SWAS034A February   2017  – May 2021 CC3120

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Functional Block Diagrams
  5. 5 Revision History
  6. 6 Device Comparison
    1. 6.1 Related Products
  7. 7 Terminal Configuration and Functions
    1. 7.1 Pin Diagram
    2. 7.2 Pin Attributes
    3. 7.3 Connections for Unused Pins
  8. 8 Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Power-On Hours (POH)
    4. 8.4  Recommended Operating Conditions
    5. 8.5  Current Consumption Summary
    6. 8.6  TX Power and IBAT versus TX Power Level Settings
    7. 8.7  Brownout and Blackout Conditions
    8. 8.8  Electrical Characteristics (3.3 V, 25°C)
    9. 8.9  WLAN Receiver Characteristics
    10. 8.10 WLAN Transmitter Characteristics
    11. 8.11 WLAN Filter Requirements
      1. 8.11.1 WLAN Filter Requirements
    12. 8.12 Thermal Resistance Characteristics
      1. 8.12.1 Thermal Resistance Characteristics for RGK Package
    13. 8.13 Reset Requirement
    14. 8.14 Timing and Switching Characteristics
      1. 8.14.1 Power Supply Sequencing
      2. 8.14.2 Device Reset
      3. 8.14.3 Reset Timing
        1. 8.14.3.1 nRESET (32-kHz Crystal)
        2. 8.14.3.2 First-Time Power-Up and Reset Removal Timing Requirements (32-kHz Crystal)
        3. 8.14.3.3 nRESET (External 32-kHz)
          1. 8.14.3.3.1 First-Time Power-Up and Reset Removal Timing Requirements (External 32-kHz)
      4. 8.14.4 Wakeup From HIBERNATE Mode
        1. 8.14.4.1 nHIB Timing Requirements
      5. 8.14.5 Clock Specifications
        1. 8.14.5.1 Slow Clock Using Internal Oscillator
          1. 8.14.5.1.1 RTC Crystal Requirements
        2. 8.14.5.2 Slow Clock Using an External Clock
          1. 8.14.5.2.1 External RTC Digital Clock Requirements
        3. 8.14.5.3 Fast Clock (Fref) Using an External Crystal
          1. 8.14.5.3.1 WLAN Fast-Clock Crystal Requirements
        4. 8.14.5.4 Fast Clock (Fref) Using an External Oscillator
          1. 8.14.5.4.1 External Fref Clock Requirements (–40°C to +85°C)
      6. 8.14.6 Interfaces
        1. 8.14.6.1 Host SPI Interface Timing
          1. 8.14.6.1.1 Host SPI Interface Timing Parameters
        2. 8.14.6.2 Flash SPI Interface Timing
          1. 8.14.6.2.1 Flash SPI Interface Timing Parameters
    15. 8.15 External Interfaces
      1. 8.15.1 SPI Flash Interface
        1. 8.15.1.1 SPI Flash Interface
      2. 8.15.2 SPI Host Interface
        1. 8.15.2.1 SPI Host Interface
      3. 8.15.3 Host UART Interface
        1. 8.15.3.1 SimpleLink™ UART Configuration
        2. 8.15.3.2 5-Wire UART Topology
        3. 8.15.3.3 4-Wire UART Topology
        4. 8.15.3.4 3-Wire UART Topology
  9. 9 Detailed Description
    1. 9.1 Device Features
      1. 9.1.1 WLAN
      2. 9.1.2 Network Stack
      3. 9.1.3 Security
      4. 9.1.4 Host Interface and Driver
      5. 9.1.5 System
    2. 9.2 Power-Management Subsystem
      1. 9.2.1 VBAT Wide-Voltage Connection
      2. 9.2.2 Preregulated 1.85V
    3. 9.3 Low-Power Operating Modes
      1. 9.3.1 Low-Power Deep Sleep
      2. 9.3.2 Hibernate
      3. 9.3.3 Shutdown
    4. 9.4 Memory
      1. 9.4.1 External Memory Requirements
    5. 9.5 Restoring Factory Default Configuration
  10. 10Applications, Implementation, and Layout
    1. 10.1 Application Information
      1. 10.1.1 Typical Application—CC3120R Wide-Voltage Mode
      2. 10.1.2 Typical Application Schematic—CC3120R Preregulated, 1.85-V Mode
    2. 10.2 PCB Layout Guidelines
      1. 10.2.1 General PCB Guidelines
      2. 10.2.2 Power Layout and Routing
        1. 10.2.2.1 Design Considerations
      3. 10.2.3 Clock Interfaces
      4. 10.2.4 Digital Input and Output
      5. 10.2.5 RF Interface
  11. 11Device and Documentation Support
    1. 11.1 Development Tools and Software
    2. 11.2 Firmware Updates
    3. 11.3 Device Nomenclature
    4. 11.4 Documentation Support
    5. 11.5 Support Resources
    6. 11.6 Trademarks
    7. 11.7 Electrostatic Discharge Caution
    8. 11.8 Export Control Notice
    9. 11.9 Glossary
  12. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Packaging Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10.2.3 Clock Interfaces

The following guidelines are for the slow clock.

  • The 32.768-kHz crystal must be placed close to the VQFN package.
  • Ensure that the load capacitance is tuned according to the board parasitics to the frequency tolerance is within ±150 ppm.
  • The ground plane on layer two is solid below the trace lanes and there is ground around these traces on the top layer.

The following guidelines are for the fast clock.

  • The 40-MHz crystal must be placed close to the VQFN package.
  • Ensure that he load capacitance is tuned according to the board parasitics to the frequency tolerance is within ±100 ppm at room temperature. The total frequency across parts, temperature, and with aging, must be ±25 ppm to meet the WLAN specification.
  • Ensure that no high-frequency lines are routed close to the crystal routing to avoid noise degradation.
  • Ensure that crystal tuning capacitors are close to the crystal pads.
  • Make both traces (XTAL_N and XTAL_P) as close to parallel as possible and approximately the same length.
  • The ground plane on layer two is solid below the trace lines and that there is ground around these traces on the top layer.
  • See CC31xx & CC32xx Frequency Tuning for frequency tuning.