SLPS598C May 2017 – January 2018 CSD88584Q5DC
Refer to the PDF data sheet for device specific package drawings
The SOA curve in Figure 3 provide guidance on the temperature boundaries within an operating system by incorporating the thermal resistance and system power loss. This curve outlines the board and case temperatures required for a given load current. The area under the curve dictates the safe operating area. This curve is based on measurements made on a PCB design with dimensions of 4 in (W) × 3.5 in (L) × 0.062 in (H) and 6 copper layers of 2-oz copper thickness.