SWRS201C January   2017  – March 2025 CC2640R2F-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Functional Block Diagram
  6. 5 Device Comparison
    1. 5.1 Related Products
  7. 6 Pin Configuration and Functions
    1. 6.1 Pin Diagram—RGZ Package
    2. 6.2 Signal Descriptions—RGZ Package
    3. 6.3 Wettable Flanks
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Power Consumption Summary
    5. 7.5  General Characteristics
    6. 7.6  1Mbps GFSK (Bluetooth Low Energy Technology)—RX
    7. 7.7  1Mbps GFSK (Bluetooth Low Energy Technology)—TX
    8. 7.8  24MHz Crystal Oscillator (XOSC_HF)
    9. 7.9  32.768kHz Crystal Oscillator (XOSC_LF)
    10. 7.10 48MHz RC Oscillator (RCOSC_HF)
    11. 7.11 32kHz RC Oscillator (RCOSC_LF)
    12. 7.12 ADC Characteristics
    13. 7.13 Temperature Sensor
    14. 7.14 Battery Monitor
    15. 7.15 Continuous Time Comparator
    16. 7.16 Low-Power Clocked Comparator
    17. 7.17 Programmable Current Source
    18. 7.18 Synchronous Serial Interface (SSI)
    19. 7.19 DC Characteristics
    20. 7.20 Thermal Resistance Characteristics for RGZ Package
    21. 7.21 Timing Requirements
    22. 7.22 Switching Characteristics
    23. 7.23 Typical Characteristics
  9. 8 Detailed Description
    1. 8.1  Overview
    2. 8.2  Main CPU
    3. 8.3  RF Core
    4. 8.4  Sensor Controller
    5. 8.5  Memory
    6. 8.6  Debug
    7. 8.7  Power Management
    8. 8.8  Clock Systems
    9. 8.9  General Peripherals and Modules
    10. 8.10 System Architecture
  10. 9 Application, Implementation, and Layout
    1. 9.1 Application Information
    2. 9.2 7 × 7 Internal Differential (7ID) Application Circuit
      1. 9.2.1 Layout
  11. 10Device and Documentation Support
    1. 10.1 Device Nomenclature
    2. 10.2 Tools and Software
    3. 10.3 Documentation Support
    4. 10.4 Texas Instruments Low-Power RF Website
    5. 10.5 Support Resources
    6. 10.6 Trademarks
    7. 10.7 Electrostatic Discharge Caution
    8. 10.8 Export Control Notice
    9. 10.9 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Packaging Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RGZ|48
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • Qualified for automotive applications
  • AEC-Q100 qualified with the following results:
    • Device temperature grade 2: –40°C to +105°C ambient operating temperature range
    • Device HBM ESD Classification Level 2
    • Device CDM ESD Classification Level C3
  • Microcontroller
    • Powerful Arm®Cortex®-M3
    • EEMBC CoreMark® Score: 142
    • Up to 48MHz clock speed
    • 275KB nonvolatile memory, including 128KB in-system Programmable Flash
    • Up to 28KB system SRAM, of which 20KB is ultra-low leakage SRAM
    • 8KB SRAM for Cache or system RAM use
    • 2-pin cJTAG and JTAG debugging
    • Supports Over-the-Air (OTA) upgrade
  • Ultra-low power sensor controller
    • Can run autonomously from the rest of the system
    • 16-bit architecture
    • 2-KB ultra-low leakage SRAM for code and data
  • Efficient code size architecture, placing drivers, Bluetooth Low Energy® Controller, and bootloader in ROM to make more flash available for the application
  • RoHS-compliant automotive grade package
    • 7mm × 7mm RGZ VQFN48 with wettable flanks>
  • Peripherals
    • 31 GPIOs, all digital peripheral pins can be routed to any GPIO
    • Four general-purpose timer modules
      (eight 16-bit or four 32-bit timers, PWM each)
    • 12-bit ADC, 200-ksamples/s, 8-channel analog MUX
    • Continuous time comparator
    • Ultra-low power analog comparator
    • Programmable current source
    • UART
    • 2× SSI (SPI, MICROWIRE, TI)
    • I2C, I2S
    • Real-time clock (RTC)
    • AES-128 security module
    • True random number generator (TRNG)
    • Support for eight capacitive-sensing buttons
    • Integrated temperature sensor
  • External system
    • On-chip internal DC/DC converter
    • Very few external components
    • Seamless integration with the SimpleLink™ CC2590 and CC2592 range extenders
  • Low power
    • Wide supply voltage range: 1.8V to 3.8V
    • Active mode RX: 6.1mA
    • Active mode TX at 0dBm: 7.0mA
    • Active mode TX at +5dBm: 9.3mA
    • Active mode MCU: 61µA/MHz
    • Active mode MCU: 48.5 CoreMark/mA
    • Active mode sensor controller:
      0.4mA + 8.2µA/MHz
    • Standby: 1.3µA (RTC running and RAM/CPU retention)
    • Shutdown: 150nA (wake up on external events)
  • RF section
    • 2.4GHz RF transceiver compatible with Bluetooth Low Energy (BLE) 4.2 and 5 specifications
    • Excellent receiver sensitivity (–97dBm for Bluetooth Low Energy 1Mbps), selectivity, and blocking performance
    • Programmable output power up to +5dBm
    • Link budget of 102dB for Bluetooth Low Energy 1Mbps
    • Suitable for systems targeting compliance with worldwide radio frequency regulations
      • ETSI EN 300 328 and EN 300 440 (Europe)
      • FCC CFR47 Part 15 (US)
      • ARIB STD-T66 (Japan)
  • Development Tools and Software