SBAS528C June   2013  – January 2018 DAC7760 , DAC8760

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Device Comparison Table
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics
    6. 7.6  Electrical Characteristics: AC
    7. 7.7  Timing Requirements: Write Mode
    8. 7.8  Timing Requirements: Readback Mode
    9. 7.9  Timing Requirements: Daisy-Chain Mode
    10. 7.10 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  DAC Architecture
      2. 8.3.2  Voltage Output Stage
      3. 8.3.3  Current Output Stage
      4. 8.3.4  Internal Reference
      5. 8.3.5  Digital Power Supply
      6. 8.3.6  DAC Clear
      7. 8.3.7  Power-Supply Sequence
      8. 8.3.8  Power-On Reset
      9. 8.3.9  Alarm Detection
      10. 8.3.10 Watchdog Timer
        1. 8.3.10.1 The DACx760 Shares the SPI Bus With Other Devices (Non-DACx760)
      11. 8.3.11 Frame Error Checking
        1. 8.3.11.1 The DACx760 Shares the SPI Bus With Other Devices (Non-DACx760)
      12. 8.3.12 User Calibration
      13. 8.3.13 Programmable Slew Rate
    4. 8.4 Device Functional Modes
      1. 8.4.1 Setting Voltage and Current Output Ranges
      2. 8.4.2 Boost Configuration for IOUT
      3. 8.4.3 Filtering the Current Output (only on the VQFN package)
      4. 8.4.4 HART Interface
        1. 8.4.4.1 For 4-mA to 20-mA Mode
        2. 8.4.4.2 For All Current Output Modes
    5. 8.5 Programming
      1. 8.5.1 Serial Peripheral Interface (SPI)
        1. 8.5.1.1 SPI Shift Register
        2. 8.5.1.2 Write Operation
        3. 8.5.1.3 Read Operation
        4. 8.5.1.4 Stand-Alone Operation
        5. 8.5.1.5 Daisy-Chain Operation
    6. 8.6 Register Maps
      1. 8.6.1 DACx760 Commands and Register Map
        1. 8.6.1.1 DACx760 Register Descriptions
          1. 8.6.1.1.1 Control Register
          2. 8.6.1.1.2 Configuration Register
          3. 8.6.1.1.3 DAC Registers
          4. 8.6.1.1.4 Reset Register
          5. 8.6.1.1.5 Status Register
  9. Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Controlling the VOUT and IOUT Pins
        1. 9.1.1.1 VOUT and IOUT Pins are Independent Outputs, Never Simultaneously Enabled
        2. 9.1.1.2 VOUT and IOUT Pins are Independent Outputs, Simultaneously Enabled
        3. 9.1.1.3 VOUT and IOUT Pins are Tied Together, Never Simultaneously Enabled
      2. 9.1.2 Implementing HART in All Current Output Modes
        1. 9.1.2.1 Using CAP2 Pin on VQFN Package
        2. 9.1.2.2 Using the ISET-R Pin
      3. 9.1.3 Short-Circuit Current Limiting
    2. 9.2 Typical Application
      1. 9.2.1 Voltage and Current Output Driver for Factory Automation and Control, EMC and EMI Protected
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
    3. 11.3 Thermal Considerations
  12. 12Device and Documentation Support
    1. 12.1 Related Links
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resource
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Revision History

Changes from B Revision (June 2016) to C Revision

  • Changed description of Power-Supply Sequence sectionGo
  • Added The DACx760 Shares the SPI Bus With Other Devices section Go
  • Added first sentence to second paragraph and added last paragraph to Frame Error Checking sectionGo
  • Added The DACx760 Shares the SPI Bus With Other Devices sectionGo
  • Added last paragraph to User Calibration section Go
  • Added last paragraph to Programmable Slew Rate section Go

Changes from A Revision (December 2013) to B Revision

  • Added ESD Ratings table, Recommended Operating Conditions table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go

Changes from * Revision (June 2013) to A Revision

  • Changed data sheet from product preview to production dataGo