SWAS034A February   2017  – May 2021 CC3120

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Functional Block Diagrams
  5. 5 Revision History
  6. 6 Device Comparison
    1. 6.1 Related Products
  7. 7 Terminal Configuration and Functions
    1. 7.1 Pin Diagram
    2. 7.2 Pin Attributes
    3. 7.3 Connections for Unused Pins
  8. 8 Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Power-On Hours (POH)
    4. 8.4  Recommended Operating Conditions
    5. 8.5  Current Consumption Summary
    6. 8.6  TX Power and IBAT versus TX Power Level Settings
    7. 8.7  Brownout and Blackout Conditions
    8. 8.8  Electrical Characteristics (3.3 V, 25°C)
    9. 8.9  WLAN Receiver Characteristics
    10. 8.10 WLAN Transmitter Characteristics
    11. 8.11 WLAN Filter Requirements
      1. 8.11.1 WLAN Filter Requirements
    12. 8.12 Thermal Resistance Characteristics
      1. 8.12.1 Thermal Resistance Characteristics for RGK Package
    13. 8.13 Reset Requirement
    14. 8.14 Timing and Switching Characteristics
      1. 8.14.1 Power Supply Sequencing
      2. 8.14.2 Device Reset
      3. 8.14.3 Reset Timing
        1. 8.14.3.1 nRESET (32-kHz Crystal)
        2. 8.14.3.2 First-Time Power-Up and Reset Removal Timing Requirements (32-kHz Crystal)
        3. 8.14.3.3 nRESET (External 32-kHz)
          1. 8.14.3.3.1 First-Time Power-Up and Reset Removal Timing Requirements (External 32-kHz)
      4. 8.14.4 Wakeup From HIBERNATE Mode
        1. 8.14.4.1 nHIB Timing Requirements
      5. 8.14.5 Clock Specifications
        1. 8.14.5.1 Slow Clock Using Internal Oscillator
          1. 8.14.5.1.1 RTC Crystal Requirements
        2. 8.14.5.2 Slow Clock Using an External Clock
          1. 8.14.5.2.1 External RTC Digital Clock Requirements
        3. 8.14.5.3 Fast Clock (Fref) Using an External Crystal
          1. 8.14.5.3.1 WLAN Fast-Clock Crystal Requirements
        4. 8.14.5.4 Fast Clock (Fref) Using an External Oscillator
          1. 8.14.5.4.1 External Fref Clock Requirements (–40°C to +85°C)
      6. 8.14.6 Interfaces
        1. 8.14.6.1 Host SPI Interface Timing
          1. 8.14.6.1.1 Host SPI Interface Timing Parameters
        2. 8.14.6.2 Flash SPI Interface Timing
          1. 8.14.6.2.1 Flash SPI Interface Timing Parameters
    15. 8.15 External Interfaces
      1. 8.15.1 SPI Flash Interface
        1. 8.15.1.1 SPI Flash Interface
      2. 8.15.2 SPI Host Interface
        1. 8.15.2.1 SPI Host Interface
      3. 8.15.3 Host UART Interface
        1. 8.15.3.1 SimpleLink™ UART Configuration
        2. 8.15.3.2 5-Wire UART Topology
        3. 8.15.3.3 4-Wire UART Topology
        4. 8.15.3.4 3-Wire UART Topology
  9. 9 Detailed Description
    1. 9.1 Device Features
      1. 9.1.1 WLAN
      2. 9.1.2 Network Stack
      3. 9.1.3 Security
      4. 9.1.4 Host Interface and Driver
      5. 9.1.5 System
    2. 9.2 Power-Management Subsystem
      1. 9.2.1 VBAT Wide-Voltage Connection
      2. 9.2.2 Preregulated 1.85V
    3. 9.3 Low-Power Operating Modes
      1. 9.3.1 Low-Power Deep Sleep
      2. 9.3.2 Hibernate
      3. 9.3.3 Shutdown
    4. 9.4 Memory
      1. 9.4.1 External Memory Requirements
    5. 9.5 Restoring Factory Default Configuration
  10. 10Applications, Implementation, and Layout
    1. 10.1 Application Information
      1. 10.1.1 Typical Application—CC3120R Wide-Voltage Mode
      2. 10.1.2 Typical Application Schematic—CC3120R Preregulated, 1.85-V Mode
    2. 10.2 PCB Layout Guidelines
      1. 10.2.1 General PCB Guidelines
      2. 10.2.2 Power Layout and Routing
        1. 10.2.2.1 Design Considerations
      3. 10.2.3 Clock Interfaces
      4. 10.2.4 Digital Input and Output
      5. 10.2.5 RF Interface
  11. 11Device and Documentation Support
    1. 11.1 Development Tools and Software
    2. 11.2 Firmware Updates
    3. 11.3 Device Nomenclature
    4. 11.4 Documentation Support
    5. 11.5 Support Resources
    6. 11.6 Trademarks
    7. 11.7 Electrostatic Discharge Caution
    8. 11.8 Export Control Notice
    9. 11.9 Glossary
  12. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Packaging Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10.2.5 RF Interface

The following guidelines are for the RF interface. Follow guidelines specified in the vendor-specific antenna design guides (including placement of the antenna). Also see CC3120 and CC3220 SimpleLink™ Wi-Fi® and IoT Solution Layout Guidelines for general antenna guidelines.

  • Ensure that the antenna is matched for 50-Ω. TI recommends using a Pi-matching network.
  • Ensure that the area underneath the BPF pads is grounded on layer one and layer two, and ensure that the minimum filter requirements are met.
  • Verify that the Wi-Fi RF trace is a 50-Ω, impedance-controlled trace with a reference to solid ground.
  • The RF trace bends must be made with gradual curves. Avoid using 90-degree bends.
  • The RF traces must not have sharp corners.
  • Do not place traces or ground under the antenna section.
  • The RF traces must have via stitching on the ground plane beside the RF trace on both sides.