021 BUF634A

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics: Wide-Bandwidth Mode
    6. 7.6 Electrical Characteristics: Low-Quiescent Current Mode
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Output Current
      2. 8.3.2 Thermal Shutdown
      3. 8.3.3 ESD Protection
    4. 8.4 Device Functional Modes
      1. 8.4.1 Adjustable Bandwidth
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 High-Frequency Applications
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
    1. 10.1 Power Dissipation and Thermal Considerations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 SOIC Layout Guidelines (D Package Without a Thermal Pad)
      2. 11.1.2 HSOIC Layout Guidelines (DDA Package With a Thermal Pad)
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
      2. 12.1.2 Development Support
        1. 12.1.2.1 TINA-TI (Free Software Download)
        2. 12.1.2.2 TI Precision Designs
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Support Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
  • DDA|8
  • DRB|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from Revision E (December 2020) to Revision F (May 2021)

  • Replaced the THD+N vs Frequency Using the BUF634A with the OPA2810 (VO = 10 VPP, 90-kHz Measurement Bandwidth) figure with the Thermal Performance vs Cu Area for the DDA Package figureGo

Changes from Revision D (September 2020) to Revision E (December 2020)

  • Deleted preview statement for BUF634A VSON packageGo
  • Deleted preview statement for the DRB packageGo

Changes from Revision C (June 2020) to Revision D (September 2020)

  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo
  • Added DRB package outline to Mechanical, Packaging, and Orderable Information sectionGo

Changes from Revision B (January 2020) to Revision C (June 2020)

  • Deleted preview statement for BUF634A HSOIC packageGo
  • Deleted preview statement for the D and DDA packagesGo

Changes from Revision A (May 2019) to Revision B (January 2020)

  • Added DRB (VSON) and DDA (HSOIC) packages to documentGo
  • Changed Applications sectionGo
  • Changed last paragraph of Description section Go
  • Added discussion of VIN pin to ESD Protection sectionGo
  • Added Power Dissipation and Thermal Considerations sectionGo
  • Added HSOIC Layout Guidelines (DDA Package With a Thermal Pad) sectionGo
  • Changed title of BUF634A Layout Example imageGo

Changes from Revision * (February 2019) to Revision A (May 2019)

  • Changed document status from Advance Information to Production Data Go