SWRS181D September   2015  – July 2018 CC1310

PRODUCTION DATA.  

  1. 1Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
  2. 2Revision History
  3. 3Device Comparison
    1. 3.1 Related Products
  4. 4Terminal Configuration and Functions
    1. 4.1 Pin Diagram – RSM Package
    2. 4.2 Signal Descriptions – RSM Package
    3. 4.3 Pin Diagram – RHB Package
    4. 4.4 Signal Descriptions – RHB Package
    5. 4.5 Pin Diagram – RGZ Package
    6. 4.6 Signal Descriptions – RGZ Package
  5. 5Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Power Consumption Summary
    5. 5.5  RF Characteristics
    6. 5.6  Receive (RX) Parameters, 861 MHz to 1054 MHz
    7. 5.7  Receive (RX) Parameters, 431 MHz to 527 MHz
    8. 5.8  Transmit (TX) Parameters, 861 MHz to 1054 MHz
    9. 5.9  Transmit (TX) Parameters, 431 MHz to 527 MHz
    10. 5.10 PLL Parameters
    11. 5.11 ADC Characteristics
    12. 5.12 Temperature Sensor
    13. 5.13 Battery Monitor
    14. 5.14 Continuous Time Comparator
    15. 5.15 Low-Power Clocked Comparator
    16. 5.16 Programmable Current Source
    17. 5.17 DC Characteristics
    18. 5.18 Thermal Characteristics
    19. 5.19 Timing and Switching Characteristics
      1. 5.19.1 Reset Timing
        1. Table 5-1 Reset Timing
      2. 5.19.2 Wakeup Timing
        1. Table 5-2 Wakeup Timing
      3. 5.19.3 Clock Specifications
        1. Table 5-3 24-MHz Crystal Oscillator (XOSC_HF)
        2. Table 5-4 32.768-kHz Crystal Oscillator (XOSC_LF)
        3. Table 5-5 48-MHz RC Oscillator (RCOSC_HF)
        4. Table 5-6 32-kHz RC Oscillator (RCOSC_LF)
      4. 5.19.4 Flash Memory Characteristics
        1. Table 5-7 Flash Memory Characteristics
      5. 5.19.5 Synchronous Serial Interface (SSI) Characteristics
        1. Table 5-8 Synchronous Serial Interface (SSI) Characteristics
    20. 5.20 Typical Characteristics
  6. 6Detailed Description
    1. 6.1  Overview
    2. 6.2  Main CPU
    3. 6.3  RF Core
    4. 6.4  Sensor Controller
    5. 6.5  Memory
    6. 6.6  Debug
    7. 6.7  Power Management
    8. 6.8  Clock Systems
    9. 6.9  General Peripherals and Modules
    10. 6.10 Voltage Supply Domains
    11. 6.11 System Architecture
  7. 7Application, Implementation, and Layout
    1. 7.1 Application Information
    2. 7.2 TI Design or Reference Design
  8. 8Device and Documentation Support
    1. 8.1  Device Nomenclature
    2. 8.2  Tools and Software
    3. 8.3  Documentation Support
    4. 8.4  Texas Instruments Low-Power RF Website
    5. 8.5  Additional Information
    6. 8.6  Community Resources
    7. 8.7  Trademarks
    8. 8.8  Electrostatic Discharge Caution
    9. 8.9  Export Control Notice
    10. 8.10 Glossary
  9. 9Mechanical, Packaging, and Orderable Information
    1. 9.1 Packaging Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1.1 Features

  • Microcontroller
    • Powerful Arm®Cortex®-M3 Processor
    • EEMBC CoreMark® Score: 142
    • EEMBC ULPBench™ Score: 158
    • Clock Speed up to 48-MHz
    • 32KB, 64KB, and 128KB of In-System Programmable Flash
    • 8KB of SRAM for Cache
      (or as General-Purpose RAM)
    • 20KB of Ultra-Low-Leakage SRAM
    • 2-Pin cJTAG and JTAG Debugging
    • Supports Over-the-Air (OTA) Update
  • Ultra-Low-Power Sensor Controller
    • Can Run Autonomously From the Rest of the System
    • 16-Bit Architecture
    • 2KB of Ultra-Low-Leakage SRAM for Code and Data
  • Efficient Code-Size Architecture, Placing Parts of
    TI-RTOS, Drivers, and Bootloader in ROM
  • RoHS-Compliant Package
    • 7-mm × 7-mm RGZ VQFN48 (30 GPIOs)
    • 5-mm × 5-mm RHB VQFN32 (15 GPIOs)
    • 4-mm × 4-mm RSM VQFN32 (10 GPIOs)
  • Peripherals
    • All Digital Peripheral Pins Can Be Routed to Any GPIO
    • Four General-Purpose Timer Modules
      (Eight 16-Bit or Four 32-Bit Timers, PWM Each)
    • 12-Bit ADC, 200 ksamples/s, 8-Channel Analog MUX
    • Continuous Time Comparator
    • Ultra-Low-Power Clocked Comparator
    • Programmable Current Source
    • UART
    • 2× SSI (SPI, MICROWIRE, TI)
    • I2C, I2S
    • Real-Time Clock (RTC)
    • AES-128 Security Module
    • True Random Number Generator (TRNG)
    • Support for Eight Capacitive Sensing Buttons
    • Integrated Temperature Sensor

    • SPACER

    SPACER

    SPACER

    SPACER

  • External System
    • On-Chip Internal DC/DC Converter
    • Seamless Integration With the SimpleLink™ CC1190 Range Extender
  • Low Power
    • Wide Supply Voltage Range: 1.8 to 3.8 V
    • RX: 5.4 mA
    • TX at +10 dBm: 13.4 mA
    • Active-Mode MCU 48 MHz Running Coremark: 2.5 mA (51 µA/MHz)
    • Active-Mode MCU: 48.5 CoreMark/mA
    • Active-Mode Sensor Controller at 24 MHz:
      0.4 mA + 8.2 µA/MHz
    • Sensor Controller, One Wakeup Every Second Performing One 12-Bit ADC Sampling: 0.95 µA
    • Standby: 0.7 µA (RTC Running and RAM and CPU Retention)
    • Shutdown: 185 nA (Wakeup on External Events)
  • RF Section
    • Excellent Receiver Sensitivity –124 dBm Using Long-Range Mode, –110 dBm at 50 kbps
    • Excellent Selectivity (±100 kHz): 56 dB
    • Excellent Blocking Performance (±10 MHz):
      90 dB
    • Programmable Output Power up to +15 dBm
    • Single-Ended or Differential RF Interface
    • Suitable for Systems Targeting Compliance With Worldwide Radio Frequency Regulations
      • ETSI EN 300 220, EN 303 204 (Europe)
      • FCC CFR47 Part 15 (US)
      • ARIB STD-T108 (Japan)
    • Wireless M-Bus (EN 13757-4) and IEEE® 802.15.4g PHY
  • Tools and Development Environment
    • Full-Feature and Low-Cost Development Kits
    • Multiple Reference Designs for Different RF Configurations
    • Packet Sniffer PC Software
    • Sensor Controller Studio
    • SmartRF™ Studio
    • SmartRF Flash Programmer 2
    • IAR Embedded Workbench® for Arm
    • Code Composer Studio™ (CCS) IDE
    • CCS UniFlash