SWRS227B March   2020  – May 2021 CC3130

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Functional Block Diagram
  5. 5 Revision History
  6. 6 Device Comparison
    1. 6.1 Related Products
  7. 7 Terminal Configuration and Functions
    1. 7.1 Pin Diagram
    2. 7.2 Pin Attributes
    3. 7.3 Signal Descriptions
      1.      12
    4. 7.4 Connections for Unused Pins
  8. 8 Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Power-On Hours (POH)
    4. 8.4  Recommended Operating Conditions
    5. 8.5  Current Consumption Summary
    6. 8.6  TX Power Control
    7. 8.7  Brownout and Blackout Conditions
      1. 8.7.1 Brownout and Blackout Voltage Levels
    8. 8.8  Electrical Characteristics for DIO Pins
      1. 8.8.1 Electrical Characteristics: DIO Pins Except 52 and 53
      2. 8.8.2 Electrical Characteristics: DIO Pins 52 and 53
    9. 8.9  Electrical Characteristics for Pin Internal Pullup and Pulldown
    10. 8.10 WLAN Receiver Characteristics
      1.      28
    11. 8.11 WLAN Transmitter Characteristics
      1.      30
    12. 8.12 WLAN Transmitter Out-of-Band Emissions
      1. 8.12.1 WLAN 2.4 GHz Filter Requirements
    13. 8.13 BLE/2.4 GHz Radio Coexistence and WLAN Coexistence Requirements
    14. 8.14 Thermal Resistance Characteristics for RGK Package
    15. 8.15 Timing and Switching Characteristics
      1. 8.15.1 Power Supply Sequencing
      2. 8.15.2 Device Reset
      3. 8.15.3 Reset Timing
        1. 8.15.3.1 nRESET (32-kHz Crystal)
        2. 8.15.3.2 First-Time Power-Up and Reset Removal Timing Requirements (32-kHz Crystal)
        3. 8.15.3.3 nRESET (External 32-kHz Crystal)
          1. 8.15.3.3.1 First-Time Power-Up and Reset Removal Timing Requirements (External 32-kHz Crystal)
      4. 8.15.4 Wakeup From HIBERNATE Mode
        1. 8.15.4.1 nHIB Timing Requirements
      5. 8.15.5 Clock Specifications
        1. 8.15.5.1 Slow Clock Using Internal Oscillator
          1. 8.15.5.1.1 RTC Crystal Requirements
        2. 8.15.5.2 Slow Clock Using an External Clock
          1. 8.15.5.2.1 External RTC Digital Clock Requirements
        3. 8.15.5.3 Fast Clock (Fref) Using an External Crystal
          1. 8.15.5.3.1 WLAN Fast-Clock Crystal Requirements
        4. 8.15.5.4 Fast Clock (Fref) Using an External Oscillator
          1. 8.15.5.4.1 External Fref Clock Requirements (–40°C to +85°C)
      6. 8.15.6 Interfaces
        1. 8.15.6.1 Host SPI Interface Timing
          1. 8.15.6.1.1 Host SPI Interface Timing Parameters
        2. 8.15.6.2 Flash SPI Interface Timing
          1. 8.15.6.2.1 Flash SPI Interface Timing Parameters
        3. 8.15.6.3 DIO Interface Timing
          1. 8.15.6.3.1 DIO Output Transition Time Parameters (Vsupply = 3.3 V)
            1. 8.15.6.3.1.1 DIO Output Transition Times (Vsupply = 3.3 V) (1)
          2. 8.15.6.3.2 DIO Input Transition Time Parameters
            1. 8.15.6.3.2.1 DIO Input Transition Time Parameters
    16. 8.16 External Interfaces
      1. 8.16.1 SPI Flash Interface
      2. 8.16.2 SPI Host Interface
      3. 8.16.3 Host UART Interface
        1. 8.16.3.1 5-Wire UART Topology
        2. 8.16.3.2 4-Wire UART Topology
        3. 8.16.3.3 3-Wire UART Topology
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Device Features
      1. 9.2.1 WLAN
      2. 9.2.2 Network Stack
      3. 9.2.3 Security
      4. 9.2.4 Host Interface and Driver
      5. 9.2.5 System
    3. 9.3 Power-Management Subsystem
      1. 9.3.1 VBAT Wide-Voltage Connection
    4. 9.4 Low-Power Operating Modes
      1. 9.4.1 Low-Power Deep Sleep
      2. 9.4.2 Hibernate
      3. 9.4.3 Shutdown
    5. 9.5 Memory
      1. 9.5.1 External Memory Requirements
    6. 9.6 Restoring Factory Default Configuration
    7. 9.7 Hostless Mode
  10. 10Applications, Implementation, and Layout
    1. 10.1 Application Information
      1. 10.1.1 BLE/2.4 GHz Radio Coexistence
      2. 10.1.2 Antenna Selection
      3. 10.1.3 Typical Application
    2. 10.2 PCB Layout Guidelines
      1. 10.2.1 General PCB Guidelines
      2. 10.2.2 Power Layout and Routing
        1. 10.2.2.1 Design Considerations
      3. 10.2.3 Clock Interface Guidelines
      4. 10.2.4 Digital Input and Output Guidelines
      5. 10.2.5 RF Interface Guidelines
  11. 11Device and Documentation Support
    1. 11.1 Tools and Software
    2. 11.2 Firmware Updates
    3. 11.3 Device Nomenclature
    4. 11.4 Documentation Support
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Package Option Addendum
      1. 12.1.1 Packaging Information
      2. 12.1.2 Tape and Reel Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.4 Connections for Unused Pins

All unused pin should be configured as stated in Table 7-3.

Table 7-3 Connections for Unused Pins
FUNCTIONSIGNAL DESCRIPTIONPIN NUMBERACCEPTABLE PRACTICEPREFERRED PRACTICE
DIODigital input or outputWake up I/O source should not be floating during hibernate.

All the I/O pins will float while in Hibernate and Reset states. Ensure pullup and pulldown resistors are available on board to maintain the state of the I/O.

Leave unused DIOs as NC
No ConnectNC26, 29, 30Unused pin, leave as NC.Unused pin, leave as NC
SOPConfiguration sense-on-powerEnsure pulldown resistors are available on unused SOP pins100-kΩ Pull down resistor on SOP0 and SOP1. 2.7-kΩ pull down on SOP2
ResetRESET input for the deviceNever leave the reset pin floating
ClockRTC_XTAL_NWhen using an external oscillator, add a 100-kΩ pullup resistor to VIO
WLAN_XTAL_NWhen using an external oscillator, connect to ground if unused