SWAS037B February   2019  – May 2021 CC3135

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Functional Block Diagram
  5. 5 Revision History
  6. 6 Device Comparison
    1. 6.1 Related Products
  7. 7 Terminal Configuration and Functions
    1. 7.1 Pin Diagram
    2. 7.2 Pin Attributes
    3. 7.3 Signal Descriptions
      1.      12
    4. 7.4 Connections for Unused Pins
  8. 8 Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Power-On Hours (POH)
    4. 8.4  Recommended Operating Conditions
    5. 8.5  Current Consumption Summary: 2.4 GHz RF Band
    6. 8.6  Current Consumption Summary: 5 GHz RF Band
    7. 8.7  TX Power Control for 2.4 GHz Band
    8. 8.8  TX Power Control for 5 GHz
    9. 8.9  Brownout and Blackout Conditions
      1.      24
    10. 8.10 Electrical Characteristics for DIO Pins
      1.      26
      2.      27
    11. 8.11 Electrical Characteristics for Pin Internal Pullup and Pulldown
    12. 8.12 WLAN Receiver Characteristics
      1.      30
      2.      31
    13. 8.13 WLAN Transmitter Characteristics
      1.      33
      2.      34
    14. 8.14 WLAN Transmitter Out-of-Band Emissions
      1.      36
      2.      37
    15. 8.15 BLE/2.4 GHz Radio Coexistence and WLAN Coexistence Requirements
    16. 8.16 Thermal Resistance Characteristics for RGK Package
    17. 8.17 Timing and Switching Characteristics
      1. 8.17.1 Power Supply Sequencing
      2. 8.17.2 Device Reset
      3. 8.17.3 Reset Timing
        1. 8.17.3.1 nRESET (32-kHz Crystal)
        2.       45
        3. 8.17.3.2 nRESET (External 32-kHz Crystal)
          1.        47
      4. 8.17.4 Wakeup From HIBERNATE Mode
        1.       49
      5. 8.17.5 Clock Specifications
        1. 8.17.5.1 Slow Clock Using Internal Oscillator
          1.        52
        2. 8.17.5.2 Slow Clock Using an External Clock
          1.        54
        3. 8.17.5.3 Fast Clock (Fref) Using an External Crystal
          1.        56
        4. 8.17.5.4 Fast Clock (Fref) Using an External Oscillator
          1.        58
      6. 8.17.6 Interfaces
        1. 8.17.6.1 Host SPI Interface Timing
          1.        61
        2. 8.17.6.2 Flash SPI Interface Timing
          1.        63
        3. 8.17.6.3 DIO Interface Timing
          1. 8.17.6.3.1 DIO Output Transition Time Parameters (Vsupply = 3.3 V)
            1.         66
          2. 8.17.6.3.2 DIO Input Transition Time Parameters
            1.         68
    18. 8.18 External Interfaces
      1. 8.18.1 SPI Flash Interface
      2. 8.18.2 SPI Host Interface
      3. 8.18.3 Host UART Interface
        1. 8.18.3.1 5-Wire UART Topology
        2. 8.18.3.2 4-Wire UART Topology
        3. 8.18.3.3 3-Wire UART Topology
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Device Features
      1. 9.2.1 WLAN
      2. 9.2.2 Network Stack
      3. 9.2.3 Security
      4. 9.2.4 Host Interface and Driver
      5. 9.2.5 System
    3. 9.3 FIPS 140-2 Level 1 Certification
    4. 9.4 Power-Management Subsystem
      1. 9.4.1 VBAT Wide-Voltage Connection
    5. 9.5 Low-Power Operating Modes
      1. 9.5.1 Low-Power Deep Sleep
      2. 9.5.2 Hibernate
      3. 9.5.3 Shutdown
    6. 9.6 Memory
      1. 9.6.1 External Memory Requirements
    7. 9.7 Restoring Factory Default Configuration
    8. 9.8 Hostless Mode
  10. 10Applications, Implementation, and Layout
    1. 10.1 Application Information
      1. 10.1.1 BLE/2.4 GHz Radio Coexistence
      2. 10.1.2 Antenna Selection
      3. 10.1.3 Typical Application
    2. 10.2 PCB Layout Guidelines
      1. 10.2.1 General PCB Guidelines
      2. 10.2.2 Power Layout and Routing
        1. 10.2.2.1 Design Considerations
      3. 10.2.3 Clock Interface Guidelines
      4. 10.2.4 Digital Input and Output Guidelines
      5. 10.2.5 RF Interface Guidelines
  11. 11Device and Documentation Support
    1. 11.1  Third-Party Products Disclaimer
    2. 11.2  Tools and Software
    3. 11.3  Firmware Updates
    4. 11.4  Device Nomenclature
    5. 11.5  Documentation Support
    6. 11.6  Support Resources
    7. 11.7  Trademarks
    8. 11.8  Electrostatic Discharge Caution
    9. 11.9  Export Control Notice
    10. 11.10 Glossary
  12. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Packaging Information
    2. 12.2 Package Option Addendum
      1. 12.2.1 Packaging Information
      2. 12.2.2 Tape and Reel Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.2.3 Security

The SimpleLink Wi-Fi CC3135 Internet-on-a chip device enhances the security capabilities available for development of IoT devices, while completely offloading these activities from the MCU to the networking subsystem. The security capabilities include the following key features:

Code and Data Security:

  • Secured network information: Network passwords and certificates are encrypted
  • Secured and authenticated service pack: SP is signed based on TI certificate

Wi-Fi and Internet Security:

  • Personal and enterprise Wi-Fi security
    • Personal standards
      • AES (WPA2-PSK)
      • TKIP (WPA-PSK)
      • WEP
    • Enterprise standards
      • EAP Fast
      • EAP PEAPv0 MSCHAPv2
      • EAP PEAPv0 TLS
      • EAP PEAPv1 TLS EAP LS
      • EAP TTLS TLS
      • EAP TTLS MSCHAPv2
  • Secure HTTP server (HTTPS)
  • The Trusted root-certificate catalog verifies that the CA used by the application is trusted and known secure content delivery
  • The TI root-of-trust public key is a hardware-based mechanism that allows authenticating TI as the genuine origin of a given content using asymmetric keys
  • Secure content delivery allows file transfer to the system in a secure way on any unsecured tunnel
  • Secure sockets
    • Protocol versions: SSL v3/TLS 1.0/TLS 1.1/TLS 1.2
    • On-chip powerful crypto engine for fast, secure Wi-Fi and internet connections with 256-bit AES encryption for TLS and SSL connections
    • Ciphers suites
      • SL_SEC_MASK_SSL_RSA_WITH_RC4_128_SHA
      • SL_SEC_MASK_SSL_RSA_WITH_RC4_128_MD5
      • SL_SEC_MASK_TLS_RSA_WITH_AES_256_CBC_SHA
      • SL_SEC_MASK_TLS_DHE_RSA_WITH_AES_256_CBC_SHA
      • SL_SEC_MASK_TLS_ECDHE_RSA_WITH_AES_256_CBC_SHA
      • SL_SEC_MASK_TLS_ECDHE_RSA_WITH_RC4_128_SHA
      • SL_SEC_MASK_TLS_RSA_WITH_AES_128_CBC_SHA256
      • SL_SEC_MASK_TLS_RSA_WITH_AES_256_CBC_SHA256
      • SL_SEC_MASK_TLS_ECDHE_RSA_WITH_AES_128_CBC_SHA256
      • SL_SEC_MASK_TLS_ECDHE_ECDSA_WITH_AES_128_CBC_SHA256
      • SL_SEC_MASK_TLS_ECDHE_ECDSA_WITH_AES_128_CBC_SHA
      • SL_SEC_MASK_TLS_ECDHE_ECDSA_WITH_AES_256_CBC_SHA
      • SL_SEC_MASK_TLS_RSA_WITH_AES_128_GCM_SHA256
      • SL_SEC_MASK_TLS_RSA_WITH_AES_256_GCM_SHA384
      • SL_SEC_MASK_TLS_DHE_RSA_WITH_AES_128_GCM_SHA256
      • SL_SEC_MASK_TLS_DHE_RSA_WITH_AES_256_GCM_SHA384
      • SL_SEC_MASK_TLS_ECDHE_RSA_WITH_AES_128_GCM_SHA256
      • SL_SEC_MASK_TLS_ECDHE_RSA_WITH_AES_256_GCM_SHA384
      • SL_SEC_MASK_TLS_ECDHE_ECDSA_WITH_AES_128_GCM_SHA256
      • SL_SEC_MASK_TLS_ECDHE_ECDSA_WITH_AES_256_GCM_SHA384
      • SL_SEC_MASK_TLS_ECDHE_ECDSA_WITH_CHACHA20_POLY1305_SHA256
      • SL_SEC_MASK_TLS_ECDHE_RSA_WITH_CHACHA20_POLY1305_SHA256
      • SL_SEC_MASK_TLS_DHE_RSA_WITH_CHACHA20_POLY1305_SHA256
    • Server authentication
    • Client authentication
    • Domain name verification
    • Socket upgrade to secure socket – STARTTLS