SCHS051H November 1998 – February 2020 CD4066B
PRODUCTION DATA.
Refer to the PDF data sheet for device specific package drawings
THERMAL METRIC(1) | CD4066B | UNIT | |||||
---|---|---|---|---|---|---|---|
N
(PDIP) |
D
(SOIC) |
NS
(SO) |
PW
(TSSOP) |
||||
14 PINS | 14 PINS | 14 PINS | 14 PINS | ||||
RθJA | Junction-to-ambient thermal resistance | 53.7 | 89.5 | 88.2 | 119.5 | °C/W | |
RθJC(top) | Junction-to-case (top) thermal resistance | 41.0 | 49.7 | 46.1 | 48.2 | °C/W | |
RθJB | Junction-to-board thermal resistance | 33.6 | 43.8 | 47.0 | 61.2 | °C/W | |
ψJT | Junction-to-top characterization parameter | 25.8 | 17.4 | 16.3 | 5.5 | °C/W | |
ψJB | Junction-to-board characterization parameter | 33.5 | 43.5 | 46.6 | 60.6 | °C/W |