SNAS843C December   2024  – July 2025 CDC6C

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Environmental Compliance
    4. 6.4 Recommended Operating Conditions
    5. 6.5 Thermal Information
    6. 6.6 Electrical Characteristics
    7. 6.7 Timing Diagrams
    8. 6.8 Typical Characteristics
  8. 7 Parameter Measurement Information
    1. 7.1 Device Output Configurations
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Bulk Acoustic Wave (BAW)
      2. 8.3.2 Device Block-Level Description
      3. 8.3.3 Function Pin
      4. 8.3.4 Clock Output Interfacing and Termination
      5. 8.3.5 Temperature Stability
      6. 8.3.6 Mechanical Robustness
    4. 8.4 Device Functional Modes
  10. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Driving Multiple Loads With a Single CDC6Cx
      2. 9.1.2 CDC6Cx CISPR25 Radiated Emission Performance
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
        1. 9.4.1.1 Providing Thermal Reliability
        2. 9.4.1.2 Recommended Solder Reflow Profile
      2. 9.4.2 Layout Examples
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Tape and Reel Information
    2. 12.2 Orderable Part Number Decoder

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DLX|4
  • DLF|4
  • DLE|4
  • DLY|4
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.3.6 Mechanical Robustness

For reference oscillators, vibration and shock are common causes for increased phase noise and jitter, frequency shift and spikes, or even physical damages to the resonator and package. Compared to quartz crystals, the BAW resonator is more immune to vibration and shock due to the orders of magnitude smaller mass and higher frequency—that is force applied to the device from acceleration is much smaller due to smaller mass.

Figure 8-3 shows the CDC6Cx BAW oscillator vibration performance. TI followed MIL-STD-883 Method 2026 Conditions C (10g) and Method 2007 Condition A (20g) for testing. In this test, the CDC6Cx oscillator is mounted on an EVM and subjected to a 10g acceleration force, ranging from 50Hz to 2kHz in the x, y, and z-axis. Phase noise trace with spur due to vibration is captured using Keysight E5052B and frequency deviation is calculated from the spur power. Then the frequency deviation is converted to ppb by noting the carrier frequency and normalized to ppb/g. Finally, the RMS sum of ppb/g along all three axes is reported as the Vibration sensitivity in ppb/g. CDC6Cx performance under vibration is approximately 2ppb/g while most quartz oscillators best case is 3ppb/g and worse can be above 10ppb/g.

CDC6C Vibration Resilience vs. Vibration Frequency at 25MHz, 25°C, Supply 1.8V - X-AxisFigure 8-3 Vibration Resilience vs. Vibration Frequency at 25MHz, 25°C, Supply 1.8V - X-Axis
CDC6C Vibration Resilience vs. Vibration Frequency at 25MHz, 25°C, Supply 1.8V - Z-AxisFigure 8-5 Vibration Resilience vs. Vibration Frequency at 25MHz, 25°C, Supply 1.8V - Z-Axis
CDC6C Vibration Resilience vs. Vibration Frequency at 25MHz, 25°C, Supply 1.8V - Y-AxisFigure 8-4 Vibration Resilience vs. Vibration Frequency at 25MHz, 25°C, Supply 1.8V - Y-Axis

For the mechanical shock test, TI followed MIL-STD-883F Method 2002 Condition A (1500g) for testing. For more information on BAW technology mechanical robustness, see the Standalone BAW Oscillators Advantages Over Quartz Oscillators application note.

CDC6C Pre and Post 1500g Mechanical Shock at 25MHz and 25°C, X-Axis
 
Figure 8-6 Pre and Post 1500g Mechanical Shock at 25MHz and 25°C, X-Axis
CDC6C Pre and Post 1500g Mechanical Shock at 25MHz and 25°C, Y-Axis
 
Figure 8-8 Pre and Post 1500g Mechanical Shock at 25MHz and 25°C, Y-Axis
CDC6C Pre and Post 1500g Mechanical Shock at 25MHz and 25°C, Z-Axis
 
Figure 8-10 Pre and Post 1500g Mechanical Shock at 25MHz and 25°C, Z-Axis
CDC6C During 1500g Mechanical Shock at 25MHz and 25°C, X-Axis
 
Figure 8-7 During 1500g Mechanical Shock at 25MHz and 25°C, X-Axis
CDC6C During 1500g Mechanical Shock at 25MHz and 25°C, Y-Axis
 
Figure 8-9 During 1500g Mechanical Shock at 25MHz and 25°C, Y-Axis
CDC6C During 1500g Mechanical Shock at 25MHz and 25°C, Z-Axis
 
Figure 8-11 During 1500g Mechanical Shock at 25MHz and 25°C, Z-Axis