DLPS021 September 2019 DLP470TP
PRODUCTION DATA.
The layer stack-up and copper weight for each layer is shown in Table 9. Small sub-planes are allowed on signal routing layers to connect components to major sub-planes on top/bottom layers if necessary.
LAYER NO. | LAYER NAME | COPPER WT. (oz.) | COMMENTS |
---|---|---|---|
1 | Side A - DMD only | 1.5 | DMD, escapes, low frequency signals, power sub-planes |
2 | Ground | 0.5 | Solid ground plane (net GND) |
3 | Signal | 0.5 | 50 Ω and 100 Ω differential signals |
4 | Signal/Power | 0.5 | 50 Ω and 100 Ω differential signals / power |
5 | Ground | 0.5 | Solid ground plane (net GND) |
6 | Signal | 0.5 | 50 Ω and 100 Ω differential signals |
7 | Ground | 0.5 | Solid ground plane (net GND) |
8 | Side B - All other Components | 1.5 | Discrete components, low frequency signals, power sub-planes |