SLASE16B January   2014  – May 2014 DAC37J82 , DAC38J82

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  Handling Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  DC Electrical Characteristics
    6. 6.6  Digital Electrical Characteristics
    7. 6.7  AC Electrical Characteristics
    8. 6.8  Timing Requirements
    9. 6.9  Switching Characteristics
    10. 6.10 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Serdes Input
      2. 7.3.2  Serdes Rate
      3. 7.3.3  Serdes PLL
      4. 7.3.4  Serdes Equalizer
      5. 7.3.5  JESD204B Descrambler
      6. 7.3.6  JESD204B Frame Assembly
      7. 7.3.7  Serial Peripheral Interface (SPI)
      8. 7.3.8  Multi-Device Synchronization
      9. 7.3.9  Input Multiplexer
      10. 7.3.10 FIR Filters
      11. 7.3.11 Full Complex Mixer
      12. 7.3.12 Coarse Mixer
      13. 7.3.13 Dithering
      14. 7.3.14 Complex Summation
      15. 7.3.15 Quadrature Modulation Correction (QMC)
        1. 7.3.15.1 Gain and Phase Correction
        2. 7.3.15.2 Offset Correction
      16. 7.3.16 Group Delay Correction Block
        1. 7.3.16.1 Fine Fractional Delay FIR Filter
        2. 7.3.16.2 Coarse Fractional Delay FIR Filter
      17. 7.3.17 Output Multiplexer
      18. 7.3.18 Power Measurement And Power Amplifier Protection
      19. 7.3.19 Serdes Test Modes
      20. 7.3.20 Error Counter
      21. 7.3.21 Eye Scan
      22. 7.3.22 JESD204B Pattern Test
      23. 7.3.23 Temperature Sensor
      24. 7.3.24 Alarm Monitoring
      25. 7.3.25 LVPECL Inputs
      26. 7.3.26 CMOS Digital Inputs
      27. 7.3.27 Reference Operation
      28. 7.3.28 Analog Outputs
      29. 7.3.29 DAC Transfer Function
    4. 7.4 Device Functional Modes
      1. 7.4.1 Clocking Modes
        1. 7.4.1.1 PLL Bypass Mode
        2. 7.4.1.2 PLL Mode
      2. 7.4.2 PRBS Test Mode
    5. 7.5 Register Map
      1. 7.5.1 Register Descriptions
  8. Applications and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Low-IF Wideband LTE Transmitter
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Data Input Rate
          2. 8.2.1.2.2 Intermediate Frequency
          3. 8.2.1.2.3 Interpolation
          4. 8.2.1.2.4 DAC PLL Setup
          5. 8.2.1.2.5 Serdes Lanes
        3. 8.2.1.3 Application Performance Plots
      2. 8.2.2 Zero-IF Wideband Transmitter
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
          1. 8.2.2.2.1 Data Input Rate
          2. 8.2.2.2.2 Interpolation
          3. 8.2.2.2.3 Serdes Lanes
          4. 8.2.2.2.4 LO Feedthrough and Sideband Correction
        3. 8.2.2.3 Application Performance Plots
    3. 8.3 Initialization Set Up
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
  11. 11Device and Documentation Support
    1. 11.1 Related Links
    2. 11.2 Trademarks
    3. 11.3 Electrostatic Discharge Caution
    4. 11.4 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • Resolution: 16-Bit
  • Maximum Sample Rate:
    • DAC37J82: 1.6 GSPS
    • DAC38J82: 2.5 GSPS
  • Maximum Input Data Rate: 1.23GSPS
  • JESD204B Interface
    • 8 JESD204B Serial Input Lanes
    • 12.5 Gbps Maximum Bit Rate per Lane
    • Subclass 1 Multi-DAC synchronization
  • On-Chip Very Low Jitter PLL
  • Selectable 1x -16x Interpolation
  • Independent Complex Mixers with 48-bit NCO/ or ±n×Fs/8
  • Wideband Digital Quadrature Modulator Correction
  • Sinx/x Correction Filters
  • Fractional Sample Group Delay Correction
  • Flexible Routing to Four Analog Outputs via Output Multiplexer
  • 3/4-Wire Serial Control Bus (SPI)
  • Integrated Temperature Sensor
  • JTAG Boundary Scan
  • Pin-compatible with Quad-channel DAC37J84/DAC38J84
  • Power Dissipation: 1.1W at 2.5GSPS
  • Package: 10x10mm, 144-Ball Flip-Chip BGA

2 Applications

  • Cellular Base Stations
  • Diversity Transmit
  • Wideband Communications
  • Direct Digital Synthesis (DDS) Instruments
  • Millimeter/Microwave Backhaul
  • Automated Test Equipment
  • Cable Infrastructure
  • Radar

3 Description

The pin-compatible DAC37J82/DAC38J82 family is a very low power, 16-bit, dual-channel, 1.6/2.5 GSPS digital to analog converter (DAC) with JESD204B interface. The maximum input data rate is 1.23 GSPS.

Digital data is input to the device through 1, 2, 4 or 8 configurable serial JESD204B lanes running up to 12.5 Gbps with on-chip termination and programmable equalization. The interface allows JESD204B Subclass 1 SYSREF based deterministic latency and full synchronization of multiple devices.

The device includes features that simplify the design of complex transmit architectures. Fully bypassable 2x to 16x digital interpolation filters with over 90 dB of stop-band attenuation simplify the data interface and reconstruction filters. An on-chip 48-bit Numerically Controlled Oscillator (NCO) and independent complex mixers allow flexible and accurate carrier placement.

A high-performance low jitter PLL simplifies clocking of the device without significant impact on the dynamic range. The digital Quadrature Modulator Correction (QMC) and Group Delay Correction (QDC) enable complete IQ compensation for gain, offset, phase, and group delay between channels in direct up-conversion applications. A programmable Power Amplifier (PA) protection mechanism is available to provide PA protection in cases when the abnormal power behavior of the input data is detected.

DAC37J82/DAC38J82 family provides four analog outputs, and the data from the internal two digital paths can be routed to any two out of these four DAC outputs via the output multiplexer.

Device Information(1)

PART NUMBER PACKAGE BODY SIZE (NOM)
DAC37J82 FCBGA (144) 10.00 mm x 10.00 mm
DAC38J82 FCBGA (144) 10.00 mm x 10.00 mm
  1. For all available packages, see the orderable addendum at the end of the datasheet.
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4 Revision History

Changes from A Revision (January 2014) to B Revision

  • Changed status from Product Preview to Production DataGo

Changes from * Revision (January 2014) to A Revision

  • Changed Pin ConfigurationGo