SLASF08 December   2021 DAC43508 , DAC53508

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configurations and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics
    6. 7.6  Timing Requirements: SPI
    7. 7.7  Timing Requirements: Logic
    8. 7.8  Timing Diagrams
    9. 7.9  Typical Characteristics: Static Performance
    10. 7.10 Typical Characteristics: Dynamic Performance
    11. 7.11 Typical Characteristics: General
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Digital-to-Analog Converter (DAC) Architecture
        1. 8.3.1.1 DAC Transfer Function
        2. 8.3.1.2 DAC Register Update and LDAC Functionality
        3. 8.3.1.3 CLR Functionality
        4. 8.3.1.4 Output Amplifier
      2. 8.3.2 Reference
      3. 8.3.3 Power-On Reset (POR)
      4. 8.3.4 Software Reset
    4. 8.4 Device Functional Modes
      1. 8.4.1 Power-Down Mode
    5. 8.5 Programming
      1. 8.5.1 Serial Peripheral Interface (SPI)
    6. 8.6 Register Map
      1. 8.6.1 DEVICE_CONFIG Register (address = 01h) [reset = 00FFh]
      2. 8.6.2 STATUS_TRIGGER Register (address = 02h) [reset = 0000h]
      3. 8.6.3 BRDCAST Register (address = 03h) [reset = 0000h]
      4. 8.6.4 DACn_DATA Register (address = 08h to 0Fh) [reset = 0000h]
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Programmable LED Biasing
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curve
      2. 9.2.2 Programmable Window Comparator
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
        3. 9.2.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.6 Timing Requirements: SPI

All inputs signals are specified with tR = tF = 1 V/ns (10% to 90% of VDD) and timed from a voltage level of VDD/2,
1.8 V ≤ VDD ≤ 5.5 V and –40°C ≤ TA ≤ +125°C
MIN NOM MAX UNIT
f(SCLK) Serial clock frequency, 1.7 V ≤ VDD < 2.7 V 25 MHz
Serial clock frequency, 2.7 V ≤ VDD ≤ 5.5 V 50
tSCLKHIGH SCLK high time, 1.7 V ≤ VDD < 2.7 V 20 ns
SCLK high time, 2.7 V ≤ VDD ≤ 5.5 V 10
tSCLKLOW SCLK low time, 1.7 V ≤ VDD < 2.7 V 20 ns
SCLK low time, 2.7 V ≤ VDD ≤ 5.5 V 10
tSDIS SDI setup time, 1.7 V ≤ VDD < 2.7 V 16 ns
SDI setup time, 2.7 V ≤ VDD ≤ 5.5 V 8
tSDIH SDI hold time, 1.7 V ≤ VDD < 2.7 V 10 ns
SDI hold time, 2.7 V ≤ VDD ≤ 5.5 V 5
tCSS SYNC to SCLK falling edge setup time, 1.7 V ≤ VDD < 2.7 V 36 ns
SYNC to SCLK falling edge setup time, 2.7 V ≤ VDD ≤ 5.5 V 18
tCSH SCLK falling edge to SYNC rising edge, 1.7 V ≤ VDD < 2.7 V 10 ns
SCLK falling edge to SYNC rising edge, 2.7 V ≤ VDD ≤ 5.5 V 5
tCSHIGH SYNC high time, 1.7 V ≤ VDD < 2.7 V 50 ns
SYNC high time, 2.7 V ≤ VDD ≤ 5.5 V 25