SWRS205E March   2017  – May 2021 CC3120MOD

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Functional Block Diagrams
  5. 5 Revision History
  6. 6 Device Comparison
    1. 6.1 Related Products
  7. 7 Terminal Configuration and Functions
    1. 7.1 CC3120MOD Pin Diagram
    2. 7.2 Pin Attributes
      1.      11
    3. 7.3 Connections for Unused Pins
  8. 8 Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Recommended Operating Conditions
    4. 8.4  Current Consumption Summary
    5. 8.5  TX Power and IBAT versus TX Power Level Settings
    6. 8.6  Brownout and Blackout Conditions
    7. 8.7  Electrical Characteristics
    8. 8.8  WLAN Receiver Characteristics
    9. 8.9  WLAN Transmitter Characteristics
    10. 8.10 Reset Requirement
    11. 8.11 Thermal Resistance Characteristics for MOB Package
    12. 8.12 Timing and Switching Characteristics
      1. 8.12.1 Power-Up Sequencing
      2. 8.12.2 Power-Down Sequencing
      3. 8.12.3 Device Reset
      4. 8.12.4 Wakeup From HIBERNATE Mode Timing
    13. 8.13 External Interfaces
      1. 8.13.1 SPI Host Interface
      2. 8.13.2 Host UART Interface
        1. 8.13.2.1 5-Wire UART Topology
        2. 8.13.2.2 4-Wire UART Topology
        3. 8.13.2.3 3-Wire UART Topology
      3. 8.13.3 External Flash Interface
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Module Features
      1. 9.2.1 WLAN
      2. 9.2.2 Network Stack
        1. 9.2.2.1 Security
      3. 9.2.3 Host Interface and Driver
      4. 9.2.4 System
    3. 9.3 Power-Management Subsystem
      1. 9.3.1 VBAT Wide-Voltage Connection
    4. 9.4 Low-Power Operating Modes
      1. 9.4.1 Low-Power Deep Sleep
      2. 9.4.2 Hibernate
      3. 9.4.3 Shutdown
    5. 9.5 Restoring Factory Default Configuration
    6. 9.6 Device Certification and Qualification
      1. 9.6.1 FCC Certification and Statement
      2. 9.6.2 Industry Canada (IC) Certification and Statement
      3. 9.6.3 ETSI/CE Certification
      4. 9.6.4 Japan MIC Certification
      5. 9.6.5 SRRC Certification and Statement
    7. 9.7 Module Markings
    8. 9.8 End Product Labeling
    9. 9.9 Manual Information to the End User
  10. 10Applications, Implementation, and Layout
    1. 10.1 Application Information
      1. 10.1.1 Typical Application
      2. 10.1.2 Power Supply Decoupling and Bulk Capacitors
      3. 10.1.3 Reset
      4. 10.1.4 Unused Pins
    2. 10.2 PCB Layout Guidelines
      1. 10.2.1 General Layout Recommendations
      2. 10.2.2 RF Layout Recommendations
      3. 10.2.3 Antenna Placement and Routing
      4. 10.2.4 Transmission Line Considerations
  11. 11Environmental Requirements and Specifications
    1. 11.1 Temperature
      1. 11.1.1 PCB Bending
    2. 11.2 Handling Environment
      1. 11.2.1 Terminals
      2. 11.2.2 Falling
    3. 11.3 Storage Condition
      1. 11.3.1 Moisture Barrier Bag Before Opened
      2. 11.3.2 Moisture Barrier Bag Open
    4. 11.4 Baking Conditions
    5. 11.5 Soldering and Reflow Condition
  12. 12Device and Documentation Support
    1. 12.1 Device Nomenclature
    2. 12.2 Development Tools and Software
    3. 12.3 Firmware Updates
    4. 12.4 Documentation Support
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information
    1. 13.1 Mechanical, Land, and Solder Paste Drawings
    2. 13.2 Package Option Addendum
      1. 13.2.1 Packaging Information
    3. 13.3 Tape and Reel Information
      1. 13.3.1 Tape and Reel Specification

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • MOB|63
Thermal pad, mechanical data (Package|Pins)

6 Device Comparison

Table 6-1 shows the features supported across different CC3x20 modules.

Table 6-1 Device Features Comparison
FEATURE DEVICE
CC3120MOD CC3220MODS CC3220MODSF
Onboard Chip CC3120 CC3220S CC3220SF
Onboard ANT No No No
sFlash 32-Mbit 32-Mbit 32-Mbit
Regulatory Certification FCC, IC, CE, MIC, SRRC FCC, IC, CE, MIC, SRRC FCC, IC, CE, MIC, SRRC
Wi-Fi Alliance Certification Yes Yes Yes
Input Voltage 2.3 V to 3.6 V 2.3 V to 3.6 V 2.3 V to 3.6 V
Package 17.5 mm × 20.5 mm LGA 17.5 mm × 20.5 mm LGA 17.5 mm × 20.5 mm LGA
Operating Temperature Range –40° to 85°C –40° to 85°C –40° to 85°C
Classification Wi-Fi Network Processor Wireless Microcontroller Wireless Microcontroller
Standard 802.11 b/g/n 802.11 b/g/n 802.11 b/g/n
Frequency 2.4 GHz 2.4 GHz 2.4 GHz
TCP / IP Stack IPv4, IPv6 IPv4, IPv6 IPv4, IPv6
Sockets 16 16 16
Integrated MCU - Arm®Cortex®-M4 at 80 MHz Arm® Cortex®-M4 at 80 MHz
On Chip Memory
RAM - 256KB 256KB
Flash - - 1MB
Peripherals and Interfaces
Universal Asynchronous Receiver and Transmitter (UART) 1 2 2
Serial Port Interface (SPI) 1 1 1
Multi-Channel Audio Serial Port (McASP) — I2S or PCM - 2-ch 2-ch
Inter-Integrated Circuit (I2C) - 1 1
Analog to Digital Converter (ADC) - 4-ch, 12-bit 4-ch, 12-bit
Parallel Interface (8-bit PI) - 1 1
General-Purpose Timers - 4 4
Multimedia Card (MMC / SD) - 1 1
Security Features
Wi-Fi Level of Security WEP, WPS, WPA / WPA2, PSK WPA2 (802.1x) WEP, WPS, WPA / WPA2, PSK WPA2 (802.1x) WEP, WPS, WPA / WPA2, PSK WPA2 (802.1x)
Secure Sockets (SSL v3 or TLS 1.0 /1.1/ 1.2) 6 6 6
Additional Networking Security Unique Device Identity
Trusted Root-Certificate Catalog
TI Root-of-Trust Public key		 Unique Device Identity
Trusted Root-Certificate Catalog
TI Root-of-Trust Public key		 Unique Device Identity
Trusted Root-Certificate Catalog
TI Root-of-Trust Public key
Hardware Acceleration Hardware Crypto Engines Hardware Crypto Engines Hardware Crypto Engines
Secure Boot - Yes Yes
Enhanced Application Level Security - File system security
Secure key storage
Software tamper detection
Cloning protection
Initial secure programming		 File system security
Secure key storage
Software tamper detection
Cloning protection
Initial secure programming