SBAS649B June   2021  – June 2022 DAC12DL3200

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics - DC Specifications
    6. 6.6  Electrical Characteristics - Power Consumption
    7. 6.7  Electrical Characteristics - AC Specifications
    8. 6.8  Timing Requirements
    9. 6.9  Switching Characteristics
    10. 6.10 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 DAC Output Modes
        1. 7.3.1.1 NRZ Mode
        2. 7.3.1.2 RTZ Mode
        3. 7.3.1.3 RF Mode
        4. 7.3.1.4 2xRF Mode
      2. 7.3.2 DAC Output Interface
        1. 7.3.2.1 DAC Output Structure
        2. 7.3.2.2 Full-scale Current Adjustment
        3. 7.3.2.3 Example Analog Output Interfaces
      3. 7.3.3 LVDS Interface
        1. 7.3.3.1 MODE0: Two LVDS banks per channel
        2. 7.3.3.2 MODE1: One LVDS bank per channel
        3. 7.3.3.3 MODE2: Four LVDS banks, single channel mode
        4. 7.3.3.4 LVDS Interface Input Strobe
        5. 7.3.3.5 FIFO Operation
          1. 7.3.3.5.1 Using FIFO Delay Readback Values
          2. 7.3.3.5.2 FIFO Delay Handling
          3. 7.3.3.5.3 FIFO Delay and NCO Operation
          4. 7.3.3.5.4 FIFO Over/Under Flow Alarming
      4. 7.3.4 Multi-Device Synchronization (SYSREF+/-)
        1. 7.3.4.1 DACCLK Domain Synchronization
        2. 7.3.4.2 SYSREF Position Detector and Sampling Position Selection (SYSREF Windowing)
      5. 7.3.5 Alarms
    4. 7.4 Device Functional Modes
      1. 7.4.1 Direct Digital Synthesis (DDS) Mode
        1. 7.4.1.1 NCO Gain Scaling
        2. 7.4.1.2 NCO Phase Continuous Operation
        3. 7.4.1.3 Trigger Clock
    5. 7.5 Programming
      1. 7.5.1 Using the Serial Interface
        1. 7.5.1.1 SCS
        2. 7.5.1.2 SCLK
        3. 7.5.1.3 SDI
        4. 7.5.1.4 SDO
        5. 7.5.1.5 Serial Interface Operation
        6. 7.5.1.6 Streaming Mode
      2. 7.5.2 SPI Register Map
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Startup Procedure with LVDS Input
      2. 8.1.2 Startup Procedure With NCO Operation
      3. 8.1.3 Interface Test Pattern and Timing Verification
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
      1. 8.3.1 Power Up and Down Sequence
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  9. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  10. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.9 Switching Characteristics

Typical values at TA = +25°C, minimum and maximum values over operating free-air temperature range, typical supply voltages, single channel (MODE2) at 6.4 GSPS, single tone amplitude = 0 dBFS, unless otherwise noted.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
LATENCY
TDAC DAC sampling period 1 / fCLK s
tLAT digital input to DAC output sample latency single clock mode, 4 LVDS banks for 1 DAC 35.5 TDAC
single clock mode, 2 LVDS banks per DAC 20.5
single clock mode, 1 LVDS bank per DAC 12.5
dual clock mode, 2 LVDS banks per DAC 35.5
dual clock mode, 1 LVDS bank per DAC 20.5
tPDI Input clock rising edge cross-over to output sample cross-over 680 ps
SERIAL PROGRAMMING INTERFACE
Fs_c_r serial clock frequency reading 100 MHz
Fs_c_w serial clock frequency writing 200 MHz
Fs_cts serial clock frequency temp sensor 1 MHz
tP_W serial clock period for writing 5 ns
tP_R serial clock period for reading 10 ns
tPH serial clock pulse width high 2 ns
tPL serial clock pulse width low 2 ns
tSU SDI setup 1 ns
tH SDI hold 1 ns
tIZ SDI TRI-STATE 1 ns
tODZ SDO driven to TRI-STATE 200 fF load 0 1.5 ns
tOZD SDO TRI-STATE to driven 200 fF load 0 1.5 ns
tOD SDO output delay 200 fF load 0 6 ns
tCSS SCS setup 1 ns
tCSH SCS hold 1 ns
tIAG Inter-access gap 1 ns