SBAS649B June   2021  – June 2022 DAC12DL3200

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics - DC Specifications
    6. 6.6  Electrical Characteristics - Power Consumption
    7. 6.7  Electrical Characteristics - AC Specifications
    8. 6.8  Timing Requirements
    9. 6.9  Switching Characteristics
    10. 6.10 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 DAC Output Modes
        1. 7.3.1.1 NRZ Mode
        2. 7.3.1.2 RTZ Mode
        3. 7.3.1.3 RF Mode
        4. 7.3.1.4 2xRF Mode
      2. 7.3.2 DAC Output Interface
        1. 7.3.2.1 DAC Output Structure
        2. 7.3.2.2 Full-scale Current Adjustment
        3. 7.3.2.3 Example Analog Output Interfaces
      3. 7.3.3 LVDS Interface
        1. 7.3.3.1 MODE0: Two LVDS banks per channel
        2. 7.3.3.2 MODE1: One LVDS bank per channel
        3. 7.3.3.3 MODE2: Four LVDS banks, single channel mode
        4. 7.3.3.4 LVDS Interface Input Strobe
        5. 7.3.3.5 FIFO Operation
          1. 7.3.3.5.1 Using FIFO Delay Readback Values
          2. 7.3.3.5.2 FIFO Delay Handling
          3. 7.3.3.5.3 FIFO Delay and NCO Operation
          4. 7.3.3.5.4 FIFO Over/Under Flow Alarming
      4. 7.3.4 Multi-Device Synchronization (SYSREF+/-)
        1. 7.3.4.1 DACCLK Domain Synchronization
        2. 7.3.4.2 SYSREF Position Detector and Sampling Position Selection (SYSREF Windowing)
      5. 7.3.5 Alarms
    4. 7.4 Device Functional Modes
      1. 7.4.1 Direct Digital Synthesis (DDS) Mode
        1. 7.4.1.1 NCO Gain Scaling
        2. 7.4.1.2 NCO Phase Continuous Operation
        3. 7.4.1.3 Trigger Clock
    5. 7.5 Programming
      1. 7.5.1 Using the Serial Interface
        1. 7.5.1.1 SCS
        2. 7.5.1.2 SCLK
        3. 7.5.1.3 SDI
        4. 7.5.1.4 SDO
        5. 7.5.1.5 Serial Interface Operation
        6. 7.5.1.6 Streaming Mode
      2. 7.5.2 SPI Register Map
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Startup Procedure with LVDS Input
      2. 8.1.2 Startup Procedure With NCO Operation
      3. 8.1.3 Interface Test Pattern and Timing Verification
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
      1. 8.3.1 Power Up and Down Sequence
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  9. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  10. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
Supply voltage range VDDA18A, VDDA18B(1) 1.71 1.8 1.89 V
VEEAM18, VEEBM18(1) -1.89 -1.8 -1.71 V
VDDA(1) 0.95 1 1.05 V
VDDCLK18, VDDSYS18(2) 1.71 1.8 1.89 V
VDDHAF, VDDL2B, VDDL2A, VDDCLK10(2) 0.95 1 1.05 V
VDDIO18(3) 1.71 1.8 1.89 V
VQPS(3) 0 0 1.89 V
VDDDIG, VDDEB, VDDEA(3) 0.95 1 1.05 V
VCMI Input common mode voltage DA[11:0]+, DA[11:0]–, DACLK+, DACLK–, DASTR+, DASTR–, DB[11:0]+, DB[11:0]–, DBCLK+, DBCLK–, DBSTR+, DBSTR–, DC[11:0]+, DC[11:0]–, DCCLK+, DCCLK–, DCSTR+, DCSTR–, DD[11:0]+, DD[11:0]–, DDCLK+, DDCLK–, DDSTR+, DDSTR–(3) 1.0 1.2 1.5 V
CLK+, CLK–(2)(4) 0.5
SYSREF+, SYSREF–(2) (4) (6) 0.3 0.5 0.7
VID Input differential peak-to-peak voltage DA[11:0]+ to DA[11:0]–, DACLK+ to DACLK–, DASTR+ to DASTR–, DB[11:0]+ to DB[11:0]–, DBCLK+ to DBCLK–, DBSTR+ to DBSTR–, DC[11:0]+ to DC[11:0]–, DCCLK+ to DCCLK–, DCSTR+ to DCSTR–, DD[11:0]+ to DD[11:0]–, DDCLK+ to DDCLK–, DDSTR+ to DDSTR– 350 700 1000 mVPP-DIFF
CLK+ to CLK– 800 1000 2000
SYSREF+ to SYSREF–, AC coupled with self bias 200 1000 2000
SYSREF+ to SYSREF–, DC coupled with Vcm between 0.3 and 0.7V, 125ps rise/fall time 200 1000 1000
TDCLKH Data Clock input pulse high time DACLK±, DBCLK±, DCCLK±, DDCLK± 540 ps
TDCLKL Data Clock input pulse low time DACLK±, DBCLK±, DCCLK±, DDCLK± 540 ps
DC CLK+/– duty cycle 45 50 55 %
TA Operating free-air temperature -40 85 °C
TJ Recommended operating junction temperature 105(5) °C
TJ-MAX Maximum rated operating junction temperature 125 °C
(1) Measured to AGND.
(2) Measured to VSSCLK.
(3) Measured to DGND.
(4) CLK+/- and SYSREF+/- are weakly self-biased to the optimal common mode voltage. CLK+/- should always be AC coupled to the clock source. SYSREF+/- is recommended to be AC coupled to the clock source when possible.
(5) Prolonged use above this junction temperature may increase the device failure-in-time (FIT) rate.
(6) Max VID for the larger Vcm range can be as large as 2VPP-DIFF without any reliability concerns.  However, it may degrade the accuracy of the SYSREF windowing by 1 bit.