SWRS205D March 2017 – September 2020 CC3120MOD
Refer to the PDF data sheet for device specific package drawings
TI does not recommend the use of conformal coating or similar material on the SimpleLink module. This coating can lead to localized stress on the WCSP solder connections inside the module and impact the device reliability. Use caution during the module assembly process to the final PCB to avoid the presence of foreign material inside the module.