SBAS871C August   2017  – January 2019 DAC60504 , DAC70504 , DAC80504

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
    1.     Device Images
      1.      Simplified Block Diagram
  4. Revision History
  5. Device Comparison Table
  6. Pin Configuration and Functions
    1.     Pin Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Digital-to-Analog Converter (DAC)
        1. 8.3.1.1 DAC Transfer Function
        2. 8.3.1.2 Output Amplifiers
        3. 8.3.1.3 DAC Register Structure
          1. 8.3.1.3.1 DAC Register Synchronous and Asynchronous Updates
          2. 8.3.1.3.2 Broadcast DAC Register
      2. 8.3.2 Internal Reference
        1. 8.3.2.1 Reference Divider
        2. 8.3.2.2 Solder Heat Reflow
      3. 8.3.3 Device Reset Options
        1. 8.3.3.1 Power-on-Reset (POR)
        2. 8.3.3.2 Software Reset
    4. 8.4 Device Functional Modes
      1. 8.4.1 Stand-Alone Operation
      2. 8.4.2 Daisy-Chain Operation
      3. 8.4.3 Frame Error Checking
      4. 8.4.4 Power-Down Mode
    5. 8.5 Programming
    6. 8.6 Register Map
      1. 8.6.1 NOP Register (address = 0x00) [reset = 0x0000]
        1. Table 9. NOP Register Field Descriptions
      2. 8.6.2 DEVICE ID Register (address = 0x01) [reset = 0x---]
        1. Table 10. DEVICE ID Field Descriptions
      3. 8.6.3 SYNC Register (address = 0x2) [reset = 0xFF00]
        1. Table 11. SYNC Register Field Descriptions
      4. 8.6.4 CONFIG Register (address = 0x3) [reset = 0x0000]
        1. Table 12. CONFIG Register Field Descriptions
      5. 8.6.5 GAIN Register (address = 0x04) [reset = 0x---]
        1. Table 13. GAIN Register Field Descriptions
      6. 8.6.6 TRIGGER Register (address = 0x05) [reset = 0x0000]
        1. Table 14. TRIGGER Register Field Descriptions
      7. 8.6.7 BRDCAST Register (address = 0x6) [reset = 0x0000]
        1. Table 15. BRDCAST Register Field Descriptions
      8. 8.6.8 STATUS Register (address = 0x7) [reset = 0x0000]
        1. Table 16. STATUS Register Field Descriptions
      9. 8.6.9 DACx Register (address = 0x8 to 0xF) [reset = 0x0000 or 0x8000]
        1. Table 17. DACx Register Field Descriptions
  9. Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Interfacing to a Microcontroller
      2. 9.1.2 Programmable Current Source Circuit
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Related Links
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Community Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Power-on-Reset (POR)

The DACx0504 includes a power-on reset function that controls the output voltage at power up. After the VDD and VIO supplies have been established a POR event is issued. The POR causes all registers to initialize to their default values and communication with the device is valid only after a 250 µs power-on-reset delay. The default value for all DACs is either zero-code or midscale-code as determined by the RSTSEL pin. Each DAC channel remains at the power-up voltage until a valid command is written to it.

The POR circuit requires specific supply levels to discharge the internal capacitors and to reset the device on power up, as indicated in Figure 59 and Figure 60. In order to initiate a POR event, VDD or VIO must be below their corresponding low thresholds for at least 100 µs. If VDD and VIO remain above their specified high threshold a POR event will not occur. When the supplies drop below their high threshold but remain over the lower one (shown as the undefined region), the device may or may not reset under all specified temperature and power-supply conditions.

DAC80504 DAC70504 DAC60504 threshold_VDD_slase73.gifFigure 59. Threshold Levels for VDD POR Circuit
DAC80504 DAC70504 DAC60504 threshold_VIO_slase73.gifFigure 60. Threshold Levels for VIO POR Circuit