SWRS206C March   2017  – December 2018 CC3220MOD , CC3220MODA


  1. Module Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagrams
  2. Revision History
  3. Device Comparison
    1. 3.1 Related Products
  4. Terminal Configuration and Functions
    1. 4.1 CC3220MODx and CC3220MODAx Pin Diagram
    2. 4.2 Pin Attributes
      1. Table 4-1 Module Pin Attributes
    3. 4.3 Connections for Unused Pins
    4. 4.4 Pin Attributes and Pin Multiplexing
    5. 4.5 Drive Strength and Reset States for Analog-Digital Multiplexed Pins
    6. 4.6 Pad State After Application of Power to Chip, but Before Reset Release
  5. Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Current Consumption (CC3220MODS and CC3220MODAS)
    5. 5.5  Current Consumption (CC3220MODSF and CC3220MODASF)
    6. 5.6  TX Power and IBAT Versus TX Power Level Settings
    7. 5.7  Brownout and Blackout Conditions
    8. 5.8  Electrical Characteristics
    9. 5.9  CC3220MODAx Antenna Characteristics
    10. 5.10 WLAN Receiver Characteristics
    11. 5.11 WLAN Transmitter Characteristics
    12. 5.12 Reset Requirement
    13. 5.13 Thermal Resistance Characteristics for MOB and MON Packages
    14. 5.14 Timing and Switching Characteristics
      1. 5.14.1 Power-Up Sequencing
      2. 5.14.2 Power-Down Sequencing
      3. 5.14.3 Device Reset
      4. 5.14.4 Wake Up From Hibernate Timing
      5. 5.14.5 Peripherals Timing
        1.  SPI
          1. SPI Master
          2. SPI Slave
        2.  I2S
          1. I2S Transmit Mode
          2. I2S Receive Mode
        3.  GPIOs
          1. GPIO Input Transition Time Parameters
        4.  I2C
        5.  IEEE 1149.1 JTAG
        6.  ADC
        7.  Camera Parallel Port
        8.  UART
        9.  External Flash Interface
        10. SD Host
        11. Timers
  6. Detailed Description
    1. 6.1  Overview
    2. 6.2  Arm® Cortex®-M4 Processor Core Subsystem
    3. 6.3  Wi-Fi® Network Processor Subsystem
      1. 6.3.1 WLAN
      2. 6.3.2 Network Stack
    4. 6.4  Security
    5. 6.5  Power-Management Subsystem
      1. 6.5.1 VBAT Wide-Voltage Connection
    6. 6.6  Low-Power Operating Mode
    7. 6.7  Memory
      1. 6.7.1 Internal Memory
        1. SRAM
        2. ROM
        3. Flash Memory
        4. Memory Map
    8. 6.8  Restoring Factory Default Configuration
    9. 6.9  Boot Modes
      1. 6.9.1 Boot Mode List
    10. 6.10 Device Certification and Qualification
      1. 6.10.1 FCC Certification and Statement
      2. 6.10.2 Industry Canada (IC) Certification and Statement
      3. 6.10.3 ETSI/CE Certification
      4. 6.10.4 MIC Certification
      5. 6.10.5 SRRC Certification and Statement
    11. 6.11 Module Markings
    12. 6.12 End Product Labeling
    13. 6.13 Manual Information to the End User
  7. Applications, Implementation, and Layout
    1. 7.1 Typical Application
    2. 7.2 Device Connection and Layout Fundamentals
      1. 7.2.1 Power Supply Decoupling and Bulk Capacitors
      2. 7.2.2 Reset
      3. 7.2.3 Unused Pins
    3. 7.3 PCB Layout Guidelines
      1. 7.3.1 General Layout Recommendations
      2. 7.3.2 CC3220MODx RF Layout Recommendations
        1. Antenna Placement and Routing
        2. Transmission Line Considerations
      3. 7.3.3 CC3220MODAx RF Layout Recommendations
  8. Environmental Requirements and Specifications
    1. 8.1 PCB Bending
    2. 8.2 Handling Environment
      1. 8.2.1 Terminals
      2. 8.2.2 Falling
    3. 8.3 Storage Condition
      1. 8.3.1 Moisture Barrier Bag Before Opened
      2. 8.3.2 Moisture Barrier Bag Open
    4. 8.4 Baking Conditions
    5. 8.5 Soldering and Reflow Condition
  9. Device and Documentation Support
    1. 9.1 Third-Party Products Disclaimer
    2. 9.2 Development Tools and Software
    3. 9.3 Firmware Updates
    4. 9.4 Device Nomenclature
    5. 9.5 Documentation Support
      1. 9.5.1 Community Resources
    6. 9.6 Trademarks
    7. 9.7 Electrostatic Discharge Caution
    8. 9.8 Export Control Notice
    9. 9.9 Glossary
  10. 10Mechanical, Packaging, and Orderable Information
    1. 10.1 Mechanical, Land, and Solder Paste Drawings
    2. 10.2 Package Option Addendum
      1. 10.2.1 Packaging Information
      2. 10.2.2 Tape and Reel Information
        1. CC3220MODx Tape Specifications
        2. CC3220MODAx Tape Specifications
          1. CC3220MODx Tape Specifications
          2. CC3220MODAx Tape Specifications

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • MON|63
Thermal pad, mechanical data (Package|Pins)

Low-Power Operating Mode

From a power-management perspective, the CC3220MODx and CC3220MODAx module comprise the following two independent subsystems:

  • Arm® Cortex®-M4 application processor subsystem
  • Networking subsystem

Each subsystem operates in one of several power states.

The Arm® Cortex®-M4 application processor runs the user application loaded from an external serial Flash, or internal Flash (in CC3220MODSF). The networking subsystem runs preprogrammed TCP/IP and Wi-Fi data link layer functions.

The user program controls the power state of the application processor subsystem and can be in one of the five modes described in Table 6-2.

Table 6-2 User Program Modes

MCU active mode MCU executing code at 80-MHz state rate
MCU sleep mode The MCU clocks are gated off in sleep mode and the entire state of the device is retained. Sleep mode offers instant wakeup. The MCU can be configured to wake up by an internal fast timer or by activity from any GPIO line or peripheral.
MCU LPDS mode State information is lost and only certain MCU-specific register configurations are retained. The MCU can wake up from external events or by using an internal timer. (The wake-up time is less than 3 ms.) Certain parts of memory can be retained while the MCU is in LPDS mode. The amount of memory retained is configurable. Users can choose to preserve code and the MCU-specific setting. The MCU can be configured to wake up using the RTC timer or by an external event on specific GPIOs as the wake-up source.
MCU hibernate mode The lowest power mode in which all digital logic is power-gated. Only a small section of the logic directly powered by the input supply is retained. The RTC keeps running and the MCU supports wakeup from an external event or from an RTC timer expiry. Wake-up time is longer than LPDS mode at about 15 ms plus the time to load the application from serial Flash, which varies according to code size. In this mode, the MCU can be configured to wake up using the RTC timer or external event on a GPIO .
MCU shutdown mode The lowest power mode system-wise. All device logics are off, including the RTC. The wake-up time in this mode is longer than hibernate at about 1.1 s. To enter or exit the shutdown mode, the state of the nRESET line is changed (low to shut down, high to turn on).
Modes are listed in order of power consumption, with highest power modes listed first.

The NWP can be active or in LPDS mode and takes care of its own mode transitions. When there is no network activity, the NWP sleeps most of the time and wakes up only for beacon reception (see
Table 6-3).

Table 6-3 Networking Subsystem Modes

Network active mode
(processing layer 3, 2, and 1)
Transmitting or receiving IP protocol packets
Network active mode
(processing layer 2 and 1)
Transmitting or receiving MAC management frames; IP processing not required.
Network active listen mode Special power optimized active mode for receiving beacon frames (no other frames supported)
Network connected Idle A composite mode that implements 802.11 infrastructure power save operation. The CC3220MODx and CC3220MODAx NWPs automatically goes into LPDS mode between beacons and then wakes to active listen mode to receive a beacon and determine if there is pending traffic at the AP. If not, the NWP returns to LPDS mode and the cycle repeats.
Network LPDS mode Low-power state between beacons in which the state is retained by the NWP, allowing for a rapid wake up.
Network disabled The network is disabled

The operation of the application and network processor ensures that the module remains in the lowest power mode most of the time to preserve battery life.

The following examples show the use of the power modes in applications:

  • A product that is continuously connected to the network in the 802.11 infrastructure power-save mode but sends and receives little data spends most of the time in connected idle, which is a composite of receiving a beacon frame and waiting for the next beacon.
  • A product that is not continuously connected to the network but instead wakes up periodically (for example, every 10 minutes) to send data, spends most of the time in hibernate mode, jumping briefly to active mode to transmit data.