SCHS047L august   1998  – september 2023 CD4051B , CD4052B , CD4053B

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Revision History
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 AC Performance Characteristics
    7. 6.7 Typical Characteristics
  8. Parameter Measurement Information
  9. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagrams
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
  10. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Features

  • Wide range of digital and analog signal levels:
    • Digital: 3 V to 20 V
    • Analog: ≤ 20 VP-P
  • Low ON resistance, 125 Ω (typical) over 15 VP-P signal input range for VDD – VEE = 18 V
  • High OFF resistance, channel leakage of
    ±100 pA (typical) at VDD – VEE = 18 V
  • Logic-level conversion for digital addressing signals of 3 V to 20 V (VDD – VSS = 3 V to 20 V) to switch analog signals to 20 VP-P (VDD – VEE = 20 V) matched switch characteristics, rON = 5 Ω (typical) for VDD – VEE = 15 V very low quiescent power dissipation under all digital-control input and supply conditions, 0.2 µW (typical) at
    VDD – VSS = VDD – VEE = 10 V
  • Binary address decoding on chip
  • 5 V, 10 V, and 15 V parametric ratings
  • 100% tested for quiescent current at 20 V
  • Maximum input current of 1 µA at 18 V over full package temperature range, 100 nA at 18 V and 25°C
  • Break-before-make switching eliminates channel overlap