SWRS333A July   2025  – August 2025 CC3300MOD , CC3301MOD

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Functional Block Diagrams
  6. 5 Pin Configuration and Functions
    1. 5.1 Pin Diagram
    2. 5.2 Pin Descriptions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Electrical Characteristics
    5. 6.5  WLAN Performance: 2.4GHz Receiver Characteristics
    6. 6.6  WLAN Performance: 2.4GHz Transmitter Power
    7. 6.7  BLE Performance: Receiver Characteristics
    8. 6.8  BLE Performance: Transmitter Characteristics
    9. 6.9  Current Consumption: WLAN Static Modes
    10. 6.10 Current Consumption: 2.4GHz WLAN Use Cases
    11. 6.11 Current Consumption: BLE Static Modes
    12. 6.12 Current Consumption: BLE Use Cases
    13. 6.13 Current Consumption: Device Modes
    14. 6.14 Timing and Switching Characteristics
      1. 6.14.1 Power Supply Sequencing
      2. 6.14.2 Clocking Specifications
        1. 6.14.2.1 Slow Clock Generated Internally
        2. 6.14.2.2 Slow Clock Using an External Oscillator
    15. 6.15 Interface Timing Characteristics
      1. 6.15.1 SDIO Timing Specifications
        1. 6.15.1.1 SDIO Timing Diagram: Default Speed
        2. 6.15.1.2 SDIO Timing Diagram: High Speed
      2. 6.15.2 SPI Timing Specifications
        1. 6.15.2.1 SPI Timing Diagram
        2. 6.15.2.2 SPI Timing Parameters
      3. 6.15.3 UART 4-Wire Interface
        1. 6.15.3.1 UART Timing Parameters
  8. 7 Device Certification
    1. 7.1 FCC Certification and Statement
    2. 7.2 IC/ISED Certification and Statement
    3. 7.3 ETSI/CE
    4. 7.4 MIC Certification
    5. 7.5 Manual Information to the End User
    6. 7.6 Module Markings
      1. 7.6.1 Test Grades
  9. 8 Application Information
    1. 8.1 Typical Application—CC330xMOD Reference Design
    2. 8.2 Design Recommendations
      1. 8.2.1 General Layout Recommendations
      2. 8.2.2 CC330xMOD RF Layout Recommendations
      3. 8.2.3 Thermal Board Recommendations
  10. 9 Device and Documentation Support
    1. 9.1 Third-Party Products Disclaimer
    2. 9.2 Device Nomenclature Boilerplate
    3. 9.3 Tools and Software
    4. 9.4 Documentation Support
    5. 9.5 Support Resources
    6. 9.6 Trademarks
    7. 9.7 Electrostatic Discharge Caution
    8. 9.8 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
  • MOZ|65
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.2 Design Recommendations

This section describes the layout recommendations for the CC330xMOD module, RF trace, and antenna.

Table 8-1 summarizes the layout recommendations.

Table 8-1 Layout Recommendations Summary
ITEM DESCRIPTION
Thermal
1 The proximity of ground vias must be close to the pad.
2 Signal traces must not be run underneath the module on the layer where the module is mounted.
3 Have a complete ground pour in layer 2 for thermal dissipation.
4 Have a solid ground plane and ground vias under the module for a stable system and thermal dissipation.
5 Increase the ground pour in the first layer and have all of the traces from the first layer on the inner layers, if possible.
6 Signal traces can be run on a third layer under the solid ground layer, which is below the module mounting layer.
RF Trace and Antenna Routing
7 The RF trace antenna feed must be as short as possible beyond the ground reference. At this point, the trace starts to radiate.
8 The RF trace bends must be gradual, with an approximate maximum bend of 45° with trace mitered. RF traces must not have sharp corners.
9 RF traces must have via stitching on the ground plane beside the RF trace on both sides.
10 RF traces must have constant impedance (microstrip transmission line).
11 For best results, the RF trace ground layer should be the ground layer immediately below the RF trace. The ground layer should be solid.
12 There must be no traces or ground under the antenna section.
13 RF traces must be as short as possible. The antenna, RF traces, and modules must be on the edge of the PCB product. The proximity of the antenna to the enclosure and the enclosure material must also be considered.