DLPS125 November   2018 DLP4710

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
    1.     Device Images
      1.      DLP DLP4710 0.47 1080p Chipset
  4. Revision History
  5. Pin Configuration and Functions
    1.     Pin Functions – Connector Pins
    2.     Pin Functions – Test Pads
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  Storage Conditions
    3. 6.3  ESD Ratings
    4. 6.4  Recommended Operating Conditions
    5. 6.5  Thermal Information
    6. 6.6  Electrical Characteristics
    7. 6.7  Timing Requirements
    8. 6.8  Switching Characteristics
    9. 6.9  System Mounting Interface Loads
    10. 6.10 Physical Characteristics of the Micromirror Array
    11. 6.11 Micromirror Array Optical Characteristics
    12. 6.12 Window Characteristics
    13. 6.13 Chipset Component Usage Specification
  7. Software Requirements
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Power Interface
      2. 8.3.2 Low-Speed Interface
      3. 8.3.3 High-Speed Interface
      4. 8.3.4 Timing
    4. 8.4 Device Functional Modes
    5. 8.5 Optical Interface and System Image Quality Considerations
      1. 8.5.1 Optical Interface and System Image Quality
        1. 8.5.1.1 Numerical Aperture and Stray Light Control
        2. 8.5.1.2 Pupil Match
        3. 8.5.1.3 Illumination Overfill
    6. 8.6 Micromirror Array Temperature Calculation
    7. 8.7 Micromirror Landed-On/Landed-Off Duty Cycle
      1. 8.7.1 Definition of Micromirror Landed-On/Landed-Off Duty Cycle
      2. 8.7.2 Landed Duty Cycle and Useful Life of the DMD
      3. 8.7.3 Landed Duty Cycle and Operational DMD Temperature
      4. 8.7.4 Estimating the Long-Term Average Landed Duty Cycle of a Product or Application
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
    1. 10.1 Power Supply Power-Up Procedure
    2. 10.2 Power Supply Power-Down Procedure
    3. 10.3 Power Supply Sequencing Requirements
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Device Nomenclature
      2. 12.1.2 Device Markings
    2. 12.2 Related Links
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Features

  • 0.47-Inch (11.93-mm) Diagonal Micromirror Array
    • 1920 × 1080 Array of Aluminum Micrometer-Sized Mirrors, in an Orthogonal Layout
    • Micron Micromirror Pitch: 5.4
    • Micromirror Tilt (Relative to Flat Surface): ±17°
    • Bottom Illumination for Optimal Efficiency and Optical Engine Size
    • Polarization Independent Aluminum Micromirror Surface
  • 32-Bit SubLVDS Input Data Bus
  • Dedicated DLPC3439 or DLP3479 Light and Display Controllers
  • Dedicated DLPA3000 or DLPA3005 PMIC/LED Drivers for Reliable Operation