SWRS204B December   2016  – January 2020 CC2640R2F

PRODUCTION DATA.  

  1. 1Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4.     Device Images
      1. 1.3.1 Functional Block Diagram
  2. 2Revision History
  3. 3Device Comparison
    1. 3.1 Related Products
  4. 4Terminal Configuration and Functions
    1. 4.1 Pin Diagram – RGZ Package
    2. 4.2 Signal Descriptions – RGZ Package
    3. 4.3 Pin Diagram – RHB Package
    4. 4.4 Signal Descriptions – RHB Package
    5. 4.5 Pin Diagram – YFV (Chip Scale, DSBGA) Package
    6. 4.6 Signal Descriptions – YFV (Chip Scale, DSBGA) Package
    7. 4.7 Pin Diagram – RSM Package
    8. 4.8 Signal Descriptions – RSM Package
  5. 5Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Power Consumption Summary
    5. 5.5  General Characteristics
    6. 5.6  125-kbps Coded (Bluetooth 5) – RX
    7. 5.7  125-kbps Coded (Bluetooth 5) – TX
    8. 5.8  500-kbps Coded (Bluetooth 5) – RX
    9. 5.9  500-kbps Coded (Bluetooth 5) – TX
    10. 5.10 1-Mbps GFSK (Bluetooth low energy) – RX
    11. 5.11 1-Mbps GFSK (Bluetooth low energy) – TX
    12. 5.12 2-Mbps GFSK (Bluetooth 5) – RX
    13. 5.13 2-Mbps GFSK (Bluetooth 5) – TX
    14. 5.14 24-MHz Crystal Oscillator (XOSC_HF)
    15. 5.15 32.768-kHz Crystal Oscillator (XOSC_LF)
    16. 5.16 48-MHz RC Oscillator (RCOSC_HF)
    17. 5.17 32-kHz RC Oscillator (RCOSC_LF)
    18. 5.18 ADC Characteristics
    19. 5.19 Temperature Sensor
    20. 5.20 Battery Monitor
    21. 5.21 Continuous Time Comparator
    22. 5.22 Low-Power Clocked Comparator
    23. 5.23 Programmable Current Source
    24. 5.24 Synchronous Serial Interface (SSI)
    25. 5.25 DC Characteristics
    26. 5.26 Thermal Resistance Characteristics
    27. 5.27 Timing Requirements
    28. 5.28 Switching Characteristics
    29. 5.29 Typical Characteristics
  6. 6Detailed Description
    1. 6.1  Overview
    2. 6.2  Functional Block Diagram
    3. 6.3  Main CPU
    4. 6.4  RF Core
    5. 6.5  Sensor Controller
    6. 6.6  Memory
    7. 6.7  Debug
    8. 6.8  Power Management
    9. 6.9  Clock Systems
    10. 6.10 General Peripherals and Modules
    11. 6.11 Voltage Supply Domains
    12. 6.12 System Architecture
  7. 7Application, Implementation, and Layout
    1. 7.1 Application Information
    2. 7.2 5 × 5 External Differential (5XD) Application Circuit
      1. 7.2.1 Layout
    3. 7.3 4 × 4 External Single-ended (4XS) Application Circuit
      1. 7.3.1 Layout
  8. 8Device and Documentation Support
    1. 8.1  Device Nomenclature
    2. 8.2  Tools and Software
    3. 8.3  Documentation Support
    4. 8.4  Texas Instruments Low-Power RF Website
    5. 8.5  Low-Power RF eNewsletter
    6. 8.6  Support Resources
    7. 8.7  Trademarks
    8. 8.8  Electrostatic Discharge Caution
    9. 8.9  Export Control Notice
    10. 8.10 Glossary
  9. 9Mechanical, Packaging, and Orderable Information
    1. 9.1 Packaging Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RSM|32
  • RGZ|48
  • RHB|32
  • YFV|34
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Device Overview