DLPS214B July   2021  – May 2022 DLP300S

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  Storage Conditions
    3. 6.3  ESD Ratings
    4. 6.4  Recommended Operating Conditions
    5. 6.5  Thermal Information
    6. 6.6  Electrical Characteristics
    7. 6.7  Timing Requirements
    8. 6.8  Switching Characteristics
    9. 6.9  System Mounting Interface Loads
    10. 6.10 Micromirror Array Physical Characteristics
    11. 6.11 Micromirror Array Optical Characteristics
    12. 6.12 Window Characteristics
    13. 6.13 Chipset Component Usage Specification
    14. 6.14 Software Requirements
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Power Interface
      2. 7.3.2 Low-Speed Interface
      3. 7.3.3 High-Speed Interface
      4. 7.3.4 Timing
    4. 7.4 Device Functional Modes
    5. 7.5 Optical Interface and System Image Quality Considerations
      1. 7.5.1 Optical Interface and System Image Quality
        1. 7.5.1.1 Numerical Aperture and Stray Light Control
        2. 7.5.1.2 Pupil Match
        3. 7.5.1.3 Illumination Overfill
    6. 7.6 Micromirror Array Temperature Calculation
    7. 7.7 Micromirror Landed-On/Landed-Off Duty Cycle
      1. 7.7.1 Definition of Micromirror Landed-On and Landed-Off Duty Cycle
      2. 7.7.2 Landed Duty Cycle and Useful Life of the DMD
      3. 7.7.3 Landed Duty Cycle and Operational DMD Temperature
      4. 7.7.4 Estimating the Long-Term Average Landed Duty Cycle of a Product or Application
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
  9. Power Supply Recommendations
    1. 9.1 DMD Power Supply Power-Up Procedure
    2. 9.2 DMD Power Supply Power-Down Procedure
    3. 9.3 Power Supply Sequencing Requirements
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
      2. 11.1.2 Device Nomenclature
      3. 11.1.3 Device Markings
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Related Links
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Electrical Characteristics

Over operating free-air temperature range (unless otherwise noted)(10)
PARAMETERTEST CONDITIONS(2)MINTYPMAXUNIT
CURRENT
IDDSupply current: VDD(3)(5)VDD = 1.95 V60.5mA
VDD = 1.8 V54
IDDISupply current: VDDI(3)(5)VDDI = 1.95 V16.5mA
VDD = 1.8 V11.3
IOFFSETSupply current: VOFFSET(4)(6)VOFFSET = 10.5 V2.2mA
VOFFSET = 10 V1.5
IBIASSupply current: VBIAS(4)(6)VBIAS = 18.5 V0.6mA
VBIAS = 18 V0.3
IRESETSupply current: VRESET(6)VRESET = –14.5 V2.4mA
VRESET = –14 V1.7
POWER(1)
PDDSupply power dissipation: VDD(3)(5)VDD = 1.95 V118mW
VDD = 1.8 V95
PDDISupply power dissipation: VDDI(3)(5)VDDI = 1.95 V32mW
VDD = 1.8 V20
POFFSETSupply power dissipation: VOFFSET(4)(6)VOFFSET = 10.5 V23mW
VOFFSET = 10 V15
PBIASSupply power dissipation: VBIAS(4)(6)VBIAS = 18.5 V11mW
VBIAS = 18 V6
PRESETSupply power dissipation: VRESET(6)VRESET = –14.5 V35mW
VRESET = –14 V24
PTOTALSupply power dissipation: Total160219mW
LPSDR INPUT(7)
VIH(DC)DC input high voltage(9)0.7 × VDDVDD + 0.3V
VIL(DC)DC input low voltage(9)–0.30.3 × VDDV
VIH(AC)AC input high voltage(9)0.8 × VDDVDD + 0.3V
VIL(AC)AC input low voltage(9)–0.30.2 × VDDV
∆VTHysteresis ( VT+ – VT– )Figure 6-120.1 × VDD0.4 × VDDV
IILLow–level input currentVDD = 1.95 V; VI = 0 V–100nA
IIHHigh–level input currentVDD = 1.95 V; VI = 1.95 V100nA
LPSDR OUTPUT(8)
VOHDC output high voltageIOH = –2 mA0.8 × VDDV
VOLDC output low voltageIOL = 2 mA0.2 × VDDV
CAPACITANCE
CINInput capacitance LPSDRƒ = 1 MHz10pF
Input capacitance SubLVDSƒ = 1 MHz10pF
COUTOutput capacitanceƒ = 1 MHz10pF
The following power supplies are all required to operate the DMD: VSS, VDD, VDDI, VOFFSET, VBIAS, VRESET.
All voltage values are with respect to the ground pins (VSS).
To prevent excess current, the supply voltage delta |VDDI – VDD| must be less than specified limit.
To prevent excess current, the supply voltage delta |VBIAS – VOFFSET| must be less than specified limit.
Supply power dissipation based on non–compressed commands and data.
Supply power dissipation based on 3 global resets in 200 µs.
LPSDR specifications are for pins LS_CLK and LS_WDATA.
LPSDR specification is for pin LS_RDATA.
Low-speed interface is LPSDR and adheres to the Electrical Characteristics and AC/DC Operating Conditions table in JEDEC Standard No. 209B, Low-Power Double Data Rate (LPDDR)JESD209B.
Device electrical characteristics are over Section 6.4 unless otherwise noted.