SBOS948F February   2019  – May 2021 BUF634A

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics: Wide-Bandwidth Mode
    6. 7.6 Electrical Characteristics: Low-Quiescent Current Mode
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Output Current
      2. 8.3.2 Thermal Shutdown
      3. 8.3.3 ESD Protection
    4. 8.4 Device Functional Modes
      1. 8.4.1 Adjustable Bandwidth
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 High-Frequency Applications
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
    1. 10.1 Power Dissipation and Thermal Considerations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 SOIC Layout Guidelines (D Package Without a Thermal Pad)
      2. 11.1.2 HSOIC Layout Guidelines (DDA Package With a Thermal Pad)
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
      2. 12.1.2 Development Support
        1. 12.1.2.1 TINA-TI (Free Software Download)
        2. 12.1.2.2 TI Precision Designs
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Support Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
  • DDA|8
  • DRB|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.5 Electrical Characteristics: Wide-Bandwidth Mode

at TA = 25°C, VS = ±15 V, BW pin connected to V–, and RL = 100 Ω connected to mid-supply (unless otherwise noted).
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
AC PERFORMANCE
BW Bandwidth, –3 dB RL = 1 kΩ 210 MHz
RL = 100 Ω 200
Bandwidth for 0.1-dB flatness VO = 10 mVPP, RL = 100 Ω, RS = 50 Ω 50 MHz
SR Slew rate VO = 20-V step, VIN-SR = 4000 V/µs 3750 V/µs
Rise and fall time VO = 200-mV step 1.3 ns
Settling time to 0.1% VO = 20-V step, VIN-SR = 2500 V/µs 90 ns
Settling time to 1% VO = 20-V step, VIN-SR = 2500 V/µs 20 ns
en Voltage noise f = 1 kHz 3.4 nV/√Hz
in Current noise f = 100 kHz 0.85 pA/√Hz
HD2 2nd-harmonic distortion VO = 2 VPP, f = 20 kHz –77 dBc
VO = 10 VPP, f = 20 kHz –69
HD3 3rd-harmonic distortion VO = 2 VPP, f = 20 kHz –77 dBc
VO = 10 VPP, f = 20 kHz –56
DC PERFORMANCE
VOS Input offset voltage TA = 25℃ 36 65 mV
Input offset voltage drift(1) TA = –40℃ to 125℃ 175 µV/℃
IB Input bias current VIN = 0 V 0.25 2 µA
G Gain VO = ±10 V, RL = 1 kΩ 0.95 0.99 V/V
VO = ±10 V, RL = 100 Ω 0.93 0.95
VO = ±10 V, RL = 67 Ω 0.91 0.93
INPUT
Linear input voltage range RL = 1 kΩ, IB < 10 µA –13 13 V
ZIN Input impedance RL = 100 Ω 180 || 5 MΩ || pF
OUTPUT
Output headroom to supplies IO = ±10 mA 1.6 1.8 V
IO = ±100 mA 2.0 2.2
IO = ±150 mA 2.2 2.5
IO Current output, continuous ±250 mA
ISC Short-circuit current ±375 ±550 mA
ZO Output impedance DC, IO = 10 mA 5 Ω
POWER SUPPLY
VS Operating voltage range ±2.25 ±18 V
IQ Quiescent current IO = 0 mA 8.5 12 mA
PSRR Power-supply rejection ratio VS = ±2.25 V to ±18 V 64 75 dB
THERMAL SHUTDOWN
Thermal shutdown temperature 180 ℃
(1) Based on electrical characterization over temperature of 35 devices.