DLPS183C March   2020  – March 2023 DLP3021-Q1

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  Storage Conditions
    3. 6.3  ESD Ratings
    4. 6.4  Recommended Operating Conditions
    5. 6.5  Thermal Information
    6. 6.6  Electrical Characteristics
    7. 6.7  Timing Requirements
    8. 6.8  Switching Characteristics
    9. 6.9  System Mounting Interface Loads
    10. 6.10 Physical Characteristics of the Micromirror Array
    11. 6.11 Micromirror Array Optical Characteristics
    12. 6.12 Window Characteristics
    13. 6.13 Chipset Component Usage Specification
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Micromirror Array
      2. 7.3.2 Double Data Rate (DDR) Interface
      3. 7.3.3 Micromirror Switching Control
      4. 7.3.4 DMD Voltage Supplies
      5. 7.3.5 Logic Reset
      6. 7.3.6 Temperature Sensing Diode
        1. 7.3.6.1 Temperature Sense Diode Theory
      7. 7.3.7 DMD JTAG Interface
    4. 7.4 System Optical Considerations
      1. 7.4.1 Numerical Aperture and Stray Light Control
      2. 7.4.2 Pupil Match
      3. 7.4.3 Illumination Overfill and Alignment
    5. 7.5 DMD Image Performance Specification
    6. 7.6 Micromirror Array Temperature Calculation
    7. 7.7 Micromirror Landed-On/Landed-Off Duty Cycle
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
    3. 8.3 Application Mission Profile Consideration
  9. Power Supply Recommendations
    1. 9.1 Power Supply Sequencing Requirements
      1. 9.1.1 Power Up and Power Down
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Temperature Diode Pins
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Device Nomenclature
      2. 11.1.2 Device Markings
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Device Handling
    8. 11.8 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Typical Application

The DLP3021-Q1 DMD combined with a DLP products controller are the primary devices that make up the reference design for a dynamic ground projection system as shown in the block diagram Figure 8-1.

GUID-C86EE25D-A3F6-4673-916B-D0ED7306AA7F-low.gifFigure 8-1 Dynamic Ground Projection Reference Design Block Diagram

In this architecture, video content is compressed and stored in external flash memory. Low speed SPI commands are sent from a microcontroller or other processor to the DLP products controller to indicate what video content to read from external memory. Storing the video content in memory removes the need for a high speed video interface to the module which improves compatibility with typical vehicle infrastructures. It also decreases overall system size and cost by removing graphics generation and interfaces. The controller decompresses each bit plane of the video data (608 × 684 resolution) and displays them on the DMD in rapid succession to create the full video image. Due to the diamond format of the DMD pixels, the output image has an effective resolution of 864 × 480. The controller synchronizes the DMD bit plane data with the RGB enable timing for the LED color controller and driver circuit.

The controller may connect to a TMP411-Q1 to measure the DLP3021-Q1 temperature using the built-in temperature sensing diode.

The controller combined with the DLP3021-Q1 may be used in RGB LED or laser illumination systems, or in single-color systems as shown in Figure 8-2.

GUID-A2C7FD7B-E8EF-4D31-BF1C-5CE3F7D83212-low.gifFigure 8-2 Dynamic Ground Projection Reference Design Block Diagram - Single Color