SWRS243B February   2020  – May 2021 CC3235MODAS , CC3235MODASF , CC3235MODS , CC3235MODSF

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Functional Block Diagrams
  5. Revision History
  6. Device Comparison
    1. 6.1 Related Products
  7. Terminal Configuration and Functions
    1. 7.1 CC3235MODx and CC3235MODAx Pin Diagram
    2. 7.2 Pin Attributes and Pin Multiplexing
      1. 7.2.1 Module Pin Descriptions
    3. 7.3 Signal Descriptions
    4. 7.4 Drive Strength and Reset States for Analog-Digital Multiplexed Pins
    5. 7.5 Pad State After Application of Power to Chip, but Before Reset Release
    6. 7.6 Connections for Unused Pins
  8. Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Recommended Operating Conditions
    4. 8.4  Current Consumption (CC3235MODS and CC3235MODAS)
      1.     
      2.     
    5. 8.5  Current Consumption (CC3235MODSF and CC3235MODASF)
      1.     
      2.     
    6. 8.6  TX Power Control for 2.4 GHz Band
    7. 8.7  TX Power Control for 5 GHz
    8. 8.8  Brownout and Blackout Conditions
    9. 8.9  Electrical Characteristics for GPIO Pins
      1. 8.9.1 Electrical Characteristics for Pin Internal Pullup and Pulldown (25°C)
    10. 8.10 CC3235MODAx Antenna Characteristics
    11. 8.11 WLAN Receiver Characteristics
      1.     
      2.     
    12. 8.12 WLAN Transmitter Characteristics
      1.     
      2.     
    13. 8.13 BLE and WLAN Coexistence Requirements
    14. 8.14 Reset Requirement
    15. 8.15 Thermal Resistance Characteristics for MOB and MON Packages
    16. 8.16 Timing and Switching Characteristics
      1. 8.16.1 Power-Up Sequencing
      2. 8.16.2 Power-Down Sequencing
      3. 8.16.3 Device Reset
      4. 8.16.4 Wake Up From Hibernate Timing
      5. 8.16.5 Peripherals Timing
        1. 8.16.5.1  SPI
          1. 8.16.5.1.1 SPI Master
          2. 8.16.5.1.2 SPI Slave
        2. 8.16.5.2  I2S
          1. 8.16.5.2.1 I2S Transmit Mode
          2. 8.16.5.2.2 I2S Receive Mode
        3. 8.16.5.3  GPIOs
          1. 8.16.5.3.1 GPIO Input Transition Time Parameters
        4. 8.16.5.4  I2C
        5. 8.16.5.5  IEEE 1149.1 JTAG
        6. 8.16.5.6  ADC
        7. 8.16.5.7  Camera Parallel Port
        8. 8.16.5.8  UART
        9. 8.16.5.9  External Flash Interface
        10. 8.16.5.10 SD Host
        11. 8.16.5.11 Timers
  9. Detailed Description
    1. 9.1  Overview
    2. 9.2  Functional Block Diagram
    3. 9.3  Arm Cortex-M4 Processor Core Subsystem
    4. 9.4  Wi-Fi Network Processor Subsystem
      1. 9.4.1 WLAN
      2. 9.4.2 Network Stack
    5. 9.5  Security
    6. 9.6  FIPS 140-2 Level 1 Certification
    7. 9.7  Power-Management Subsystem
      1. 9.7.1 VBAT Wide-Voltage Connection
    8. 9.8  Low-Power Operating Mode
    9. 9.9  Memory
      1. 9.9.1 Internal Memory
        1. 9.9.1.1 SRAM
        2. 9.9.1.2 ROM
        3. 9.9.1.3 Flash Memory
        4. 9.9.1.4 Memory Map
    10. 9.10 Restoring Factory Default Configuration
    11. 9.11 Boot Modes
      1. 9.11.1 Boot Mode List
    12. 9.12 Hostless Mode
    13. 9.13 Device Certification and Qualification
      1. 9.13.1 FCC Certification and Statement
      2. 9.13.2 IC/ISED Certification and Statement
      3. 9.13.3 ETSI/CE Certification
      4. 9.13.4 MIC Certification
    14. 9.14 Module Markings
    15. 9.15 End Product Labeling
    16. 9.16 Manual Information to the End User
  10. 10Applications, Implementation, and Layout
    1. 10.1 Typical Application
      1. 10.1.1 BLE/2.4 GHz Radio Coexistence
      2. 10.1.2 Antenna Selection (CC3235MODx only)
      3. 10.1.3 Typical Application Schematic (CC3235MODx)
      4. 10.1.4 Typical Application Schematic (CC3235MODAx)
    2. 10.2 Device Connection and Layout Fundamentals
      1. 10.2.1 Power Supply Decoupling and Bulk Capacitors
      2. 10.2.2 Reset
      3. 10.2.3 Unused Pins
    3. 10.3 PCB Layout Guidelines
      1. 10.3.1 General Layout Recommendations
      2. 10.3.2 CC3235MODx RF Layout Recommendations
        1. 10.3.2.1 Antenna Placement and Routing
        2. 10.3.2.2 Transmission Line Considerations
      3. 10.3.3 CC3235MODAx RF Layout Recommendations
  11. 11Environmental Requirements and SMT Specifications
    1. 11.1 PCB Bending
    2. 11.2 Handling Environment
      1. 11.2.1 Terminals
      2. 11.2.2 Falling
    3. 11.3 Storage Condition
      1. 11.3.1 Moisture Barrier Bag Before Opened
      2. 11.3.2 Moisture Barrier Bag Open
    4. 11.4 PCB Assembly Guide
      1. 11.4.1 PCB Land Pattern & Thermal Vias
      2. 11.4.2 SMT Assembly Recommendations
      3. 11.4.3 PCB Surface Finish Requirements
      4. 11.4.4 Solder Stencil
      5. 11.4.5 Package Placement
      6. 11.4.6 Solder Joint Inspection
      7. 11.4.7 Rework and Replacement
      8. 11.4.8 Solder Joint Voiding
    5. 11.5 Baking Conditions
    6. 11.6 Soldering and Reflow Condition
  12. 12Device and Documentation Support
    1. 12.1 Development Tools and Software
    2. 12.2 Firmware Updates
    3. 12.3 Device Nomenclature
    4. 12.4 Documentation Support
    5. 12.5 Related Links
    6. 12.6 Support Resources
    7. 12.7 Trademarks
    8. 12.8 Electrostatic Discharge Caution
    9. 12.9 Glossary
  13. 13Mechanical, Packaging, and Orderable Information
    1. 13.1 Mechanical, Land, and Solder Paste Drawings
    2. 13.2 Package Option Addendum
      1. 13.2.1 Packaging Information
      2. 13.2.2 Tape and Reel Information
      3. 13.2.3 CC3235MODx Tape Specifications
      4. 13.2.4 CC3235MODAx Tape Specifications

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • MON|63
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Description

Start your design with the fully programmable FCC, IC/ISED, ETSI/CE, MIC, and SRRC certified wireless microcontroller (MCU) module with built-in dual-band Wi-Fi connectivity. The modules integrate the 40-MHz crystal, 32.768-kHz RTC clock, 32Mb SPI serial flash, RF filters, diplexer, and passive components.

The SimpleLink™ CC3235MODx module is available in two variants:

  • CC3235MODS includes 256KB of RAM, IoT networking security, device identity and keys, and MCU-level security features such as file system encryption, user IP (MCU image) encryption, secure boot, and debug security.
  • CC3235MODSF builds on the CC3235MODS and integrates a user-dedicated 1MB of executable flash in addition to the 256KB of RAM.

The SimpleLink™ CC3235MODAx module is available in two variants:

  • CC3235MODAS includes 256KB of RAM, IoT networking security, device identity and keys, and MCU-level security features such as file system encryption, user IP (MCU image) encryption, secure boot, and debug security.
  • CC3235MODASF builds on the CC3235MODAS and integrates a user-dedicated 1MB of executable flash in addition to the 256KB of RAM.

Created for IoT, the SimpleLink™ Wi-Fi® CC3235MODx and CC3235MODAx module family from Texas Instruments is a wireless module that integrates two physically separated on-chip MCUs.

  • Application processor— Arm®Cortex®-M4 MCU with a user-dedicated 256KB of RAM and an optional 1MB of executable flash.
  • Network processor to run all Wi-Fi and Internet logical layers. This ROM-based subsystem completely offloads the host MCU and includes an 802.11 a/b/g/n dual-band 2.4-GHz and 5-GHz radio, baseband, and MAC with a powerful hardware cryptography engine.

This generation introduces new capabilities that further simplify the connectivity of things to the Internet. The main new features include:

  • 802.11a/b/g/n: 2.4-GHz and 5-GHz support
  • 2.4-GHz coexistence with Bluetooth® low energy radio
  • Antenna diversity
  • Enhanced security with FIPS 140-2 Level 1 validated IC inside: certification.
  • More concurrent secure sockets (up to 16)
  • Certificate signing request (CSR)
  • Online certificate status protocol (OCSP)
  • Wi-Fi Alliance® certified for IoT applications with low-power capabilities and more
  • Hostless mode for offloading template packet transmissions
  • Improved fast scan

The CC3235MODx and CC3235MODAx device family is part of the SimpleLink MCU platform—a common, easy-to-use development environment based on a single-core software development kit (SDK) with a rich tool set and reference designs. The E2E™ support forums support Wi-Fi, Bluetooth low energy, Sub-1 GHz, and host MCUs. For more information, visit www.ti.com/simplelink or www.ti.com/simplelinkwifi.

Device Information(1)
PART NUMBER PACKAGE BODY SIZE (NOM)
CC3235MODSM2MOB QFM (63) 20.5 mm × 17.5 mm
CC3235MODSF12MOB QFM (63) 20.5 mm × 17.5 mm
CC3235MODASM2MON QFM (63) 20.5 mm × 25 mm
CC3235MODASF12MON QFM (63) 20.5 mm × 25 mm
For more information, see Section 13.